A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.

A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

The present document relates to a level shifter circuit configured to transform an input voltage at an input of the level shifter circuit into an output voltage at an output of the level shifter circuit. The level shifter circuit may comprise a first switching element coupled between an output supply voltage and a positive output terminal, wherein a control terminal of the first switching element is coupled to a negative output terminal. The level shifter circuit may comprise a second switching element coupled between the output supply voltage and the negative output terminal, wherein a control terminal of the second switching element is coupled to the positive output terminal. The level shifter circuit may comprise a drive circuit configured to drive the control terminals of the first and the second switching element based on the input voltage at the input of the level shifter circuit.

In a transistor turnoff system, a transistor control circuit is configured to adjust a control voltage at a transistor control output responsive to a comparison signal at a control input. The control voltage has a slew rate. A comparator has a comparator output and first and second comparator inputs. The first comparator input is coupled to the transistor control output. The comparator is configured to: provide the comparison signal at the comparator output based on a reference voltage at the second comparator input; and deactivate the transistor control circuit by changing a state of the comparison signal responsive to the control voltage falling below the reference voltage. A slew-rate compensator is configured to increase the reference voltage by a compensation voltage that compensates for a time delay of the comparator or the transistor control circuit. The compensation voltage is proportional to the slew rate.

A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

A semiconductor device according to embodiments includes a normally-off transistor having a first electrode, a second electrode, and a first control electrode, a normally-on transistor having a third electrode electrically connected to the second electrode, a fourth electrode, and a second control electrode, a first element having a first end portion electrically connected to the first control electrode and a second end portion electrically connected to the first electrode, and the first element including a first capacitance component; and, a second element having a third end portion electrically connected to the first control electrode and the first end portion and a fourth end portion, and the second element including a second capacitance component, wherein, when a threshold voltage of the normally-off transistor is denoted by V.sub.th, a maximum rated gate voltage of the normally-off transistor is denoted by V.sub.g_max, a voltage of the fourth end portion is denoted by V.sub.g_on, the first capacitance component is denoted by C.sub.a, and the second capacitance component is denoted by C.sub.b, V.sub.th<(C.sub.b/(C.sub.a+C.sub.b))V.sub.g_on<V.sub.g_max.

A system may include an output driving stage comprising a first switch configured to selectively open and close an electrical path between a first supply voltage and an output terminal of the output driving stage and a second switch configured to selectively open and close an electrical path between a second supply voltage and the output terminal of the output driving stage, wherein the second supply voltage is lower than the first supply voltage. The system may also include detection and protection circuitry configured to monitor a physical quantity indicative of the second supply voltage and responsive to the physical quantity exceeding an overvoltage threshold, electrically isolate the output terminal from the second supply voltage.

A level shifter and an electronic device are provided. The electronic device includes a digital circuit and a level shifter. The level shifter converts a first and a second input signals to an output signal. The level shifter includes a cross-coupled circuit, a protection circuit, and a pull-down module. The cross-coupled circuit includes a first and a second pull-up transistors. The protection circuit includes a first and a second protection transistors. The pull-down module includes a first and a second pull-down circuits and a first and a second switching circuits. The first and the second pull-up transistors, the first and the second protection transistors, and the first and the second pull-down circuits are selectively switched on in response to the first and the second input signals. The digital circuit receives the output signal from the level shifter.

The present disclosure provides an electrostatic protection circuit and an electronic device. The electrostatic protection circuit is connected to a first end point and a second end point of a power device. The electrostatic protection circuit is configured to allow bilateral electrostatic protection between the first end point and the second end point of the power device. The power device includes a transverse high-electron-mobility transistor (HEMT).

Techniques are described for implementing diodes with low threshold voltages and high breakdown voltages. Some embodiments further implement diode devices with programmable threshold voltages. For example, embodiments can couples a native device with one or more low-threshold, diode-connected devices. The coupling is such that the low-threshold device provides a low threshold voltage while being protected from breakdown by the native device, effectively manifesting as a high breakdown voltage. Some implementations include selectable branches by which the native device is programmably coupled with any of multiple low-threshold, diode-connected devices.