A composite substrate, a surface acoustic wave resonator and their fabricating method are provided. The fabricating method of the composite substrate includes: providing a first substrate; forming a liner layer including at least a polycrystalline material layer on the first substrate; depositing a piezoelectric sensing film for generating acoustic resonance on the polycrystalline material layer by a physical or chemical deposition method; and performing recrystallization annealing treatment on the piezoelectric sensing film, to make the piezoelectric sensing film reach a polycrystalline state. The recrystallization annealing treatment includes a heating process and a cooling process, and the heating process includes heating the piezoelectric sensing film to make the piezoelectric sensing film reach a molten state.

An acoustic wave device includes a substrate, a first resonator, a second resonator, and a shared reflector. The second resonator is adjacent to the first resonator and has different frequency characteristics different than the first resonator. The first resonator includes a first interdigital transducer electrode. The second resonator includes a second interdigital transducer electrode. The shared reflector has frequency characteristics that are the same as both frequency characteristics of the first resonator and frequency characteristics of the second resonator or between the frequency characteristics of the first resonator and the frequency characteristics of the second resonator. a higher-order mode frequency of the first resonator and a higher-order mode frequency of the second resonator coincides. When the number of electrode fingers of the shared reflector is even, an electrode finger facing the shared reflector in the first interdigital transducer electrode and an electrode finger facing the shared reflector in the second interdigital transducer electrode have the same polarity. When the number of electrode fingers of the shared reflector is odd, an electrode finger facing the shared reflector in the first interdigital transducer electrode and an electrode finger facing the shared reflector in the second interdigital transducer electrode have opposite polarities.

An acoustic wave sensor device, comprising an interdigitated transducer; a first reflection structure arranged on one side of the interdigitated transducer, and a second reflection structure arranged on another side of the interdigitated transducer; a first resonance cavity comprising a first upper surface and formed between the interdigitated transducer and the first reflection structure; a second resonance cavity comprising a second upper surface and formed between the interdigitated transducer and the second reflection structure; and wherein the second upper surface comprises a physical and/or chemical modification as compared to the first upper surface.

An acoustic wave device includes an interdigital transducer electrode connected to first and second terminals, and a reflector connected to the second terminal. In a group of electrode fingers of the interdigital transducer electrode, the electrode fingers at one end and another end in a second direction are respectively first and second end electrode fingers, the first end electrode finger includes a wide portion at a distal end portion. The first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An inner busbar portion of one of first and second busbars not connected to the first end electrode finger, is located on an inner side in the second direction relative to the wide portion of the first end electrode finger so as not to overlap the wide portion of the first end electrode finger in a first direction.

A layered structure (100) for transmission of an acoustic wave, the layered structure (100) comprising: a substrate layer (102); and a second layer (104) over the substrate layer (102), wherein the second layer (104) comprises a plurality of discrete portions (105) adjacent to each other, each discrete portion (105) of the plurality of discrete portions (105) comprising a first subregion (104A) and a second subregion (104B). Also an epitaxial layer (108), grown over the second layer (104), for transmission of the acoustic wave in a major plane of the epitaxial layer (108), wherein a periodicity (λ) of a wavelength of the acoustic wave to be transmitted through the epitaxial layer (108) is approximately equal to a sum of a width (d.sub.A) of the first subregion (104A) and a width (d.sub.B) of the second subregion (104B).

An acoustic wave filter includes a substrate and a piezoelectric layer over the substrate. First acoustic wave resonators are disposed over the piezoelectric layer and arranged in series along a first branch, and second acoustic wave resonators are disposed over the piezoelectric layer, arranged in parallel, and connected to the first branch and to ground. The first and second acoustic wave resonators include an interdigital transducer electrode interposed between a pair of reflectors. A layer of negative temperature coefficient of frequency dielectric material is disposed over one or more of the second plurality of acoustic wave resonators to control the temperature coefficient of frequency and improve temperature stability of the acoustic wave filter.

A front-end module may include an acoustic wave filter with a first and second interdigital transducer electrode, and a low noise amplifier (LNA) that converts a differential input to a single-ended output with respect to ground. The first interdigital transducer electrode may be single-ended with a first input bus bar configured to receive an input signal and a second input bus bar connected to ground. The second interdigital transducer electrode may be differential with a first output bus bar connected to a first output terminal and a second output bus bar connected to a second output terminal. The LNA may have a differential input connected to the acoustic wave filter, a first input transistor that receives a first signal from the first output terminal of the acoustic wave filter, and a second input transistor that receives a second signal from the second output terminal of the acoustic wave filter.

An acoustic wave device assembly is disclosed. The acoustic wave device assembly can include a first acoustic wave device that includes a first substrate, a first piezoelectric layer, a first solid acoustic mirror that is disposed between the first substrate and the first piezoelectric layer, and a first interdigital transducer electrode that has a first portion embedded in the first piezoelectric layer and a second portion disposed over a surface of the first piezoelectric layer. The acoustic wave device assembly can include a second acoustic wave device that includes a second substrate, a second piezoelectric layer, a second solid acoustic mirror that is disposed between the second substrate and the second piezoelectric layer, and a second interdigital transducer electrode that is in contact with the second piezoelectric layer. The second acoustic wave device is stacked over the first acoustic wave device. The first acoustic wave device and the second acoustic wave device are spaced by a spacer assembly such that a cavity is formed between the first acoustic wave device and the second acoustic wave device.

An elastic wave device includes an interdigital transducer electrode, a dielectric film, and a frequency adjustment film are disposed on a LiNbO.sub.3 substrate. When Euler Angles of the LiNbO.sub.3 substrate are within a range of about 0°±5°, within a range of about θ±1.5°, within a range of about 0°±10°, the interdigital transducer electrode includes a main electrode, a film thickness of the main electrode normalized by a wavelength determined in accordance with an electrode finger pitch of the interdigital transducer electrode is denoted as T, and a density ratio of a material of the main electrode to Pt is denoted as r, the film thickness of the main electrode and θ of the Euler Angles satisfy θ=−0.05°/(T/r−0.04)+31.35°.

Interdigital transducer (IDT) and reflective structure arrangements for surface acoustic wave (SAW) devices are disclosed. Representative SAW devices are described herein with reduced overall size while maintaining good quality factors. In certain embodiments, a SAW device may include an IDT arranged between reflective structures on a piezoelectric material. The reflective structures may include reflective IDTs that are configured to have a phase difference with the IDT to reflect and confine acoustic waves in the piezoelectric material. In certain embodiments, the reflective structures may be electrically connected to at least one of an input signal or an output signal. In this manner, the reflective structures may be configured with reduced size as compared to conventional reflective structures such as gratings, thereby providing a SAW device with reduced dimensions without a negative impact on device performance.