There is provided a piezoelectric vibrator element which is excellent in vibration characteristics, high in quality, and capable of suppressing a frequency fluctuation after a frequency adjustment. The piezoelectric vibrator element is provided with a piezoelectric plate having a pair of vibrating arm parts, an electrode film disposed on obverse and reverse surfaces of the piezoelectric plate, and weight metal films for a frequency adjustment disposed on the electrode film at the obverse surface side in the vibrating arm parts. The reverse surface of the vibrating arm part has a reverse side exposure part from which the piezoelectric plate is exposed. The obverse surface of the vibrating arm part has an obverse side exposure part from which the weight metal film and the electrode film are removed, and from which the piezoelectric plate is exposed. A whole of the obverse side exposure part overlaps the reverse side exposure part at a distance from the electrode film on the reverse surface viewed from a thickness direction of the piezoelectric plate.

A quartz crystal resonator that includes an AT-cut quartz crystal blank including a first main surface and a second main surface that face each other and each of which has long sides extending in an X-axis direction of the quartz crystal blank and short sides extending in a Z′-axis direction of the quartz crystal blank, and a first side surface and a second side surface that are located adjacent to the long sides of the first main surface and the second main surface; a first excitation electrode and a second excitation electrode; and an extension electrode that extends from the first main surface to the second main surface along the first side surface and that is electrically connected to the first excitation electrode. Each the first and second side surfaces have a first m-plane face and a second m-plane face.

Hermeticity of an annular sealing bonding material to seal a vibrating part is improved. In the crystal resonator 10, a resonator-plate-side first bonding pattern 251 annularly formed on a crystal resonator plate 2 is bonded to a sealing-member-side first bonding pattern 321 annularly formed on a first sealing member 3, and a resonator-plate-side second bonding pattern 252 annularly formed on the crystal resonator plate 2 is bonded to a sealing-member-side second bonding pattern 421 annularly formed on a second sealing member 4. Thus, annular bonding materials 11a and 11b, which hermetically seal a vibrating part 22 causing piezoelectric resonance, are formed. Inner peripheral edge parts 111a and 111b and outer peripheral edge parts 112a and 112b of the bonding materials 11a and 11b are formed denser than intermediate parts 113a and 113b between the inner and outer peripheral edge parts 111a and 112a, and between the inner and outer peripheral edge parts 111b and 112b.

In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.

A package structure that includes a pair of substrates arranged to oppose each other so as to form an internal space; a bonding portion sealing the pair of substrates; an element is sealed in the internal space and surrounded by the pair of substrates; an adsorption layer within the internal space and opposing at least one substrate of the pair of substrates, the adsorption layer constructed to adsorbs at least hydrogen; and a diffusion-inhibiting layer between the at least one substrate and the adsorption layer, and in which hydrogen is more difficult to diffuse compared with in the at least one substrate.

A resonator device includes a base made of silicon and provided with a first surface and a second surface in a front-back relationship with each other, a resonator element arranged on the first surface, a lid which is made of silicon, which has a third surface arranged at the first surface side to be faced to the first surface, and a recessed part having a bottom surface and opening on the third surface, and the third surface of which is bonded to the first surface, and a getter layer which is arranged on the bottom surface of the recessed part, and which is provided with a gas adsorptive property, wherein the bottom surface of the recessed part is higher in surface roughness Ra than the third surface.

A resonator device includes an element substrate including a frame part having a first surface and a second surface in a front-back relationship with each other, and a resonator element which is coupled to the frame part, and is arranged inside the frame part, a first substrate which is arranged at the first surface side, and has a third surface faced to the first surface, a first bonding layer which is arranged between the element substrate and the first substrate, and which is configured to bond the first surface and the third surface to each other, a second substrate which is arranged at the second surface side, and has a fourth surface faced to the second surface, a second bonding layer which is arranged between the element substrate and the second substrate, and which is configured to bond the second surface and the fourth surface to each other, a housing part which is surrounded by the frame part, the first substrate, and the second substrate, and which houses the resonator element, and a getter layer which is arranged on the fourth surface, exposed to the housing part, and has a gas adsorptive property.

A microelectromechanical resonator assembly includes a first rectangular resonator array and a second rectangular resonator array, where the first rectangular resonator array and the second rectangular resonator array each have at least two rectangular resonator sub-elements, and the at least two rectangular resonator sub-elements are coupled to each other by one or more connection elements, and the first rectangular resonator array and the second rectangular resonator array are coupled to each other by one or more connection elements.

A resonator that includes a vibrating portion that has a piezoelectric film, and a lower and upper electrodes that face each other with the piezoelectric film interposed therebetween. Moreover, a holding portion is provided at least around a maximum displacement region of the vibrating portion and has an insulating film. A holding arm connects the vibrating portion and the holding portion, and include a conductive portion that is in contact with the insulating film of the holding portion in at least a region that faces the maximum displacement region of the vibrating portion. In addition, the conductive portion is electrically connected to the lower electrode or the upper electrode or is grounded.

A piezoelectric vibrating device according to the present invention is provided with: a piezoelectric vibration plate having first and second driving electrodes respectively formed on main surfaces on both sides thereof, the piezoelectric vibration plate further having first and second mounting terminals that are respectively connected to the first and second driving electrodes. The piezoelectric vibrating device is also provided with first and second sealing members respectively joined to the main surfaces on both sides of the piezoelectric vibration plate in a manner that the first and second driving electrodes of the piezoelectric vibration plate are covered with these sealing members. At least one of the first and second sealing members includes a film made of a resin.