The present disclosure a program burning device configured to read or write to a program burning interface. The program burning device includes a microprocessor, a programming drive circuit and an overcurrent protection circuit. The microprocessor outputs a first test signal or a second test signal. The programming drive circuit outputs a high driving voltage or a low driving voltage to the program burning interface. After the programming drive circuit outputs the low driving voltage for a preset time, the programming drive circuit outputs the high driving voltage to make the program burning interface form a high impedance. Afterwards, the overcurrent protection circuit receives the first test signal to trigger the overcurrent protection, and then receives the second test signal to trigger the undercurrent protection. If triggering the overcurrent protection and the undercurrent protection are continuously failed over a preset number of times, the microprocessor determines that current protection is failed.

In a semiconductor switch, a resistance value between a current input terminal to which a current is input and a current output terminal from which a current is output decreases as a voltage of a control terminal based on a potential of the current output terminal increases. A booster circuit is disposed on a path extending from the current input terminal to the control terminal. The booster circuit boosts a voltage input from the current input terminal side and applies the boosted voltage to the control terminal. A switch is connected between the control terminal and the current output terminal of the semiconductor switch. The switch is switched off by power consumption. The power consumption stops and the switch switches on if the supply of power to the booster circuit stops.

In a voltage converter, a blocking transistor has a conduction path between a power terminal and a converter terminal. A body diode of the blocking transistor: conducts current from the power terminal to the converter terminal; and blocks current from the converter terminal to the power terminal. A first switching transistor has a conduction path between the converter terminal and a switching terminal. A second switching transistor has a conduction path between the switching terminal and a ground terminal. A first gate driver has an output coupled to a control terminal of the first switching transistor. A second gate driver has an output coupled to a control terminal of the second switching transistor. A driver circuit has an output coupled to a control terminal of the blocking transistor. A bootstrap terminal of the driver circuit is coupled to a bias input of the first gate driver.

Field effect transistors in an electronic switching device are provided with electrostatic discharge (ESD) protection elements electrically coupled to a first current terminal of each transistor (e.g., a source of each transistor or a drain of each transistor), allowing the electronic switching device to withstand ESD-induced currents without damage to the switching device.

A bidirectional GaN FET with a single gate formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs with a common source. The single-gate bidirectional GaN FET occupies most of the integrated circuit die, such that the integrated device has a low channel resistance, while also capturing the advantages of a back-to-back bidirectional GaN FET device.

A gate drive device drives a gate of a semiconductor switching element and controls a transient voltage corresponding to a voltage of a main terminal of the semiconductor switching element to a target value of the transient voltage at a time of switching the semiconductor switching element. The gate drive device includes a calculation circuit, a drive circuit, a detection circuit, and a learning circuit. The calculation circuit executes a predetermined calculation mode to calculate an operation amount for operating gate drive speed of the semiconductor switching element. The drive circuit drives the gate of the semiconductor switching element according to the operation amount. The detection circuit detects the transient voltage. The learning circuit executes learning processing to change the predetermined calculation mode based on the operation amount calculated by the calculation circuit and the transient voltage detected by the detection circuit.

A buffer circuit includes an input terminal configured to receive an input signal, an output terminal, an inverter, and a resistor-capacitor (RC) circuit coupled in series with the inverter between the input terminal and the output terminal. The RC circuit includes an NMOS transistor coupled between an RC circuit output terminal and a reference node, a resistor coupled between the RC circuit output terminal and a power supply node, and a capacitor coupled between the RC circuit output terminal and one of the power supply node or the reference node, and the inverter and the RC circuit are configured to generate an output signal at the output terminal based on the input signal.

A power stage includes a power transistor controlled via a driver, the power transistor comprising three terminals, including a collector c, an emitter e and a gate g linked to the driver, the power stage comprising a detection device for detecting a short-circuit current cc between the collector c and the emitter e, the detection device comprising a voltage sensor capable of detecting a voltage Vge at the gate g of the power transistor outside of a predefined voltage range.

A switch includes an input terminal, an output terminal, and a stack including transistors, such as, for example, field effect transistors, coupled in series, the stack being coupled between the input terminal and the output terminal. The switch also includes at least one switching element configured to be selectively operated in a conducting state or a non-conducting state, and at least one overvoltage protection element coupled to the stack by the at least one switching element. By way of example, the switch can implement a radio-frequency switch.

A semiconductor apparatus includes an internal circuit connected to a first power line to which a first power voltage is applied; a transistor including a first terminal, which is connected to a node to which an input voltage is applied, a second terminal connected to the internal circuit, and a control terminal to which a control voltage is applied; and a voltage control circuit, which is connected to the node, generating the control voltage. Further, the voltage control circuit includes a step-down circuit generating an internal voltage by lowering the input voltage applied to the node, and a switching circuit, which is connected to the first power line, generating the control voltage based on the first power voltage and the internal voltage.