A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

A circuit for implementing a scan chain in programmable resources of an integrated circuit is described. The circuit comprises a programmable element configured to receive an input signal and generate an output signal based upon the input signal; a selection circuit configured to receive the output signal generated by the programmable element at a first input and to receive a scan chain input signal at a second input, wherein the selection circuit generates a selected output signal in response to a selection circuit control signal; and a register configured to receive the selected output signal of the selection circuit.

Systems and methods are disclosed for preventing tampering of a programmable integrated circuit device. Generally, programmable devices, such as FPGAs, have two stages of operation; a configuration stage and a user mode stage. To prevent tampering and/or reverse engineering of a programmable device, various anti-tampering techniques may be employed during either stage of operation to disable the device and/or erase sensitive information stored on the device once tampering is suspected. One type of tampering involves bombarding the device with a number of false configuration attempts in order to decipher encrypted data. By utilizing a dirty bit and a sticky error counter, the device can keep track of the number of failed configuration attempts that have occurred and initiate anti-tampering operations when tampering is suspected while the device is still in the configuration stage of operation.

A programmable circuit includes a physical interface at an input output (IO) periphery of the programmable circuit. The programmable circuit also includes a partial reconfigurable (PR) module, at the IO periphery of the programmable circuit, to implement a sequencer unit operable to configure the physical interface during a first instance of the PR module, and a controller unit operable to translate commands to the physical interface during a second instance of the PR module.

A display device includes a display panel, a driving circuit board, and an electronic connector. The electronic connector connects the display panel and the driving circuit board. The driving circuit board is configured with a first wire, a second wire, a third wire, a fourth wire and a fifth wire arranged in order. The first wire, the second wire, the third wire and the fifth wire extend to the electronic connector and connect to the display panel. A first convergence point of the second wire and the third wire is located on the electronic connector, and a second convergence point of the fourth wire and the third wire is located on the driving circuit board. A detection method of the display device is also disclosed.

A method for implementing nonvolatile memory array logic includes configuring a crosspoint memory array in a first configuration and applying an input voltage to the crosspoint array in the first configuration to produce a setup voltage. The crosspoint array is configured in a second configuration and an input voltage is applied to the crosspoint array in the second configuration to produce a sense voltage. The setup voltage and the sense voltage compared to perform a logical operation on data stored in the crosspoint array. A system for performing nonvolatile memory array logic is also provided.

A fuel system includes an electronic control module (ECM), at least one injector coupled to the ECM, and a configurable output driver circuit coupled to the at least one injector. The configurable output driver circuit includes a channel that enables adaptation of ECM outputs. The configurable output driver circuit is configurable based on a value stored in a register circuit.