A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

There is provided a piezoelectric vibrator element which is excellent in vibration characteristics, high in quality, and capable of suppressing a frequency fluctuation after a frequency adjustment. The piezoelectric vibrator element is provided with a piezoelectric plate having a pair of vibrating arm parts, an electrode film disposed on obverse and reverse surfaces of the piezoelectric plate, and weight metal films for a frequency adjustment disposed on the electrode film at the obverse surface side in the vibrating arm parts. The reverse surface of the vibrating arm part has a reverse side exposure part from which the piezoelectric plate is exposed. The obverse surface of the vibrating arm part has an obverse side exposure part from which the weight metal film and the electrode film are removed, and from which the piezoelectric plate is exposed. A whole of the obverse side exposure part overlaps the reverse side exposure part at a distance from the electrode film on the reverse surface viewed from a thickness direction of the piezoelectric plate.

A RF antenna comprises a quartz resonator having electrodes disposed thereon with a magnetostrictive film disposed on the quartz resonator either on, partially under or adjacent at least one of the electrodes. A RF antenna having a magnetostrictive film may be made by patterning selected portions of a top surface of the quartz wafer for deposition of electrode metal and deposition of the magnetostrictive film and depositing the electrode metal and the magnetostrictive film; temporarily bonding the quartz wafer to a handle wafer; thinning the quartz wafer to a desired thickness; etching the quartz wafer to define the outlines of at least one quartz resonator bearing the electrode metal and the magnetostrictive film; patterning selected portions of a bottom surface the at least one quartz resonator for deposition of electrode metal and at least one bond pad and depositing the electrode metal and the at least one bond pad; bonding the at least one quartz resonator to a substrate wafer; and releasing the at least one quartz resonator from the handle wafer.

A method of manufacturing a piezoelectric resonator unit that includes preparing a piezoelectric resonator having a piezoelectric element, a pair of excitation electrodes respectively disposed on a first main surface and a second main surface of the piezoelectric element so as to face each other with the piezoelectric element therebetween, and a pair of connection electrodes that are respectively electrically connected to the pair of excitation electrodes; electrically connecting the pair of connection electrodes to a pair of electrode pads on a third main surface of a base member using an electroconductive holding member so as to excitably hold the piezoelectric resonator on the third main surface of the base member; and attaching an electroconductive material, which is scattered from an electroconductive member, to a surface of the electroconductive holding member.

A method of manufacturing a piezoelectric resonator unit that includes preparing a piezoelectric resonator having a piezoelectric element, a pair of excitation electrodes respectively disposed on a first main surface and a second main surface of the piezoelectric element so as to face each other with the piezoelectric element therebetween, and a pair of connection electrodes that are respectively electrically connected to the pair of excitation electrodes; electrically connecting the pair of connection electrodes to a pair of electrode pads on a third main surface of a base member using an electroconductive holding member so as to excitably hold the piezoelectric resonator on the third main surface of the base member; and attaching an electroconductive material, which is scattered from an electroconductive member, to a surface of the electroconductive holding member.

A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

A quartz crystal resonator unit that includes: a quartz crystal resonator including an excitation electrode and a connection electrode electrically connected to the excitation electrode; a base member including an electrode pad; an electrically conductive holding member that connects the connection electrode and the electrode pad to each other; and a lid member attached to the base member so as to form an internal space between the lid member and the base member in which the quartz crystal resonator is accommodated. The electrically conductive holding member is a cured product of an electrically conductive adhesive containing (1) a silicone resin as a main component and (2) an epoxy compound having two or more epoxy groups.

A quartz crystal resonator unit that includes: a quartz crystal resonator including an excitation electrode and a connection electrode electrically connected to the excitation electrode; a base member including an electrode pad; an electrically conductive holding member that connects the connection electrode and the electrode pad to each other; and a lid member attached to the base member so as to form an internal space between the lid member and the base member in which the quartz crystal resonator is accommodated. The electrically conductive holding member is a cured product of an electrically conductive adhesive containing (1) a silicone resin as a main component and (2) an epoxy compound having two or more epoxy groups.