An electronic structure is provided. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are disposed on the substrate. The bump structure is disposed on at least one of the conductors. The protective layer is disposed on the conductors. A region is exposed between the conductors. A method of manufacturing the electronic structure is also provided.

Aspects are disclosed for a piezoelectric device and a method of manufacturing a piezoelectric device. For example, the piezoelectric device can include a substrate, a piezoelectric layer, and an electrode formed on the substrate. The electrode includes a conductive layer and a conductive protective layer that is different from the conductive layer. The piezoelectric device can further include an interconnect formed on the piezoelectric layer over the conductive protective layer of the electrode. The interconnect provides an electrical path from the electrode to the piezoelectric layer.