A piezoelectric device includes a piezoelectric element, a package, and a vibration absorber. The package contains at least the piezoelectric element. The vibration absorber is disposed on a mounting component, and supports the package. The mounting component is a component to which the package is mounted. The vibration absorber absorbs vibration transmitted from the mounting component to the package. The piezoelectric element has a substantially rectangular shape in plan view. The piezoelectric element is a crystal resonator element including a crystal strip, and electrodes. The crystal strip includes a first major face and a second major face opposite to the first major face. The electrodes extend from the first major face of the crystal strip to the second major face.

A piezoelectric device includes a piezoelectric element, a package, and a vibration absorber. The package contains at least the piezoelectric element. The vibration absorber is disposed on a mounting component, and supports the package. The mounting component is a component to which the package is mounted. The vibration absorber absorbs vibration transmitted from the mounting component to the package. The piezoelectric element has a substantially rectangular shape in plan view. The piezoelectric element is a crystal resonator element including a crystal strip, and electrodes. The crystal strip includes a first major face and a second major face opposite to the first major face. The electrodes extend from the first major face of the crystal strip to the second major face.

In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

A vibrator includes a first substrate, a first lead frame provided in the first substrate, a package supported by the first lead frame, and a vibrating element housed in the package, in which the first lead frame has a first part coupled to the first substrate, a second part coupled to the package, and a third part coupling the first part with the second part, and including a curved portion, the first substrate has a first side and a second side opposite to each other in plan view, and a plurality of the first lead frames are provided at a side of the first side along the first side and provided at a side of the second side along the second side.

A quartz crystal oscillator as an electronic component includes a base section as a first substrate having a lower surface as a first surface, a first lead terminal connected to the first surface, and a second lead terminal connected to the first surface, and the first lead terminal and the second lead terminal intersect each other when viewed in a first direction along the first surface.

A quartz crystal oscillator as an electronic component includes a base section as a first substrate having a lower surface as a first surface, a first lead terminal connected to the first surface, and a second lead terminal connected to the first surface, and the first lead terminal and the second lead terminal intersect each other when viewed in a first direction along the first surface.

A pedestal for a vibration element includes a main body that includes two connection portions, two clearance portions, a mounting portion, and arm portions. The two connection portions are formed along long sides of the main body and contact the base plate. The two clearance portions are formed on insides of the main body with respect to the connection portions and formed along the long sides. The mounting portion is located between the two clearance portions. The vibration element is mounted to the mounting portion. The arm portions are formed on four corners of the main body and connect the mounting portion to the connection portions. A metal pattern is connected to an electrode formed on the vibration element. The metal pattern is formed to connect the mounting portion, the arm portions, and the connection portions.

A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.