A filter includes a first filter circuit and an additional circuit. The first filter circuit includes a resonator electrode and a main wire. The main wire includes first and second metal films, the second metal film being in contact with the first metal film. The additional circuit includes an IDT electrode group including IDT electrodes and a sub-wire connecting the IDT electrode group to the first filter circuit. At least a portion of the sub-wire includes a third metal film connected to the IDT electrode group. The third metal film is covered with a fourth metal film with an insulating layer interposed therebetween, the insulating layer being provided on the third metal film. The fourth metal film is connected to a ground terminal on a substrate.

Bandpass filters are disclosed. A bandpass filter includes a plurality of series resonators and a plurality of shunt resonators. The series resonators are connected in series between a first port and a second port. The plurality of series resonators includes a first series resonator and a second series resonator connected at a node. The plurality of shunt resonators includes a first shunt resonator coupled between the node and a ground. A capacitor bridges the first and second series resonators.

A filter includes a transmission filter circuit and an additional circuit that is electrically connected in parallel with at least a portion of the transmission filter circuit. The additional circuit includes a resonator group including a plurality of interdigital transducer electrodes provided adjacent to or in a vicinity of each other in an acoustic wave propagation direction, a first capacitive element electrically connected between the resonator group and one end of the additional circuit, and a second capacitive element connected between a ground and a signal path electrically connecting the resonator group and the first capacitive element. A capacitance of the second capacitive element is greater than about 0 pF and less than or substantially equal to about 2.0 pF.

Adaptive RF filters based on modulated resonators are provided. The filter architecture is based on time-interleaved commutation of passive RF resonators. The architecture can behave as a two-port filter network, with a fully tunable instantaneous filter bandwidth. The filters are applicable as miniaturized, environment-aware RF signal processing components and can be used in mobile communications.

A filter device includes a first filter and a second filter. The first filter and the second filter are disposed in parallel between a first terminal and a second terminal. A first passband of the filter device includes at least part of a second passband of the first filter. The first passband includes at least part of a third passband of the second filter. The second passband is narrower than the first passband. The third passband is narrower than the first passband. The third passband has a center frequency higher than a center frequency of the second passband. The first filter includes multiple elastic wave resonators and a first capacitive element. The first capacitive element is connected in parallel with the first elastic wave resonator.

A coupled resonator filter device is disclosed. The coupled resonator filter device includes a substrate with one or more acoustic reflector layers disposed over the substrate, a first lower electrode disposed over the one or more acoustic reflector layers, a first piezoelectric layer disposed over the first lower electrode, and a first upper electrode disposed over the first piezoelectric layer. The coupled resonator filter device further includes one or more acoustic coupling layers disposed over the first upper electrode, a second lower electrode disposed over the one or more acoustic coupling layers, a second piezoelectric layer disposed over the second lower electrode, a second upper electrode disposed over the second piezoelectric layer, and a first tuning capacitor having a first upper plate coupled to the first upper electrode and a first lower plate coupled to the first lower electrode.

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

Acoustic resonator devices, filter devices, and methods of making acoustic resonator devices and filter devices. An acoustic resonator device includes a piezoelectric plate, wherein a portion of the piezoelectric plate forms a diaphragm that spans a cavity. An interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. An integrated passive device circuit (IPD) is connected to the IDT.

Networks and filters are disclosed. A network includes a resonator that exhibits both a resonance and an anti-resonance and an inverter circuit connected in parallel with the resonator to form a composite resonator. An anti-resonant frequency of the composite resonator is different from the resonator's anti-resonant frequency.

A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.