The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.

A vibrator device has the vibrator element, a support substrate supporting the vibrator element, and a plurality of interconnections disposed on the support substrate. The support substrate includes an element mounting base, a supporting base, a frame located between the element mounting base and the supporting base, inner beams for coupling the element mounting base and the frame to each other, and outer beams for coupling the frame and the supporting base to each other. The plurality of interconnections include a drive signal interconnection and a detection signal interconnection laid around to the element mounting base and the supporting base, and the drive signal interconnection and the detection signal interconnection are laid around to the element mounting base and the frame through the respective inner beams different from each other, and are laid around to the frame and the supporting base through the respective outer beams different from each other.

Micro-machined acoustic and ultrasonic transducer (MAUT), particularly piezoelectric MAUT (PMAUT), performance tradeoffs have meant reasonable pixel depth resolution necessitated low quality factor (Q) transducers with power distributed over a large bandwidth yielding modest imaging ranges whilst high-Q transducers providing higher acoustic power output for longer imaging ranges exhibit extended ringing limiting pixel depth information. Accordingly, the inventors have established MAUTs supporting high-Q transducers for long-range high-resolution imaging by integrating electromechanical actuators (dampers) which can be selectively engaged to mechanically damped the MAUT. In several applications PMAUT arrays are required where all transducer elements should have almost identical resonant frequencies. However, prior art fabrication processes have tended to produce PMAUTs with large inter-chip and inter-wafer variances. Prior art methodologies to reduce inter-wafer process variations do not address intra-wafer or inter-chip process variations and accordingly the inventors have established manufacturing methodologies and design solutions to address these for the PMAUT resonant frequency.

Micro-machined acoustic and ultrasonic transducer (MAUT), particularly piezoelectric MAUT (PMAUT), performance tradeoffs have meant reasonable pixel depth resolution necessitated low quality factor (Q) transducers with power distributed over a large bandwidth yielding modest imaging ranges whilst high-Q transducers providing higher acoustic power output for longer imaging ranges exhibit extended ringing limiting pixel depth information. Accordingly, the inventors have established MAUTs supporting high-Q transducers for long-range high-resolution imaging by integrating electromechanical actuators (dampers) which can be selectively engaged to mechanically damped the MAUT. In several applications PMAUT arrays are required where all transducer elements should have almost identical resonant frequencies. However, prior art fabrication processes have tended to produce PMAUTs with large inter-chip and inter-wafer variances. Prior art methodologies to reduce inter-wafer process variations do not address intra-wafer or inter-chip process variations and accordingly the inventors have established manufacturing methodologies and design solutions to address these for the PMAUT resonant frequency.

A vibrator device includes: a semiconductor substrate having a first surface and an opposite-side second surface of the semiconductor substrate from the first surface; a vibrator element provided at the first surface; a circuit element that is provided at the first surface and that includes an oscillation circuit; a wiring that is provided at the first surface and that electrically couples the vibrator element and the oscillation circuit; a processing circuit that is provided at the second surface and that processes an output signal of the oscillation circuit; and a through electrode that penetrates the semiconductor substrate and that electrically couples the oscillation circuit and the processing circuit.

A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.

A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.

A substantially rectangular pedestal for mounting a blank is provided, wherein angled portions at four corners of the main body of the pedestal is formed in a shape that is cut out obliquely.

A vibrator device has the vibrator element, a support substrate supporting the vibrator element, and a plurality of interconnections disposed on the support substrate. The support substrate includes an element mounting base, a supporting base, a frame located between the element mounting base and the supporting base, inner beams for coupling the element mounting base and the frame to each other, and outer beams for coupling the frame and the supporting base to each other. The plurality of interconnections include a drive signal interconnection and a detection signal interconnection laid around to the element mounting base and the supporting base, and the drive signal interconnection and the detection signal interconnection are laid around to the element mounting base and the frame through the respective inner beams different from each other, and are laid around to the frame and the supporting base through the respective outer beams different from each other.

A vibrator device has the vibrator element, a support substrate supporting the vibrator element, and a plurality of interconnections disposed on the support substrate. The support substrate includes an element mounting base, a supporting base, a frame located between the element mounting base and the supporting base, inner beams for coupling the element mounting base and the frame to each other, and outer beams for coupling the frame and the supporting base to each other. The plurality of interconnections include a drive signal interconnection and a detection signal interconnection laid around to the element mounting base and the supporting base, and the drive signal interconnection and the detection signal interconnection are laid around to the element mounting base and the frame through the respective inner beams different from each other, and are laid around to the frame and the supporting base through the respective outer beams different from each other.