A driving apparatus drives a load. An N-channel MOSFET is disposed downstream of the load on a current path of a current that flows via the load. A circuit resistor is connected between a direct current power source and the gate of the MOSFET. A first switch is connected between the gate and the source of the MOSFET. A microcomputer outputs a voltage relative to a potential at an output terminal of a second switch to a control terminal of the second switch. As a result, the second switch is turned ON or OFF. A switching circuit turns the first switch ON when the second switch is turned ON and turns the first switch OFF when the second switch is turned OFF.

A method for in situ threshold voltage determination of a semiconductor device includes sourcing a current to a first terminal of the semiconductor device. A gate terminal of the semiconductor device is driven with a plurality of gate levels. Each gate level includes one of a plurality of different gate voltages. A transistor voltage is measured between the first terminal and a second terminal of the semiconductor device during each gate level. The respective gate voltage is stored in response to the semiconductor device voltage transitioning past a voltage limit. A temperature dependent threshold voltage of the semiconductor device is estimated for a first measured temperature measured during the storing of the stored gate voltage from a previously stored gate voltage and a second measure temperature.

A method for in situ threshold voltage determination of a semiconductor device includes sourcing a current to a first terminal of the semiconductor device. A gate terminal of the semiconductor device is driven with a plurality of gate levels. Each gate level includes one of a plurality of different gate voltages. A transistor voltage is measured between the first terminal and a second terminal of the semiconductor device during each gate level. The respective gate voltage is stored in response to the semiconductor device voltage transitioning past a voltage limit. A temperature dependent threshold voltage of the semiconductor device is estimated for a first measured temperature measured during the storing of the stored gate voltage from a previously stored gate voltage and a second measure temperature.

The present disclosure relates to a solid insulated switch using a semiconductor comprising a main circuit unit connected between systems on both sides thereof, and which has a first semiconductor and a second semiconductor arranged in a series; a snubber circuit having a capacitor and a resistor arranged in a series, one end connected in parallel to the front end of the first semiconductor switch, and the other end connected in parallel to the rear end of the second semiconductor switch; a freewheeling circuit, having a diode and a resistor arranged in a series, one end connected to a common contact between the first semiconductor switch and the second semiconductor switch, and the other end connected to the ground; and a mechanical switch for ensuring physical insulation after fault current interruption.

The present disclosure relates to a solid insulated switch using a semiconductor comprising a main circuit unit connected between systems on both sides thereof, and which has a first semiconductor and a second semiconductor arranged in a series; a snubber circuit having a capacitor and a resistor arranged in a series, one end connected in parallel to the front end of the first semiconductor switch, and the other end connected in parallel to the rear end of the second semiconductor switch; a freewheeling circuit, having a diode and a resistor arranged in a series, one end connected to a common contact between the first semiconductor switch and the second semiconductor switch, and the other end connected to the ground; and a mechanical switch for ensuring physical insulation after fault current interruption.

Power semiconductor device capable of controlling slope of current and voltage during dynamic switching disclosed. The power semiconductor device may include a semiconductor substrate and a cell array being consisted of a plurality of transistor cells on an active area, wherein each of the plurality of transistor cells may include an emitter region, a body region, a contact region and a gate region, wherein non-uniform threshold voltages may be respectively set in the plurality of transistor cells constituting the cell array, wherein a gate signal may be applied to each of the plurality of transistor cells through an input/output unit, wherein the input/output unit may include a first gate signal path configured for supplying a gate charging current to the gate regions in each of the plurality of transistor cells and a second gate signal path configured for discharging a gate discharging current from the gate region.

Power semiconductor device capable of controlling slope of current and voltage during dynamic switching disclosed. The power semiconductor device may include a semiconductor substrate and a cell array being consisted of a plurality of transistor cells on an active area, wherein each of the plurality of transistor cells may include an emitter region, a body region, a contact region and a gate region, wherein non-uniform threshold voltages may be respectively set in the plurality of transistor cells constituting the cell array, wherein a gate signal may be applied to each of the plurality of transistor cells through an input/output unit, wherein the input/output unit may include a first gate signal path configured for supplying a gate charging current to the gate regions in each of the plurality of transistor cells and a second gate signal path configured for discharging a gate discharging current from the gate region.

An apparatus includes a first leg having a plurality of transistors connected in series between a first node and a second node. Each of the plurality of transistors includes a respective body diode. The apparatus further includes a second leg connected between the first node and the second node and in parallel to the series connection of the plurality of transistors of the first leg. The second leg includes a first transistor. The second leg has lower reverse recovery losses relative to the first leg.

An apparatus includes a first leg having a plurality of transistors connected in series between a first node and a second node. Each of the plurality of transistors includes a respective body diode. The apparatus further includes a second leg connected between the first node and the second node and in parallel to the series connection of the plurality of transistors of the first leg. The second leg includes a first transistor. The second leg has lower reverse recovery losses relative to the first leg.

An overcurrent protection circuit is provided for a switching element turned on/off based on a control voltage. The overcurrent protection circuit includes a first transistor and a second transistor. The first transistor is a PNP bipolar transistor and has an emitter connected to the control voltage. The second transistor is an NPN bipolar transistor and has a base connected to a collector of the first transistor, a collector connected to a base of the first transistor and pulled up to a predetermined pull-up voltage, and a grounded emitter. When the control voltage exceeds a predetermined first threshold voltage, the first and second transistors are turned on, the control voltage is dropped by drop of the pull-up voltage, and thus the overcurrent protection circuit starts a protection operation of turning off the switching element.