H03H9/2431

DUAL RESONATOR STRUCTURE FOR TEMPERATURE-COMPENSATED OSCILLATORS, INCLUDING RELATED APPARATUSES
20250080049 · 2025-03-06 ·

An apparatus comprises a micromechanical system including a semiconductor body. The semiconductor body comprises a first resonator, a second resonator, and a supporting portion. The first resonator is to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range. The second resonator is to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range. The supporting portion is to support both the first resonator and the second resonator.

MICROMECHANICAL FREQUENCY DIVIDER

A micro-electromechanical system (MEMS) frequency divider apparatus having one or more MEMS resonators on a substrate is presented. A first oscillator frequency, as an approximate multiple of the parametric oscillation frequency, is capacitively coupled from a very closely-spaced electrode (e.g., 40 nm) to a resonant structure of the first oscillator, thus inducing mechanical oscillation. This mechanical oscillation can be coupled through additional MEMS resonators on the substrate. The mechanical resonance is then converted, in at least one of the MEMS resonators, by capacitive coupling back to an electrical signal which is a division of the first oscillation frequency. Output may be generated as a single ended output, or in response to a differential signal between two output electrodes.

High electromechanical coupling strength hollow disk resonators

System and methods for a hollow-disk radial-contour mode resonator structure. The hollow disk reduces the dynamic mass and stiffness of the structure. Since electromechanical coupling C.sub.x/C.sub.o goes as the reciprocal of mass and stiffness, the hollow disk structure has a considerably stronger electromechanical coupling than a solid one at the same frequency, and thus raises C.sub.x/C.sub.o without excessive gap-scaling. Several embodiments of hollow disk resonators are detailed, including asymmetric and symmetric disk configurations.

CONTROL DEVICE FOR VIBRATION-TYPE ACTUATOR
20250233532 · 2025-07-17 ·

To enable estimating thrust or speed of a vibration-type actuator without use of a thrust or speed detection sensor, a device is provided to control the vibration-type actuator, with a neural network that includes a plurality of input layers which receives at least a first input value and a second input value. The first input value is based on at least one of a phase difference between a first alternating-current signal and a second alternating-current signal, frequencies of the first alternating-current signal and the second alternating-current signal, and an amplitude of the first alternating-current signal or the second alternating-current signal. The second input value is at least one of a measured value of a vibrational state in a vibrating body and a measured value corresponding to an admittance characteristic of the vibrating body.

Spherical dielectric structures for storing electromagnetic energy

In one embodiment, an electromagnetic (EM) energy containment device includes a spherically symmetric resonant dielectric structure having a radial dimension R.sub.0 defined as R.sub.0=3/.Math..sub.0/2 and having first and second regions with different indices of refraction. The spherically symmetric resonant dielectric structure is configured to receive and to contain, for a selectable duration of time, an electromagnetic wave of a wavelength .sub.0, and can find applications in delay circuits for beam steering for example.

MICRO/NANO ELECTROMECHANICAL RING OSCILLATOR DEVICE

The present disclosure discloses a capacitively transduced Micro or Nano Electromechanical ring oscillator device comprising two or more resonance units coupled with each other, the two or more resonance units are coupled with one or more Signal Conditioning Circuits (SCCs). The oscillator further comprises a first set of the one or more SCC is coupled with at least one of the two or more resonance units. Further, the oscillator comprises a second set of the one or more SCC is coupled with at least one of the two or more resonance units, wherein one of the first set of the one or more SCC and the second set of the one or more SCC is configured to operate in a buffer active state. The two or more resonance units comprises one or more control gate units, and the two or more resonance units are coupled with each other in a back-to-back configuration.

MEMS RESONATOR

A MEMS resonator includes a pantograph that is a parallelogram, an oscillator connected to each vertex of the pantograph, and an electrode disposed opposite each oscillator, and forming a capacitor with the oscillator. A set of the electrodes disposed opposite to a set of the oscillators along an extension direction of a diagonal line of the pantograph that is the parallelogram have applied thereto a voltage differing in phase by 180 from another set of the electrodes disposed opposite to another set of the oscillators along an extension direction of another diagonal line of the pantograph. At least two of the MEMS resonators are connected so as to share one oscillator.

Dual resonator structure for temperature-compensated oscillators, including related apparatuses
12627258 · 2026-05-12 · ·

An apparatus comprises a micromechanical system including a semiconductor body. The semiconductor body comprises a first resonator, a second resonator, and a supporting portion. The first resonator is to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range. The second resonator is to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range. The supporting portion is to support both the first resonator and the second resonator.