A vibration-absorbing structure for packaging a crystal resonator includes a package base, a resonant crystal blank, and a top cover. The top of the package base has a recess. The sidewall of the package base surrounds the recess. The resonant crystal blank has a border area, at least one serpentine connection area, and a resonant area. The serpentine connection area is connected between the border area and the edge of the resonant area. The border area is arranged on the sidewall. The top cover, arranged on the border area, covers the recess, the at least one serpentine connection area, and the resonant area.

A vibration-absorbing structure for packaging a crystal resonator includes a package base, a resonant crystal blank, and a top cover. The top of the package base has a recess. The sidewall of the package base surrounds the recess. The resonant crystal blank has a border area, at least one serpentine connection area, and a resonant area. The serpentine connection area is connected between the border area and the edge of the resonant area. The border area is arranged on the sidewall. The top cover, arranged on the border area, covers the recess, the at least one serpentine connection area, and the resonant area.

A vibrator device has a base, a semiconductor element having an oscillation circuit, and a vibrator having an excitation electrode sequentially stacked and includes a first wire electrically coupling between the excitation electrode and the semiconductor element, a second wire electrically coupling between a second external terminal as an external output terminal placed on the base and the semiconductor element, and a shield wire placed between at least a part of the first wire and at least a part of the second wire.

A vibrator device has a base, a semiconductor element having an oscillation circuit, and a vibrator having an excitation electrode sequentially stacked and includes a first wire electrically coupling between the excitation electrode and the semiconductor element, a second wire electrically coupling between a second external terminal as an external output terminal placed on the base and the semiconductor element, and a shield wire placed between at least a part of the first wire and at least a part of the second wire.

A vibration device has a substrate, a mount disposed on the substrate, a vibration element having a base end and a tip end, the base end being disposed on the mount, and an adhesive fixing the mount and the vibration element. The mount has a first protrusion and a second protrusion disposed to be aligned in a first direction in which the base end and the tip end are aligned, and whose protrusion heights on the vibration element side differ from each other, the second protrusion is located on the base end side of the vibration element relative to the first protrusion, the vibration element is disposed on the first protrusion and the second protrusion, and a portion of the vibration element on the base end side relative to the second protrusion is separated from the substrate and the mount.

A vibration device has a substrate, a mount disposed on the substrate, a vibration element having a base end and a tip end, the base end being disposed on the mount, and an adhesive fixing the mount and the vibration element. The mount has a first protrusion and a second protrusion disposed to be aligned in a first direction in which the base end and the tip end are aligned, and whose protrusion heights on the vibration element side differ from each other, the second protrusion is located on the base end side of the vibration element relative to the first protrusion, the vibration element is disposed on the first protrusion and the second protrusion, and a portion of the vibration element on the base end side relative to the second protrusion is separated from the substrate and the mount.

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.

In an electronic component, a chip includes a vibrating functional part and a terminal on a first surface thereof. An intermediate member is stacked on the first surface. The intermediate member includes a first through hole above the functional part and surrounds the functional part in plan view. A lid is stacked on a surface of the intermediate member on the opposite side from the chip and closes the first through hole. A bonding member includes an upper end located on the opposite side of the lid from the intermediate member. The intermediate member surrounds the terminal as well as the functional part. The lid includes a second through hole overlapping the terminal out of the functional part and the terminal. The bonding member includes a center portion located inside the second through hole and a lower end located inside the first through hole and bonded to the terminal.

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.