A method of manufacturing a vibration element includes: a protective film forming step of forming a protective film on a first substrate surface of a crystal substrate; and a dry etching step of dry-etching the crystal substrate via the protective film. The protective film satisfies a relationship of T1<T2<T3, in which T1 is a thickness of the protective film in an inter-arm region positioned between a first vibration arm forming region in which a first vibration arm is formed and a second vibration arm forming region in which a second vibration arm is formed, T2 is a thickness of the protective film in a groove forming region in which a groove is formed, and T3 is a thickness of the protective film in a region of the first vibration arm forming region and the second vibration arm forming region excluding the groove forming region.

A method of manufacturing a vibration element includes: a first protective film forming step of forming a first protective film on a first substrate surface of a crystal substrate; a first dry etching step of dry-etching the crystal substrate via the first protective film; a second protective film forming step of forming a second protective film on a second substrate surface of the crystal substrate; and a second dry etching step of dry-etching the crystal substrate via the second protective film. A relationship of T1<T2<T3 or T4<T5<T6 is satisfied, in which T1 and T4 are thicknesses of the first and second protective films in an inter-arm region, respectively, T2 and T5 are thicknesses of the first and second protective films in first and second groove forming regions, respectively, and T3 and T6 are thicknesses of the first and second protective films in first and second bank portion forming regions, respectively.

A method for manufacturing a vibration element includes, a first base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a first protective film forming step of forming a first protective film in a first bank portion forming region of the first base film, a first dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film, a second base film forming step of forming a second base film at a second substrate surface of the quartz crystal substrate in the first and second vibrating arm forming regions, a second protective film forming step of forming a second protective film in a second bank portion forming region of the second base film, and a second dry-etching step of dry-etching the quartz crystal substrate through the second base film and the second protective film.

A method for manufacturing a vibration element includes, a first base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a first protective film forming step of forming a first protective film in a first bank portion forming region of the first base film, a first dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film, a second base film forming step of forming a second base film at a second substrate surface of the quartz crystal substrate in the first and second vibrating arm forming regions, a second protective film forming step of forming a second protective film in a second bank portion forming region of the second base film, and a second dry-etching step of dry-etching the quartz crystal substrate through the second base film and the second protective film.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

The vibrator element includes a base part, a vibrating arm extending from the base part, and a weight provided to the vibrating arm, wherein the weight includes a thick film part, a thin film part thinner in film thickness than the thick film part, and a connection part which is located between the thick film part and the thin film part to connect the thick film part and the thin film part to each other, and which forms a taper shape gradually decreasing in film thickness in a direction from the thick film part side toward the thin film part.

An electrical field detector includes an electromechanical oscillator, part of which is included of a piezoelectric element, a frequency measuring device which is coupled to the oscillator so as to measure the oscillation frequency, and an electrical masking assembly. The electrical masking assembly is arranged close to the piezoelectric element so that, during an use of the detector, the piezoelectric element moves by vibrating relative to the electrical masking assembly. A variable part of the piezoelectric element is thus exposed to the electrical field to be measured. A change in the oscillating frequency then forms an electrical field measurement result.

An electrical field detector includes an electromechanical oscillator, part of which is included of a piezoelectric element, a frequency measuring device which is coupled to the oscillator so as to measure the oscillation frequency, and an electrical masking assembly. The electrical masking assembly is arranged close to the piezoelectric element so that, during an use of the detector, the piezoelectric element moves by vibrating relative to the electrical masking assembly. A variable part of the piezoelectric element is thus exposed to the electrical field to be measured. A change in the oscillating frequency then forms an electrical field measurement result.

A vibration element includes a vibrating part, and a support part which is coupled to the vibrating part to support the vibrating part, wherein the vibrating part and the support part have a first surface and a second surface having a front and back relationship with the first surface, a first electrode is disposed on the first surface, the first electrode includes a first layer as a foundation layer, and a second layer as an upper layer of the first layer, when performing zoning into a first area where the first electrode is not disposed, a second area where the first layer and the second layer are stacked on one another, and a third area where the first layer is formed, identification symbols formed of two or more of the first to third areas are disposed, and an identification code formed of a plurality of the identification symbols is provided.