Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes an interdigital transducer with interleaved fingers on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the acoustic resonator chip and a perimeter of the interposer.

Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate. Portions of the piezoelectric plate form at least first and second diaphragms spanning respective cavities in the substrate. A first conductor pattern on the surface of the piezoelectric plate includes a first plurality of contact pads and at least first and second IDTs with interleaved fingers of each IDT on respective diaphragms. An interposer includes a second plurality of contacts pads. A plurality of conductive balls bond each of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.

An acoustic wave device includes a support substrate, an acoustic reflection film on the support substrate, a piezoelectric layer on the acoustic reflection film, the piezoelectric layer including first and second primary surfaces, and first and second flat-plate electrodes on the first and second primary surfaces of the piezoelectric layer. The acoustic reflection film includes high acoustic impedance layers and low acoustic impedance layers alternately stacked together. At least one layer of the high acoustic impedance and low acoustic impedance layers is a stack of layers of first and second materials having equal or substantially equal acoustic impedances for at least one of longitudinal acoustic impedance and transversal acoustic impedance. The interface between the layers of first and second materials has irregularities.

Acoustic resonators, such as bulk acoustic wave (BAW) resonators, are disclosed that include phase shift structures. Acoustic resonators, including stacked crystal filters (SCFs) and coupled resonator filters (CRFs), may include inverted piezoelectric layers that are configured to provide built-in phase shift capabilities. Circuit topologies that include such SCFs may be provided with simplified structures and reduced loss. Circuit topologies with such CRFs may be provided with more symmetrical electrical connections and improved phase balance over operating frequencies. SCFs with phase shift structures may additionally include spurious mode suppression by modifying piezoelectric coupling profiles within one or more layers. Mode suppression configurations may include structures with one or more inverted polarity piezoelectric layers, one or more non-piezoelectric layers, one or more thicker electrodes of the SCF, and combinations thereof.

Acoustic resonators, such as bulk acoustic wave (BAW) resonators, are disclosed that include mode suppression structures. Acoustic resonators, including stacked crystal filters (SCFs), are disclosed that include spurious mode suppression by modifying a piezoelectric coupling profile within one or more layers of an SCF. Mode suppression configurations may include structures with one or more inverted polarity piezoelectric layers, one or more non-piezoelectric layers, one or more thicker electrodes of the SCF, and combinations thereof. Symmetric input and output electrical response for SCFs with mode suppression configurations may be exhibited by including piezoelectric materials with different electromechanical coupling values and/or by dividing stress profiles differently by configuring different thicknesses for input and output sides of SCFs.

Acoustic resonators, such as bulk acoustic wave (BAW) resonators and, in particular, acoustic resonators including stacked crystal filters (SCFs) are disclosed. SCF structures are disclosed with increased spurious free ranges by providing various arrangements of acoustically soft materials in one or more locations that correspond with high stress regions of one or more modes. For SCFs operating in first order modes, relative amounts of acoustically soft materials within shared electrodes may be increased. One or more additional layers of acoustically soft materials may also be added to SCF structures near shared electrodes. Accordingly, SCFs may be provided with increased frequency spreads between first order modes and second order modes.

An acoustic resonator filter includes at least one series acoustic resonator, electrically connected between a first port and a second port through which a radio frequency (RF) signal passes, a branch node electrically connected to the at least one series acoustic resonator and having a respective first shunt connection path and a second shunt connection path each extended toward a ground, a first shunt acoustic resonator electrically connected in series with the first shunt connection path, and a second shunt acoustic resonator electrically connected in series with the second shunt connection path, and having a resonance frequency higher than a resonance frequency of the first shunt acoustic resonator. An inductance of the second shunt connection path is higher than an inductance of the first shunt connection path.

Aspects of this disclosure relate to acoustic wave filters that include a Lamb wave resonator and a second acoustic wave resonator that is a different type of acoustic wave resonator than the Lamb wave resonator. The different type of resonator can be a film bulk acoustic wave resonator for example. Some embodiments of this disclosure relate to an acoustic wave filter that includes the Lamb wave resonator and the second acoustic wave resonator. Some embodiments of this disclosure related to different respective acoustic wave filters including the Lamb wave resonator and the second acoustic wave resonator, in which the Lamb wave resonator and the second acoustic wave resonator are implemented on a common substrate.

A bulk acoustic wave filter comprises a substrate, an insulating layer disposed on the substrate and having a first cavity and a second cavity formed therein, a first bulk-acoustic-wave-resonance-structure disposed on the first cavity and a second bulk-acoustic-wave-resonance-structure disposed on the second cavity. The first bulk-acoustic-wave-resonance-structure comprises a first bottom electrode disposed on the first cavity, a first top electrode disposed on the first bottom electrode, a first piezoelectric layer portion sandwiched between the first top electrode and the first bottom electrode, and a first frequency tuning structure disposed between the first cavity and the first bottom electrode. The second bulk-acoustic-wave-resonance-structure comprises a second bottom electrode disposed on the second cavity, a second top electrode disposed on the second bottom electrode, a second piezoelectric layer portion sandwiched between the second top electrode and the second bottom electrode.

A method for forming cavity of bulk acoustic wave resonator comprising following steps of: forming a sacrificial epitaxial structure mesa on a compound semiconductor substrate; forming an insulating layer on the sacrificial epitaxial structure mesa and the compound semiconductor substrate; polishing the insulating layer by a chemical-mechanical planarization process to form a polished surface; forming a bulk acoustic wave resonance structure on the polished surface, which comprises following steps of: forming a bottom electrode layer on the polished surface; forming a piezoelectric layer on the bottom electrode layer; and forming a top electrode layer on the piezoelectric layer, wherein the bulk acoustic wave resonance structure is located above the sacrificial epitaxial structure mesa; and etching the sacrificial epitaxial structure mesa to form a cavity, wherein the cavity is located under the bulk acoustic wave resonance structure.