An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.

When a current flowing in a series circuit including an equivalent resistance, an equivalent inductor, and an equivalent capacitance in an electric equivalent circuit of a specific resonator in each filter is defined as an acoustic path current, under conditions that a phase of an acoustic path current of a first transmission filter at a side of a common terminal at a frequency within a first transmission band is represented as θ1.sub.Tx, a phase of an acoustic path current of the first transmission filter at the side of the common terminal at a frequency within a second transmission band is represented as θ2.sub.Tx, a phase of an acoustic path current of a first reception filter at the side of the common terminal at a frequency within the first transmission band is represented as θ1.sub.Rx, and a phase of an acoustic path current of the first reception filter at the side of the common terminal at a frequency within the second transmission band is represented as θ2.sub.Rx, a multiplexer satisfies a first condition: |(2.Math.θ1.sub.Tx−θ2.sub.Tx)−(2.Math.θ1.sub.Rx−θ2.sub.Rx)|=180°±90°, or a second condition: |(2.Math.θ2.sub.Tx−θ1.sub.Tx)−(2.Math.θ2.sub.Rx−θ1.sub.Rx)|=180°±90°.

A high Q acoustic BAW resonator with high coupling and improved spurious mode suppression is given. The BAW resonator comprises an active resonator region (AR) formed by an overlap of the three layers bottom electrode (BE), piezoelectric layer (PL) and top electrode layer (TE). An inner-flap (IF) is formed by a dielectric 3D structure sitting on a marginal region (MR) of the active resonator region (AR) or adjacent thereto, extending inwardly towards the center thereof and having a section that runs in parallel and distant to the top surface of the resonator keeping an inner gap (IG) thereto or an angle Θ.

An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

A BAW resonator comprises a center area (CA), an underlap region (UL) surrounding the center area having a thickness smaller than the thickness d.sub.C of the center region and a frame region (FR), surrounding the underlap region having thickness d.sub.F greater than d.sub.C.

An acoustic device includes a foundation structure and a transducer provided over the foundation structure. The foundation structure includes a piezoelectric layer between a top electrode and a bottom electrode. The piezoelectric layer has an active portion within an active region of the transducer, and a bi-polar border portion within a border region of the transducer. The piezoelectric material in the active portion has a first polarization. The bi-polar border portion has a first sub-portion and a second sub-portion, which resides either above or below the first sub-portion. The piezoelectric material in the first sub-portion has the first polarization, and the piezoelectric material in the second sub-portion has a second polarization, which is opposite the first polarization.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

When a current flowing in a series circuit including an equivalent resistance, an equivalent inductor, and an equivalent capacitance in an electric equivalent circuit of a specific resonator in each filter is defined as an acoustic path current, under conditions that a phase of an acoustic path current of a first transmission filter at a side of a common terminal at a frequency within a first pass band is represented as θ1.sub.Tx1, a phase of an acoustic path current of the first transmission filter at the side of the common terminal at a frequency within a second pass band is represented as θ2.sub.Tx1, a phase of an acoustic path current of a second transmission filter at the side of the common terminal at a frequency within the first pass band is represented as θ1.sub.Tx2, and a phase of an acoustic path current of the second transmission filter at the side of the common terminal at a frequency within the second pass band is represented as θ2.sub.Tx2, a multiplexer satisfies a first condition: |(2.Math.θ1.sub.Tx1−θ2.sub.Tx1)−(2.Math.θ1.sub.Tx2−θ2.sub.Tx2)|=180°±90°, or a second condition: |(2.Math.θ2.sub.Tx1−θ1.sub.Tx1)−(2.Math.θ2.sub.Tx2−θ1.sub.Tx2)|=180°±90°.

Apparatus and associated methods relate to forming an epitaxial layer of aluminum on an aluminum-nitride compound. The aluminum is epitaxially grown on the crystalline aluminum-nitride compound by maintaining temperature of a crystalline aluminum-nitride compound below a cluster-favoring temperature threshold within a vacuum chamber. Then, the crystalline aluminum-nitride compound is exposed to atoms of elemental aluminum for a predetermined time duration. The aluminum is epitaxially grown in this fashion for a predetermined time duration so as to produce a layer of epitaxial aluminum of a predetermined thickness. Such epitaxially-grown mono-crystalline aluminum has a lower resistivity than poly-crystalline aluminum.