Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having front and back surfaces, the back surface attached to a surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the diaphragm. A depth of the groove is less than a thickness of the at least one finger of the IDT.

Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having front and back surfaces, the back surface attached to a surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the diaphragm. A depth of the groove is less than a thickness of the at least one finger of the IDT.

An acoustic wave device includes a piezoelectric substrate and an IDT electrode including electrode fingers. A portion of the IDT electrode in which the electrode fingers overlap with each other in a propagation direction of an acoustic wave is an intersecting region. The intersecting region includes a central region on a center side in an extending direction of the electrode fingers, and a first region and a second region located on respective sides of the central region in the extending direction of the electrode fingers. In the central region, a dielectric film is provided between the electrode fingers, and the dielectric film does not overlap with at least a portion of the electrode fingers when seen in plan view.

An acoustic wave device includes a piezoelectric substrate and an IDT electrode including electrode fingers. A portion of the IDT electrode in which the electrode fingers overlap with each other in a propagation direction of an acoustic wave is an intersecting region. The intersecting region includes a central region on a center side in an extending direction of the electrode fingers, and a first region and a second region located on respective sides of the central region in the extending direction of the electrode fingers. In the central region, a dielectric film is provided between the electrode fingers, and the dielectric film does not overlap with at least a portion of the electrode fingers when seen in plan view.

An acoustic wave device includes a support substrate, a piezoelectric layer overlapping the support substrate viewed in a first direction, a functional electrode on at least a first main surface of the piezoelectric layer, and a wiring electrode connected to the functional electrode. A space is provided on a second main surface side opposite to the first main surface of the piezoelectric layer. The space is covered with the piezoelectric layer, the wiring electrode covers a portion of the functional electrode, and an air gap or an insulating film is provided between the functional electrode and the wiring electrode in a region where the functional electrode is covered with the wiring electrode.

An acoustic wave device includes a support substrate, a piezoelectric layer overlapping the support substrate viewed in a first direction, a functional electrode on at least a first main surface of the piezoelectric layer, and a wiring electrode connected to the functional electrode. A space is provided on a second main surface side opposite to the first main surface of the piezoelectric layer. The space is covered with the piezoelectric layer, the wiring electrode covers a portion of the functional electrode, and an air gap or an insulating film is provided between the functional electrode and the wiring electrode in a region where the functional electrode is covered with the wiring electrode.

An acoustic wave device includes a piezoelectric substrate, a first interdigital transducer electrode on the piezoelectric substrate, and a first reflector and a second reflector. The first interdigital transducer electrode, the first reflector, and the second reflector each include a plurality of electrode fingers. At least one of the first interdigital transducer electrode, the first reflector, and the second reflector has a nonuniform duty ratio area where three successive electrode fingers in an acoustic wave propagation direction all have different duty ratios.

An acoustic wave device includes a support substrate, an inorganic film over the support substrate, a piezoelectric layer over the inorganic film, and an electrode over the piezoelectric layer. A portion of the support substrate includes a hollow that overlaps at least a portion of the electrode in a thickness direction of the support substrate. An inner wall of the inorganic film is located farther from the hollow than a location on an inner wall of the support substrate, the location being closest to the piezoelectric layer, the inner wall of the support substrate defining the hollow.

An acoustic wave device includes a support substrate, an inorganic film over the support substrate, a piezoelectric layer over the inorganic film, and an electrode over the piezoelectric layer. A portion of the support substrate includes a hollow that overlaps at least a portion of the electrode in a thickness direction of the support substrate. An inner wall of the inorganic film is located farther from the hollow than a location on an inner wall of the support substrate, the location being closest to the piezoelectric layer, the inner wall of the support substrate defining the hollow.

The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer. During bonding, the area of the top surfaces of the first bumps can be controlled by etched grooves, so the area of the second bonding layer located at the top surfaces of the first bumps can be controlled, thereby realizing the control of a bonding area. By controlling the bonding area, the balance between the bonding requirement and the bonding reliability is realized.