Methods and systems 10 are provided for circuits. One method is for increasing device threshold voltage distribution of a plurality of devices of a circuit. The method includes adjusting a device threshold voltage of the plurality of devices by different amounts; and selecting a subset of the plurality of devices with adjusted device threshold voltage by a device selection module for performing a function associated with the circuit. In one aspect, a system for device threshold voltage adjustment is provided. The system includes a sensor module for sensing one or more of temperature and voltage values of a die having a plurality of devices for a circuit; and a threshold temperature and voltage compensation module for receiving an input value from the sensor module to compensate variation in a device threshold voltage caused by changes of one or more of temperature and voltage of the die.

A comparator circuit includes a first transistor configured to receive a first input and a second transistor configured to receive a second input. The comparator circuit further includes a third transistor coupled to a terminal of each of the first and second transistors. The third transistor is configured to be controlled by a first control signal. A gate of a fifth transistor is coupled to a terminal of a fourth transistor at a first node and a gate of the fourth transistor is coupled to a terminal of the fifth transistor at a second node. A sixth transistor is coupled between the first and fourth transistors. A seventh transistor is coupled between the second and fifth transistors. A gate of the sixth transistor and a gate of the seventh transistor are coupled together at a fixed voltage level.

This disclosure describes techniques to perform analog signal conditioning (including filtering and amplification) and analog-to-digital conversion (ADC) on a System-in-package (SIP) assembly technology. In particular, the disclosure combines a programmable gain amplifier (PGA), one or more filter circuits, and an ADC circuit onto the same SIP. These devices are coupled together on the SIP using high-accuracy and precise integrated-passive components. The SIP receives an analog signal, amplifies the analog signal with the PGA on the SIP, filters the amplified analog signal with the filter circuit(s) on the SIP, and then performs analog-to-digital conversion on the filtered amplified analog signal with the ADC circuit on the SIP. The SIP can be configured for various applications based on a variety of inputs and control mechanisms.

A comparator circuit includes a first transistor configured to receive a first input and a second transistor configured to receive a second input. The comparator circuit further includes a third transistor coupled to a terminal of each of the first and second transistors. The third transistor is configured to be controlled by a first control signal. A gate of a fifth transistor is coupled to a terminal of a fourth transistor at a first node and a gate of the fourth transistor is coupled to a terminal of the fifth transistor at a second node. A sixth transistor is coupled between the first and fourth transistors. A seventh transistor is coupled between the second and fifth transistors. A gate of the sixth transistor and a gate of the seventh transistor are coupled together at a fixed voltage level.

Methods and systems 10 are provided for circuits. One method is for increasing device threshold voltage distribution of a plurality of devices of a circuit. The method includes adjusting a device threshold voltage of the plurality of devices by different amounts; and selecting a subset of the plurality of devices with adjusted device threshold voltage by a device selection module for performing a function associated with the circuit. In one aspect, a system for device threshold voltage adjustment is provided. The system includes a sensor module for sensing one or more of temperature and voltage values of a die having a plurality of devices for a circuit; and a threshold temperature and voltage compensation module for receiving an input value from the sensor module to compensate variation in a device threshold voltage caused by changes of one or more of temperature and voltage of the die.

This disclosure describes techniques to perform analog signal conditioning (including filtering and amplification) and analog-to-digital conversion (ADC) on a System-in-package (SIP) assembly technology. In particular, the disclosure combines a programmable gain amplifier (PGA), one or more filter circuits, and an ADC circuit onto the same SIP. These devices are coupled together on the SIP using high-accuracy and precise integrated-passive components. The SIP receives an analog signal, amplifies the analog signal with the PGA on the SIP, filters the amplified analog signal with the filter circuit(s) on the SIP, and then performs analog-to-digital conversion on the filtered amplified analog signal with the ADC circuit on the SIP. The SIP can be configured for various applications based on a variety of inputs and control mechanisms.

An analog-to-digital converter (ADC) includes an input circuit configured to receive a first analog signal output from a first sensor or a second analog signal output from a second sensor according to an operation mode and a bit stream; a filter configured to filter an output signal from the input circuit; a quantization circuit configured to generate the bit stream from an output signal of the filter; and a digital circuit configured to generate a first digital signal corresponding to the first analog signal or a second digital signal corresponding to the second analog signal by filtering the bit stream, wherein the operation mode includes a first mode selecting the first sensor and a second mode selecting the second sensor, and wherein the digital circuit refers to the second digital signal generated during the second mode to generate the first digital signal during the first mode.

The present invention relates to telecommunication techniques and integrated circuit (IC) devices. In a specific embodiment, the present invention provides a laser deriver apparatus that includes a main DAC section and a mini DAC section. The main DAC section processes input signal received from a pre-driver array and generates an intermediate output signal. The mini DAC section provides a compensation signal to reduce distortion of the intermediate output signal. The intermediate output signal is coupled to output terminals through a cascode section and/or a T-coil section. There are other embodiments as well.

A voltage reference circuit includes a bandgap circuit and a temperature compensation circuit. The temperature compensation circuit includes a first trim circuit, a second trim circuit, and a resistive digital-to-analog converter. The resistive digital-to-analog converter is coupled to the first trim circuit, the second trim circuit, and the bandgap circuit. The resistive digital-to-analog converter is configured to generate a temperature compensation voltage, and to provide the temperature compensation voltage to the bandgap circuit.

An AD conversion apparatus includes an AD conversion unit; a reference voltage switching unit that is disposed between an output of a sensor and an analog input terminal of the AD conversion unit and is connectable to the output of the sensor and a plurality of reference voltage lines; and a control unit to control switching the reference voltage input to the AD conversion unit by connecting the reference voltage switching unit to one of the reference voltage lines and to the output of the sensor. An analog output value of the sensor is input to the analog input terminal of the AD conversion unit via the reference voltage switching unit and is converted into a digital value.