A filter circuit comprises in a signal line a band filter (BF) allowing to let pass a useful frequency band and a notch filter (NF) circuited in series to the band filter for filtering out a stop band frequency. The notch filter comprises a series circuit of a number of parallel shunt elements (SE1 . . . SE6) wherein each shunt element is shifted infrequency against the other shunt elements that the frequencies thereof are distributed (f1 . . . F6) over a notch band. All shunt elements may be realized as a SAW one-port resonator (TR.sub.NF) including regions with different pitches.

Aspects of this disclosure relate to a multiplexer that includes a first filter and a second filter coupled to a common node. The first filter includes an acoustic filter arranged to filter a radio frequency signal, a matching network coupled between the acoustic filter and the common node, and a parallel circuit coupled in series between the acoustic filter and the common node. The parallel circuit includes an inductive component in parallel with a capacitive component. In certain instances, the first filter is coupled to the common node via a switch, the matching network is coupled to a node between the acoustic filter and the switch, and the parallel circuit is coupled in series between the acoustic filter and the switch. Related methods, radio frequency modules, and wireless communication devices are also disclosed.

Aspects of this disclosure relate to an acoustic wave resonator with transverse mode suppression. The acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode, a temperature compensation layer, and a mass loading strip. The mass loading strip can be a conductive strip. The mass loading strip can overlap edge portions of fingers of the interdigital transducer electrode. A layer of the mass loading strip can have a density that is at least as high as a density of a material of the interdigital transducer electrode. The material of the interdigital transducer can impact acoustic properties of the acoustic wave resonator.

A multiplexer includes acoustic wave filters that are electrically connected to a common connection terminal. In a first transmission-side filter of the acoustic wave filters, a series arm resonator closest to the common connection terminal includes acoustic wave resonators that are electrically connected in series and capacitance elements that are electrically connected between at least one of signal paths electrically connecting the acoustic wave resonators to each other and a reference terminal.

A multiplexer includes a common terminal, a first terminal, a second terminal, a first filter device including acoustic wave resonators including series resonators and parallel resonators, an inductor provided between an acoustic wave resonator and the first terminal, and a second filter device. The first filter device further includes a first ground terminal to which a parallel resonator is electrically connected, a second ground terminal to which the parallel resonators are electrically connected, and a wiring provided between the inductor and an acoustic wave resonator. In the first filter device, the wiring is electrically connected to the first ground terminal, and the first ground terminal is not connected to the second ground terminal.

Disclosed is a semiconductor device including a semiconductor die, a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess on its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.

Aspects of this disclosure relate to a radio frequency system with an antenna, a radio frequency amplifier, and parallel acoustic wave filters. The parallel acoustic wave filters can each be a band pass filter having a passband and resonator area. The passbands of the parallel acoustic filters can be overlap in an overlap band. One of the parallel acoustic wave filters can have a smaller resonator area than another of the parallel acoustic wave filters.

A multiplexer includes a transmission-side filter electrically connected to a common terminal and a transmission input terminal, and a transmission-side filter electrically connected to the common terminal and a transmission input terminal. The transmission-side filter includes a plurality of series arm resonators and a plurality of parallel arm resonators. Capacitance elements are respectively electrically connected in parallel to the series arm resonator and the parallel arm resonator, which are connected most proximately to the common terminal. IDT electrodes of a series arm resonator and a parallel arm resonator connected most proximately to the common terminal do not include a thinning electrode, and others of the series arm resonators and the parallel arm resonators include thinning electrodes.

A frequency division duplex (FDD) first band includes a first downlink operating band and a first uplink operating band. An FDD second band includes a second downlink operating band and a second uplink operating band. In the FDD first band and the FDD second band, (1) the first downlink operating band, second downlink operating band, first uplink operating band, and second uplink operating band are positioned in order from lowest to highest frequency. The frequency range of the first uplink operating band and that of the second uplink operating band do not overlap each other. A filter is formed in or on a first substrate having piezoelectric properties and has a pass band including the first and second uplink operating bands.

An acoustic wave device includes an acoustic wave element substrate, filter electrodes on a first surface of the acoustic wave element substrate, a first insulator layer covering a second surface of the acoustic wave element substrate, and a second insulator layer laminated on the first insulator layer and sandwiching the first insulator layer between the second insulator layer and the acoustic wave element substrate. The products of propagation speeds of an acoustic wave in those layers and densities of those layers satisfy a predetermined relationship.