Patent classifications
H03H9/02015
ACOUSTIC WAVE RESONATOR USING MULTILAYER TRANSDUCTION MATERIALS WITH LOW/ZERO COUPLING BORDER REGION
The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator, which includes a bottom electrode, a top electrode structure, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, at least one of which is formed of a ferroelectric material with a box-shape polarization-electric field curve. Each transduction layer includes a transduction border (BO) portion positioned at a periphery of a corresponding transduction layer and a transduction central portion surrounded by the transduction BO portion. A combination of all transduction BO portions forms a transduction BO section of the multilayer transduction structure, and a combination of all transduction central portions forms a transduction central section of the multilayer transduction structure. An electromechanical coupling coefficient of the transduction BO section is less than an electromechanical coupling coefficient of the transduction central section.
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS WITH GAP DIELECTRIC STRIPES IN BUSBAR-ELECTRODE GAPS
An acoustic resonator device includes a substrate having a surface; an 82Y-cut lithium niobate piezoelectric plate attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in an intermediate dielectric layer of the substrate; an interdigital transducer (IDT) at the piezoelectric plate such that interleaved fingers of the IDT are at the diaphragm; and a plurality of stripes of a dielectric material extending over ends of the interleaved fingers and portions of gaps between the ends of the interleaved fingers and opposing busbars of the IDT.
In-plane and out-of-plane disk resonator
A piezoelectric structure is disclosed which includes a single crystal having piezoelectric coefficients d.sub.31 and d.sub.32 of opposite magnitude, such that when an alternating electric field is applied in the Z direction, the piezoelectric structure expands in one of the X and Y directions and contracts in the other of the X and Y direction, a first electrode coupled to the single crystal, and a second electrode coupled to the single crystal, wherein the alternating electric field is input to the single crystal through the first and second electrodes.
Bulk acoustic wave resonator and fabrication method thereof
A bulk acoustic wave (BAW) resonator includes a substrate, a piezoelectric layer disposed above the substrate, a first electrode disposed below the piezoelectric layer, a second electrode disposed above the piezoelectric layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer disposed between the substrate and the piezoelectric layer, and a bonding layer disposed between the third dielectric layer and the substrate. The first dielectric layer is disposed below the piezoelectric layer and includes a cavity. The third dielectric layer is disposed below the first dielectric layer and includes a protruding structure protruding towards the piezoelectric layer. The second dielectric layer overlays the third dielectric layer including the protruding structure, the second dielectric layer and the protruding structure of the third dielectric layer constituting a double-wall boundary structure surrounding the cavity.
Acoustic wave device
An acoustic wave device includes a piezoelectric body made of lithium niobate and disposed directly or indirectly on a supporting substrate, and IDT electrode disposed directly or indirectly on the piezoelectric body. When the wavelength of an acoustic wave that is determined by a pitch of electrode fingers of the IDT electrode is denoted by λ, the thickness of the piezoelectric body is equal to or less than about 1λ. The acoustic wave device uses the plate wave S0 mode propagating in the piezoelectric body. The Euler angles of the lithium niobate are (0°±10°, θ, 90°±10°), provided that θ is from about 0° to about 180° inclusive.
ACOUSTIC RESONATOR IN TRANSVERSE EXCITATION SHEAR MODE
Provided is an acoustic resonator in a transverse excitation shear mode. The acoustic resonator comprises: an acoustic mirror (120), which comprises at least one first acoustic reflecting layer (121, 123, 125) and at least one second acoustic reflecting layer (122, 124), wherein the acoustic impedance of each first acoustic reflecting layer is less than that of each second acoustic reflecting layer; a piezoelectric layer (130), which is arranged on the acoustic mirror, and which comprises lithium niobate of a single crystal material and/or lithium tantalate of a single crystal material; electrode units (142, 143, 144), which are arranged on the piezoelectric layer (130) and are used for forming an electric field; and transverse reflectors (152, 154), which are arranged on the piezoelectric layer, are used for transversely reflecting acoustic waves, and can have a high electromechanical coupling coefficient and a high Q value at a frequency greater than 3 GHz.
BULK ACOUSTIC WAVE RESONATOR AND CAPACITOR WITH SILICON SUPPORT
An acoustic wave device is provided comprising a substrate and at least one resonator structure of a first type and at least one resonator structure of a second type mounted on the substrate. The resonator structures of the first type are configured to operate as capacitors and have a first thickness, causing the resonator structures to have a first passband frequency range. The resonator structures of the second type have a second thickness that is different from the first thickness, causing the resonator structures to have a second passband frequency range. A method for forming such an acoustic wave device is also provided. A die comprising such an acoustic wave device, a filter comprising such an acoustic wave device, a radio-frequency module comprising such an acoustic wave device, and a wireless mobile device comprising such an acoustic wave device are also provided.
BULK ACOUSTIC WAVE (BAW) RESONATOR, PATTERNED LAYER STRUCTURES, DEVICES AND SYSTEMS
Techniques for improving Bulk Acoustic Wave (BAW) reflector and resonator structures are disclosed, including filters, oscillators and systems that may include such devices. A Bulk Acoustic Wave (BAW) resonator of this disclosure may comprise a substrate and an active piezoelectric resonant volume. The active piezoelectric resonant volume of the Bulk Acoustic Wave (BAW) resonator may have a main resonant frequency. The active piezoelectric resonant volume of the Bulk Acoustic Wave (BAW) resonator may comprise first and second piezoelectric layers having respective piezoelectric axis that substantially oppose one another. A first patterned layer may be disposed within the active piezoelectric volume. This may, but need not facilitate suppression of spurious modes. The main resonant frequency of the Bulk Acoustic Wave (BAW) resonator may be in a super high frequency (SHF) band. The main resonant frequency of the Bulk Acoustic Wave (BAW) resonator may be in an extremely high frequency (EHF) band.
Resonator shapes for bulk acoustic wave (BAW) devices
A resonator circuit device. The present invention provides for improved resonator shapes using egg-shaped, partial egg-shaped, and asymmetrical partial egg-shaped resonator structures. These resonator shapes are configured to give less spurious mode/noise below the resonant frequency (F.sub.s) than rectangular, circular, and elliptical resonator shapes. These improved resonator shapes also provide filter layout flexibility, which allows for more compact resonator devices compared to resonator devices using conventionally shaped resonators.
Acoustic resonator device with controlled placement of functionalization material
A micro-electrical-mechanical system (MEMS) resonator device includes at least one functionalization material arranged over at least a central portion, but less than an entirety, of a top side electrode. For an active region exhibiting greatest sensitivity at a center point and reduced sensitivity along its periphery, omitting functionalization material over at least one peripheral portion of a resonator active region prevents analyte binding in regions of lowest sensitivity. The at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of an active area length and extends a maximum width in a range of from about 50% to 100% of an active area width. Methods for fabricating MEMS resonator devices are also provided.