The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

A RF antenna comprises a quartz resonator having electrodes disposed thereon with a magnetostrictive film disposed on the quartz resonator either on, partially under or adjacent at least one of the electrodes. A RF antenna having a magnetostrictive film may be made by patterning selected portions of a top surface of the quartz wafer for deposition of electrode metal and deposition of the magnetostrictive film and depositing the electrode metal and the magnetostrictive film; temporarily bonding the quartz wafer to a handle wafer; thinning the quartz wafer to a desired thickness; etching the quartz wafer to define the outlines of at least one quartz resonator bearing the electrode metal and the magnetostrictive film; patterning selected portions of a bottom surface the at least one quartz resonator for deposition of electrode metal and at least one bond pad and depositing the electrode metal and the at least one bond pad; bonding the at least one quartz resonator to a substrate wafer; and releasing the at least one quartz resonator from the handle wafer.

The vibrator device includes a vibrator element, a relay substrate, a base, an element-side bonding member for bonding the vibrator element and the relay substrate to each other, and a base-side bonding member for bonding the base and the relay substrate to each other. Further, the element-side bonding member has a first bonding member and s second bonding member arranged side by side along an A axis. Further, an X axis of a first quartz crystal substrate provided to the vibrator element is parallel to the A axis, and a second quartz crystal substrate provided to the relay substrate is a Z-cut quartz crystal substrate.

The vibrator device includes a vibrator element, a relay substrate, a base, an element-side bonding member for bonding the vibrator element and the relay substrate to each other, and a base-side bonding member for bonding the base and the relay substrate to each other. Further, the element-side bonding member has a first bonding member and s second bonding member arranged side by side along an A axis. Further, an X axis of a first quartz crystal substrate provided to the vibrator element is parallel to the A axis, and a second quartz crystal substrate provided to the relay substrate is a Z-cut quartz crystal substrate.

The invention relates to a piezoelectric resonator, which comprises a base and at least two vibrating arms (3) extending from the base, at least two grooves (4a, 4b) being formed opposite each other on part of the length of the arms and on upper and lower faces of the arms. The depth of the groove on the upper face is less than 30% of the total thickness of each arm and the depth of the groove on the lower face is more than 50% of the total thickness of each arm, or reversely.

The invention relates to a piezoelectric resonator, which comprises a base and at least two vibrating arms (3) extending from the base, at least two grooves (4a, 4b) being formed opposite each other on part of the length of the arms and on upper and lower faces of the arms. The depth of the groove on the upper face is less than 30% of the total thickness of each arm and the depth of the groove on the lower face is more than 50% of the total thickness of each arm, or reversely.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

The disclosed technology generally relates to quartz crystal devices and more particularly to quartz crystal devices configured to vibrate in torsional mode. In one aspect, a quartz crystal device configured for temperature sensing comprises a fork-shaped quartz crystal comprising a pair of elongate tines laterally extending from a base region in a horizontal lengthwise direction of the fork-shaped quartz crystal. Each of the tines has formed on one or both of opposing sides thereof a vertically protruding line structure laterally elongated in the horizontal lengthwise direction. The quartz crystal device further comprises a first electrode and a second electrode formed on the one or both of the opposing sides of each of the tines and configured such that, when an electrical bias is applied between the first and second electrodes, the fork-shaped quartz crystal vibrates in a torsional mode in which each of the tines twists about a respective axis extending in the horizontal lengthwise direction.