Patent classifications
H03H9/02433
MICROMECHANICAL RESONATOR HAVING REDUCED SIZE
A micromechanical resonator is provided that enables a smaller total package size with an acceptable quality factor for timing applications. The MEMS resonator includes a vibration portion with a base and three or more vibrating beams extending therefrom. Moreover, the MEMS resonator includes a frame that surrounds a periphery of the vibration portion and a pair of anchor between the vibrating beams for stabilizing the vibration portion within the frame. Furthermore, support beams couple the base of the vibration portion to the pair of anchors.
Corner coupling resonator array
A MEMS resonator array is provided with improved electrical characteristics and reduced motional impedance at high frequency applications. The MEMS resonator array includes a pair of first piezoelectric resonators that are opposed to each other with a space defined therebetween. Moreover, the MEMS resonator array includes a pair of second piezoelectric resonators that are opposed to each other and that are each coupled to respective corners of each of the first piezoelectric resonators. As such, each of the second piezoelectric resonators is partially disposed in the space defined between the pair of first piezoelectric resonators.
RESONATOR AND RESONATOR ARRAY
The present disclosure provides a resonator which resonates in a bulk acoustic wave mode. The resonator includes a resonator body, at least one transducer arm and a substrate. The resonator body is deformed at least along a first direction. The transducer arm is connected to the resonator body along the first direction and includes a base, a piezoelectric layer and an electrode layer. The base includes a first end connected to the resonator body. The piezoelectric layer is disposed above the base but not extended to the resonator body, and the electrode layer is disposed above the piezoelectric layer but not extended to the resonator body. The substrate is for securing the transducer arm such that the resonator body is suspended.
Bulk acoustic Wave Resonator on a Stress Isolated Platform
In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.
DENSITY-MODULATED PHONONIC MEMBRANES
The invention relates to a mechanical oscillator device comprising an unsupported membrane with a multitude of discrete mass elements distributed to form Phononic crystal cells in the form of regions of additional mass each comprising a plurality of mass elements. The phononic crystal structure has a defect for confining a mechanical oscillation mode having a resonance frequency, f, with the mass elements have a smallest lateral dimension of less than 1/10 of a wavelength of the mechanical oscillation mode. The invention is based on a distribution of tiny additional mass elements providing a periodic density contrast pattern to create the bandgap. This approach keeps the tensile stress uniform which ensures perfect overlap between the tensile stress distribution and mode-shape. This again reduces the damping and thus allows for very high quality factors, Q.
DUAL PROOF-MASS RESONATORS WITH LOW SUPPORT LOSS
Mechanical resonator includes two identical proof-masses, at least one connecting beam connecting the two identical proof-masses adapted to oscillate in a same phase in a direction perpendicular to a direction of a connecting beam, and at least one anchor attached to a middle of the at least one connecting beam. Two identical proof-masses are resonant plates, and the at least anchor is anchored to a substrate. The at least anchor may comprise two anchors attached to a middle of the at least one connecting beam in opposite directions. Also, the at least one connecting beam comprises an outer ring at a middle thereof, and the at least anchor is disposed at a center of the outer ring and is connected to the outer ring via two sub-connecting beams. The outer ring may be in a rectangular ring shape. Alternatively, the outer ring may be in a circular ring shape.
SINGLE ANCHOR RESONATORS
A mechanical resonator includes two identical plates, and a decoupling structure comprising at least two first connectors, each first connector connecting the decoupling structure to a respective one of the two identical plates, and an anchor disposed at a center of the decoupling structure. Each of the two identical plates may be a square plate adapted to resonate in Lam?-mode. Further, each of the two identical plates may comprise a plurality of square plates, each square plate disposed next to one another. The decoupling structure further comprises a first ring connected to each of the two identical plates via a respective one of the at least two first connectors. The decoupling structure may further comprise a second ring connected to an inside of the first ring via at least two second connectors, wherein the anchor is disposed at a center of the second ring.
MICROELECTROMECHANICAL SYSTEM RESONATOR DEVICES AND OSCILLATOR CONTROL CIRCUITS
Reference oscillators are ubiquitous in timing applications generally, and in modern wireless communication devices particularly. Microelectromechanical system (MEMS) resonators are of particular interest due to their small size and potential for integration with other MEMS devices and electrical circuits on the same chip. In order to support their use in high volume low cost applications it would be beneficial for MEMS designers to have MEMS resonator designs and manufacturing processes that whilst employing low cost low resolution semiconductor processing yield improved resonator performance thereby reducing the requirements of the oscillator circuitry. It would be further beneficial for the oscillator circuitry to be able to leverage the improved noise performance of differential TIAs without sacrificing power consumption.
Compensation circuit for acoustic resonators
In one embodiment, filter circuitry includes a series acoustic resonator between first and second nodes. A main series resonance is provided between the first node and the second node at a main resonance frequency through the series acoustic resonator. A compensation circuit includes first and second inductors coupled in series between the first node and the second node, wherein the first inductor and the second inductor are negatively coupled with one another and a common node is provided between the first and second inductors. The compensation circuit also includes first and second shunt acoustic resonators, which are coupled in parallel with one another between the common node and a fixed voltage node. First and second series resonances at first and second resonance frequencies are provided between the first node and the second node through compensation circuit wherein the first and second resonance frequencies are different.
RESONATOR AND RESONATOR DEVICE
A resonator includes a vibrator with a base, and multiple vibrating arms extending therefrom. Moreover, a frame surrounds a periphery of the vibrating part and a holding arm couples the vibrator to the frame. The holding arm includes a pair of first support arms that are connected to the base opposite the vibrating arms and a coupling portion that couples the support arms with one another and that is connected to the frame.