Patent classifications
H03H9/02015
LATERALLY EXCITED BULK WAVE RESONATOR AND FABRICATING METHOD THEREOF
A laterally excited bulk wave resonator includes a supporting plate; a piezoelectric base having a back side attached to the supporting plate, in which a cavity is defined on a side of the supporting plate facing toward the piezoelectric base; a lower interdigital transducer provided at a back side of the piezoelectric base and located in the cavity; and an upper interdigital transducer provided at a front side of the piezoelectric base corresponding to the lower interdigital transducer. A first interdigital electrode of the lower interdigital transducer has a same polarity as a second interdigital electrode of the upper interdigital transducer at a position corresponding to the first interdigital electrode.
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS WITH COUNTER CHIRPED INTERDIGITAL TRANSDUCERS (IDTs) FOR MECHANICAL AND PROCESS COMPENSATION
An acoustic resonator has a piezoelectric plate having first and second surfaces, the second surface facing a substrate, and a diaphragm of the piezoelectric plate spanning a cavity. A conductor pattern is formed on at least one of the first and second surfaces and has an interdigital transducer (IDT) having interleaved fingers on the diaphragm portion of the piezoelectric plate. At least one of a pitch of the interleaved IDT fingers or a mark of the interleaved IDT fingers varies over an area of the IDT to compensate for process-induced distortion of the diaphragm portion of the piezoelectric plate.
Transversely-excited film bulk acoustic resonator with lateral etch stop
Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a front surface and a cavity, a perimeter of the cavity defined by a lateral etch-stop comprising etch-stop material. A back surface of a single-crystal piezoelectric plate is attached to the front surface of the substrate except for a portion of the piezoelectric plate that forms a diaphragm that spans the cavity. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the diaphragm.
ACOUSTIC WAVE DEVICE
An acoustic wave device includes a piezoelectric layer that is made of lithium niobate or lithium tantalate, and a plurality of pairs of electrodes opposed to each other in a direction intersecting with a thickness direction of the piezoelectric layer, in which a bulk wave in a thickness shear primary mode is used or d/p is about 0.5 or lower when a thickness of the piezoelectric layer is d and a distance between centers of mutually adjacent electrodes among the plurality of pairs of electrodes is p. The plurality of pairs of electrodes include at least one pair of first electrodes of a first acoustic wave resonator and at least one pair of second electrodes of a second acoustic wave resonator. A direction orthogonal to a longitudinal direction of the second electrodes in the second acoustic wave resonator is inclined at an angle that is greater than 0° and smaller than 360° with respect to a direction orthogonal to a longitudinal direction of the first electrodes in the first acoustic wave resonator.
ELECTRONIC COMPONENT
An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.
TRANSVERSELY EXCITED FILM BULK ACOUSTIC RESONATOR WITH RECESSED INTERDIGITAL TRANSDUCER FINGERS
Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having front and back surfaces, the back surface attached to a surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the diaphragm. A depth of the groove is less than a thickness of the at least one finger of the IDT.
Laminated substrate having piezoelectric film, element having piezoelectric film and method for manufacturing this laminated substrate
There is provided a laminated substrate having a piezoelectric film, including: a substrate; and a piezoelectric film provided on the substrate interposing a base film, wherein the piezoelectric film has an alkali niobium oxide based perovskite structure represented by a composition formula of (K.sub.1-xNa.sub.x)NbO.sub.3 (0<x<1) and preferentially oriented in (001) plane direction, and a sound speed of the piezoelectric film is 5100 m/s or more.
Single crystal film bulk acoustic resonator, manufacturing method for single crystal film bulk acoustic resonator, and filter
The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer. During bonding, the area of the top surfaces of the first bumps can be controlled by etched grooves, so the area of the second bonding layer located at the top surfaces of the first bumps can be controlled, thereby realizing the control of a bonding area. By controlling the bonding area, the balance between the bonding requirement and the bonding reliability is realized.
BULK ACOUSTIC WAVE RESONATORS WITH TUNABLE ELECTROMECHANICAL COUPLING
The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator with tunable electromechanical coupling. The disclosed BAW resonator includes a bottom electrode, a top electrode, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. Upon adjusting direct current (DC) bias voltage across the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed. Once the change of the overall electromechanical coupling coefficient of the multilayer transduction structure is completed, the overall electromechanical coupling coefficient of the multilayer transduction structure will remain unchanged after removing the DC bias voltage.
ACOUSTIC WAVE RESONATOR WITH LOW/ZERO-ELECTROMECHANICAL COUPLING AT BORDER REGION
The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator, which includes a bottom electrode, a top electrode structure, and a ferroelectric layer sandwiched in between. Herein, the ferroelectric layer is formed of a ferroelectric material, which has a box-shape polarization-electric field (P-E) curve. The ferroelectric layer includes a ferroelectric border (BO) portion positioned at a periphery of the ferroelectric layer and a ferroelectric central portion surrounded by the ferroelectric BO portion. The ferroelectric BO portion has a first polarization and a first electromechanical coupling coefficient, and the ferroelectric central portion has a second polarization and a second electromechanical coupling coefficient. An absolute value of the first polarization is less than an absolute value of the second polarization, and the first electromechanical coupling coefficient is less than the second electromechanical coupling coefficient. The ferroelectric central portion is configured to provide a resonance of the BAW resonator.