Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the base.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

A surface acoustic wave device: includes at least one transducer; two acoustic reflectors disposed on either side of the at least one transducer so as to form a cavity, each acoustic reflector comprising an array of electrodes in the form of lines parallel with each other, each array comprising a subset of electrodes connected to a reference potential denoted mass defining a first connection type, and a subset of electrodes that are not connected to any potential, i.e. that have a floating connection defining a second connection type; at least one switching circuit configured to modify the distribution of the connections of at least one part of the electrodes of each array between the different connection types.

An acoustic wave element of the present disclosures has a piezoelectric substrate and an acoustic wave resonator S1 on a main surface of the piezoelectric substrate. The acoustic wave resonator S1 is one being divided into a first IDT electrode and a second IDT electrode which are electrically connected to the first IDT electrode. The first IDT electrode includes a first comb-shaped electrode on the signal input side and a second comb-shaped electrode on the signal output side. The second IDT electrode includes a third comb-shaped electrode on the signal input side and a fourth comb-shaped electrode on the signal output side. The direction of arrangement of the third comb-shaped electrode and the fourth comb-shaped electrode from the third comb-shaped electrode toward the fourth comb-shaped electrode is different from the direction of arrangement from the first comb-shaped electrode toward the second comb-shaped electrode.

A surface acoustic wave filter includes first and second signal terminals and first and second IDT electrodes that are adjacent to or in a vicinity of each other in an x-axis direction and that each includes a pair of comb-shaped electrodes each including a busbar electrode extending in the x-axis direction and electrode fingers extending in a y-axis direction. One of the comb-shaped electrodes in each of the first and second IDT electrodes is electrically connected to the first and second signal terminals, respectively. The surface acoustic wave filter further includes a bridging capacitance including a pair of comb-shaped electrodes arranged in a region outside an overlap region of the electrode fingers. One of the comb-shaped electrodes of the bridging capacitance is electrically connected to the comb-shaped electrode in the first IDT electrode. The other of the comb-shaped electrodes of the bridging capacitance is electrically connected to the comb-shaped electrode in the second IDT electrode.

Described embodiments include a surface acoustic wave device, method, and apparatus. The device includes a piezoelectric substrate and a configurable electrode assembly. The assembly includes a plurality of spaced-apart elongated electrode sub-elements electromechanically coupled with the piezoelectric substrate. The assembly includes a first signal bus crossing each electrode sub-element of the plurality of electrode sub-elements and electrically isolated therefrom. The assembly includes a first matrix of addressable switches. Each addressable switch of the first matrix configured to electrically couple a respective electrode sub-element of the plurality of electrode sub-elements with the first signal bus. The assembly includes a second signal bus crossing each electrode sub-element of the plurality of electrode sub-elements and electrically isolated therefrom. The assembly includes a second matrix of addressable switches. Each addressable switch of the second matrix configured to electrically couple a respective electrode sub-element of the plurality of electrode sub-elements with the second signal bus.

An electronic component module includes an electronic component, a resin structure, a wiring portion, and a shield portion. The resin structure covers a second main surface and at least a portion of a side surface of the electronic component. The wiring portion is electrically connected to the electronic component. The shield portion includes a first conductor layer and a second conductor layer. The first conductor layer is spaced away from the electronic component between the electronic component and the resin structure, and has electrical conductivity. The second conductor layer is spaced away from the wiring portion between the wiring portion and the resin structure, and has electrical conductivity. In the shield portion, the first conductor layer and the second conductor layer are integrated.

A lead-out wiring, which is connected to a comb-shaped electrode formed on a principal surface of a piezoelectric substrate and is disposed to extend to an outer edge of the piezoelectric substrate an outer surrounding wall layer, which is arranged surrounding an outer periphery of the piezoelectric substrate including the lead-out wiring and forms a hollow portion that serves as an operation space for the comb-shaped electrode, and a top board, which bridges the outer surrounding wall layer to seal the hollow portion, are included.

An elastic wave device includes a piezoelectric film and a high acoustic velocity member in which an acoustic velocity of a bulk wave propagating in the high acoustic velocity member is larger than an acoustic velocity of a main mode elastic wave propagating in the piezoelectric film, the piezoelectric film that is directly or indirectly laminated on the high acoustic velocity member, a first conductive film provided on the piezoelectric film, and a second conductive film that is provided on the piezoelectric film and on at least a portion of the first conductive film. A plurality of IDT electrodes including electrode fingers and busbars are provided on the piezoelectric film, at least electrode fingers of a plurality of IDT electrodes are defined by the first conductive film, and at least a portion of connection wiring with which the plurality of IDT electrodes are connected to each other is defined the second conductive film.

An electronic device includes: a first substrate including a first functional element located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second functional element located on a lower surface of the second substrate; and a sealing member that is located on the upper surface of the first substrate, surrounds the second substrate in plan view, is not located between the first substrate and the second substrate, seals the first functional element and the second functional element so that the first functional element and the second functional element are located across an air gap.