An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.

An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.

To realize a resonator element capable of obtaining sufficient electric field efficiency and securing a satisfactory element characteristic, a resonator element of the invention includes a base section and a pair of resonating arms extending from the base section. The resonator element includes recesses having a curved surface shape respectively on two side surfaces (surfaces crossing a direction in which the resonating arms resonate) of the resonating arm.

To realize a resonator element capable of obtaining sufficient electric field efficiency and securing a satisfactory element characteristic, a resonator element of the invention includes a base section and a pair of resonating arms extending from the base section. The resonator element includes recesses having a curved surface shape respectively on two side surfaces (surfaces crossing a direction in which the resonating arms resonate) of the resonating arm.

A removable system and method for helping position and stabilize implant supported dentures during the healing process after surgery is provided, wherein a removable system comprises a soft tissue supported provisional denture structure configured to help position and stabilize the provisional denture during the transfer of the implant positions to the provisional denture. In the surgical process of providing implant-supported dentures, immediately after the implants are surgically implanted, adhesive is applied to the underside of the provisional denture, and implant connectors are seated on the implants. The provisional denture is seated in the patient's mouth wherein the soft tissue supported provisional denture structure helps stabilize and position the denture. The implant connectors adhere to the adhesive and transfer the implant positions to the provisional denture.

A removable system and method for helping position and stabilize implant supported dentures during the healing process after surgery is provided, wherein a removable system comprises a soft tissue supported provisional denture structure configured to help position and stabilize the provisional denture during the transfer of the implant positions to the provisional denture. In the surgical process of providing implant-supported dentures, immediately after the implants are surgically implanted, adhesive is applied to the underside of the provisional denture, and implant connectors are seated on the implants. The provisional denture is seated in the patient's mouth wherein the soft tissue supported provisional denture structure helps stabilize and position the denture. The implant connectors adhere to the adhesive and transfer the implant positions to the provisional denture.

The vibrator device includes a vibrator element, a relay substrate, a base, an element-side bonding member for bonding the vibrator element and the relay substrate to each other, and a base-side bonding member for bonding the base and the relay substrate to each other. Further, the element-side bonding member has a first bonding member and s second bonding member arranged side by side along an A axis. Further, an X axis of a first quartz crystal substrate provided to the vibrator element is parallel to the A axis, and a second quartz crystal substrate provided to the relay substrate is a Z-cut quartz crystal substrate.

The vibrator device includes a vibrator element, a relay substrate, a base, an element-side bonding member for bonding the vibrator element and the relay substrate to each other, and a base-side bonding member for bonding the base and the relay substrate to each other. Further, the element-side bonding member has a first bonding member and s second bonding member arranged side by side along an A axis. Further, an X axis of a first quartz crystal substrate provided to the vibrator element is parallel to the A axis, and a second quartz crystal substrate provided to the relay substrate is a Z-cut quartz crystal substrate.

An electronic device includes a substrate, a first electronic component mounted on the substrate and including a first vibrator element vibrating along a first plane along the substrate, a second electronic component mounted on the substrate and including a second vibrator element vibrating along a second plane crossing the first plane, a third electronic component mounted on the substrate and including a third vibrator element vibrating along a third plane crossing the first plane and the second plane, and a cap mounted on the substrate and covering the first electronic component, the second electronic component, and the third electronic component, wherein a resonance mode of the cap is not within vibration frequency bands of the second vibrator element and the third vibrator element in an operation temperature range.

An electronic device includes a substrate, a first electronic component mounted on the substrate and including a first vibrator element vibrating along a first plane along the substrate, a second electronic component mounted on the substrate and including a second vibrator element vibrating along a second plane crossing the first plane, a third electronic component mounted on the substrate and including a third vibrator element vibrating along a third plane crossing the first plane and the second plane, and a cap mounted on the substrate and covering the first electronic component, the second electronic component, and the third electronic component, wherein a resonance mode of the cap is not within vibration frequency bands of the second vibrator element and the third vibrator element in an operation temperature range.