Patent classifications
H03H9/09
Electronic component
An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.
Electronic component
An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.
METHOD FOR MANUFACTURING RESONANCE DEVICE, AND RESONANCE DEVICE
A method is provided for manufacturing a resonance device, the method includes forming a recessed portion that forms a vibration space for a resonator in an object that is at least one of an upper lid and a lower lid and includes etching on the object by isotropic etching while the object is covered with a mask having a peripheral portion having a frame shape and a stopper formation that extends from the peripheral portion toward an inside of the peripheral portion. The method further includes etching the object while the object is covered with the mask to form a stopper at a position overlapping with the stopper formation on a bottom surface of the recessed portion in a plan view of the object. In this aspect, the stopper restricts collision of the resonator with the bottom surface of the recessed portion.
METHOD FOR MANUFACTURING RESONANCE DEVICE, AND RESONANCE DEVICE
A method is provided for manufacturing a resonance device, the method includes forming a recessed portion that forms a vibration space for a resonator in an object that is at least one of an upper lid and a lower lid and includes etching on the object by isotropic etching while the object is covered with a mask having a peripheral portion having a frame shape and a stopper formation that extends from the peripheral portion toward an inside of the peripheral portion. The method further includes etching the object while the object is covered with the mask to form a stopper at a position overlapping with the stopper formation on a bottom surface of the recessed portion in a plan view of the object. In this aspect, the stopper restricts collision of the resonator with the bottom surface of the recessed portion.
DIFFERENTIAL RESONATOR AND MEMS SENSOR
The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.
DIFFERENTIAL RESONATOR AND MEMS SENSOR
The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.
DIFFERENTIAL RESONATOR AND MEMS SENSOR
The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.
DIFFERENTIAL RESONATOR AND MEMS SENSOR
The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.
Vibration device
A vibration device is provided with reduced thickness and size while maintaining vibration strength. The vibration device includes a first elastic plate with first and second ends and a first planar section disposed between the first and second ends. Moreover, a second elastic plate is joined to the second end of the first elastic plate and includes a second planar section opposing the first planar section of the first elastic plate. The second elastic plate has a flexural rigidity that is higher than that of the first elastic plate. In addition, a piezoelectric vibrating element is disposed on in the first planar section of the first elastic plate to face the second elastic plate. A weight can be attached to the first end of the first elastic plate to facilitate vibration.
Vibration device
A vibration device is provided with reduced thickness and size while maintaining vibration strength. The vibration device includes a first elastic plate with first and second ends and a first planar section disposed between the first and second ends. Moreover, a second elastic plate is joined to the second end of the first elastic plate and includes a second planar section opposing the first planar section of the first elastic plate. The second elastic plate has a flexural rigidity that is higher than that of the first elastic plate. In addition, a piezoelectric vibrating element is disposed on in the first planar section of the first elastic plate to face the second elastic plate. A weight can be attached to the first end of the first elastic plate to facilitate vibration.