A compressor includes a logic circuit having transistors of a first channel type to receive a plurality of bit signals, and transistors of a second channel type, different from the first channel type, to receive the plurality of bit signals. The transistors of the first channel type are configured to generate an XOR logic output based on the plurality of bit signals, and the transistors of the second channel type are configured to generate, substantially simultaneous with the generation of the XOR logic output, an XNOR logic output based on the plurality of bit signals. The compressor includes NAND gates to receive multiplicand and multiplier bit signals.

An example apparatus comprises an array of memory cells coupled to sensing circuitry including a first sense amplifier, a second sense amplifier, and a logical operation component. The sensing circuitry may be controlled to sense, via first sense amplifier, a data value stored in a first memory cell of the array, sense, via a second sense amplifier, a data value stored in a second memory cell of the array, and operate the logical operation component to output a logical operation result based on the data value stored in the first sense amplifier and the data value stored in the second sense amplifier.

A 3D IC includes a substrate having a substrate surface, a first stack of semiconductor devices stacked along a thickness direction of the substrate, and a second stack of semiconductor devices stacked along the thickness direction of the substrate and provided adjacent to the first stack in a direction along the substrate surface. Each semiconductor device of the first and second stack includes a gate and a pair of source-drain regions provided on opposite sides of the respective gate, and each gate of the first and second stack is a split gate. A gate contact is physically connected to a first split gate of a first one of the semiconductor devices. The gate contact forms at least part of a local interconnect structure that electrically connects the first semiconductor device to a second semiconductor device in the 3D IC.

Memory circuit for implementing logic operations and provided with memory cells, in particular of structure 6T, with a control circuit configured to activate the first access transistors or the second access transistors of at least two cells of the same given column and for detecting from a low- or high-voltage power supply line, from said given column, separate from the bit lines, a signal representative of the result of a logic operation having for operands data stored in said at least two cells.

Logic gate designs (e.g., NAND, NOR, Inverter) for stacked VTFET designs are provided. In one aspect, a logic gate device is provided. The logic gate device includes: at least one top vertical transport field-effect transistor (VTFET1) sharing a fin with at least one bottom VTFET (VTFET2); a power rail connected to a power contact of the logic gate device; and a ground rail, adjacent to the power rail, connected to a ground contact of the logic gate device. A method of forming a logic gate device is also provided.

Disclosed is a three-port static random access memory (3P-SRAM) that performs XNOR operations. The cell has a write port and first and second read ports. Read operations are enabled through either the first read port using a first read wordline and a common read bitline or the second read port using a second read wordline and the common read bitline. Read wordline activation is controlled such that only one read wordline is activated (i.e., receives a read pulse) at a time. As a result, a read operation through either read port effectively accomplishes an XNOR operation. Also disclosed is a memory array, which incorporates such cells and which performs XNOR-bitcount-compare functions. Since XNOR-bitcount-compare functions are used in XNOR-NET type binary neural networks (BNNs), the memory array can be employed for implementing such a BNN designed for improved performance, scalability, and manufacturability. Also disclosed is an in-memory computing method.

Aspects of the disclosure are directed to a circuit. In accordance with one aspect, the circuit includes a first layer, wherein the first layer includes two-dimensional (2D) shapes; a second layer coupled adjacent to the first layer through at least one via hole, wherein the second layer includes only one-dimensional (1D) shapes; a shared drain terminal; and a source terminal termination.

Certain aspects of the present disclosure are directed to methods and apparatus for convolution computation. One example apparatus generally includes a static random-access memory (SRAM) having a plurality of memory cells. Each of the plurality of memory cells may include a flip-flop (FF) having an output node and a complementary output node; a first switch coupled between the output node and a bit line (BL) of the SRAM, the first switch having a control input coupled to a word line (WL) of the SRAM; and a second switch coupled between the complementary output node and a complementary bit line (BLB) of the SRAM, the second switch having another control input coupled to a complementary word line (WLB) of the SRAM.

A compressor includes a logic circuit having transistors of a first channel type to receive a plurality of bit signals, and transistors of a second channel type, different from the first channel type, to receive the plurality of bit signals. The transistors of the first channel type are configured to generate an XOR logic output based on the plurality of bit signals, and the transistors of the second channel type are configured to generate, substantially simultaneous with the generation of the XOR logic output, an XNOR logic output based on the plurality of bit signals. The compressor includes NAND gates to receive multiplicand and multiplier bit signals.

An example apparatus comprises an array of memory cells coupled to sensing circuitry including a first sense amplifier, a second sense amplifier, and a logical operation component. The sensing circuitry may be controlled to sense, via first sense amplifier, a data value stored in a first memory cell of the array, sense, via a second sense amplifier, a data value stored in a second memory cell of the array, and operate the logical operation component to output a logical operation result based on the data value stored in the first sense amplifier and the data value stored in the second sense amplifier.