The invention relates to a method for manufacturing an electroacoustic resonator comprising the steps of: Providing a first substrate having a first side and an opposite second side; depositing a diamond layer having a first side and an opposite second side on said first substrate, wherein the second side of the diamond layer is in contact with said first side of the first substrate; removing the first substrate; forming a piezoelectric layer on the second side of the diamond layer; applying a second substrate to the first side of the diamond layer.

The invention relates to a method for manufacturing an electroacoustic resonator comprising the steps of: Providing a first substrate having a first side and an opposite second side; depositing a diamond layer having a first side and an opposite second side on said first substrate, wherein the second side of the diamond layer is in contact with said first side of the first substrate; removing the first substrate; forming a piezoelectric layer on the second side of the diamond layer; applying a second substrate to the first side of the diamond layer.

An acoustic resonator includes a substrate and a resonant portion. The resonant portion has a central portion in which a first electrode, a first piezoelectric layer, a second piezoelectric layer, and a second electrode are stacked in order on the substrate, and an extension portion extending outwardly from the central portion and including an insertion layer. A ratio of an average thickness of the first piezoelectric layer to an average thickness of the second piezoelectric layer is 18.4% to 40%.

An acoustic resonator includes a substrate and a resonant portion. The resonant portion has a central portion in which a first electrode, a first piezoelectric layer, a second piezoelectric layer, and a second electrode are stacked in order on the substrate, and an extension portion extending outwardly from the central portion and including an insertion layer. A ratio of an average thickness of the first piezoelectric layer to an average thickness of the second piezoelectric layer is 18.4% to 40%.

Bulk acoustic wave (BAW) resonators and particularly top electrodes with step arrangements for BAW resonators are disclosed. Top electrodes on piezoelectric layers are disclosed that include a border (BO) region with a dual-step arrangement where an inner step and an outer step are formed with increasing heights toward peripheral edges of the top electrode. Dielectric spacer layers may be provided between the outer steps and the piezoelectric layer. Passivation layers are disclosed that extend over the top electrode either to peripheral edges of the piezoelectric layer or that are inset from peripheral edges of the piezoelectric layer. Piezoelectric layers may be arranged with reduced thickness portions in areas that are uncovered by top electrodes. BAW resonators as disclosed herein are provided with high quality factors and suppression of spurious modes while also providing weakened BO modes that are shifted farther away from passbands of such BAW resonators.

An acoustic resonator includes: a substrate; a resonant region including a first electrode, a piezoelectric layer, and a second electrode disposed on the substrate, and a reflective layer disposed along a periphery of the resonant region; and a connection electrode extending from the second electrode. The reflective layer includes a second section disposed between the resonant region and the connection electrode, and a first section, and a cross-sectional area of the first section is different than a cross-sectional area of the second section.

An acoustic resonator includes: a substrate; a resonant region including a first electrode, a piezoelectric layer, and a second electrode disposed on the substrate, and a reflective layer disposed along a periphery of the resonant region; and a connection electrode extending from the second electrode. The reflective layer includes a second section disposed between the resonant region and the connection electrode, and a first section, and a cross-sectional area of the first section is different than a cross-sectional area of the second section.

An acoustic structure is provided. The acoustic structure includes an acoustic resonator structure configured to resonate in a series resonance frequency (e.g., passband frequency) to pass a signal, or cause a series capacitance to block the signal in a parallel resonance frequency (e.g., stopband frequency). The parallel resonance frequency may become higher than the series resonance frequency when the tunable capacitance is lesser than or equal to two times of the series capacitance (C.sub.Tune≤2C.sub.0), or lower than the series resonance frequency when the tunable capacitance is greater than two times of the series capacitance (C.sub.Tune>2C.sub.0). In this regard, the acoustic structure can be configured to include a tunable reactive circuit to generate the tunable capacitance (C.sub.Tune) to adjust the parallel resonance frequency. As such, it may be possible to flexibly configure the acoustic resonator structure to block the signal in desired stopband frequencies.

An acoustic structure is provided. The acoustic structure includes an acoustic resonator structure configured to resonate in a series resonance frequency (e.g., passband frequency) to pass a signal, or cause a series capacitance to block the signal in a parallel resonance frequency (e.g., stopband frequency). The parallel resonance frequency may become higher than the series resonance frequency when the tunable capacitance is lesser than or equal to two times of the series capacitance (C.sub.Tune≤2C.sub.0), or lower than the series resonance frequency when the tunable capacitance is greater than two times of the series capacitance (C.sub.Tune>2C.sub.0). In this regard, the acoustic structure can be configured to include a tunable reactive circuit to generate the tunable capacitance (C.sub.Tune) to adjust the parallel resonance frequency. As such, it may be possible to flexibly configure the acoustic resonator structure to block the signal in desired stopband frequencies.

Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a front surface and a cavity, a perimeter of the cavity defined by a lateral etch-stop comprising etch-stop material. A back surface of a single-crystal piezoelectric plate is attached to the front surface of the substrate except for a portion of the piezoelectric plate that forms a diaphragm that spans the cavity. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the diaphragm.