Embodiments of an analog-to-digital converter (ADC), resistive digital-to-analog converter (DAC) circuits, and methods of operating an ADC are disclosed. In an embodiment, an analog-to-digital converter includes a DAC unit configured to convert a digital code to a first voltage in response to an input voltage of the ADC, a comparator configured to compare the first voltage with a second voltage to generate a comparison output, and a logic circuit configured to generate the digital code, to control the DAC unit based on the comparison output, and to output the digital code as a digital output of the ADC. The DAC unit includes a capacitive DAC and multiple resistive DACs. Each of the resistive DACs is connected to the first voltage through a respective capacitor.

A digital-to-analog converter (DAC) device includes a current-steering DAC circuitry and a calibration circuitry. The current-steering DAC circuitry generates a first signal according to multiple least significant bits of an input signal, and generates a second signal according to multiple most significant bits of the input signal. The calibration circuitry performs a non-binary search algorithm to generate a calibration signal in response to a comparison result of the first signal and the second signal, in order to calibrate the current-steering DAC circuitry according to the calibration signal.

A digital-to-analog converter (DAC) device includes a current-steering DAC circuitry and a calibration circuitry. The current-steering DAC circuitry generates a first signal according to multiple least significant bits of an input signal, and generates a second signal according to multiple most significant bits of the input signal. The calibration circuitry performs a non-binary search algorithm to generate a calibration signal in response to a comparison result of the first signal and the second signal, in order to calibrate the current-steering DAC circuitry according to the calibration signal.

A symmetrical layout structure of a semiconductor device is formed on a chip. The symmetrical layout structure is performed in a (2.sup.M+1)(2.sup.M+1) array and comprises 2.sup.Mr working units and r dummy unit(s). Each working unit has 2.sup.2+M sub-working units continuously connected by a closed trace and arranged along the closed trace in the array, wherein M is a positive integer, and r is zero or a positive integer. Each closed trace forms a parallelogram that is symmetrical to a diagonal path of the array. The working unit can be a current cell. According to the layout structure, all parallelograms have the same centroid, the perimeters of all parallelograms are the same, the lengths of the closed traces are the same, and the distances between all of the sub-current cells are the same. The present invention thus improves the performance of the digital-to-analog converter.

An analog-to-digital converter (ADC) includes a digital-to-analog converter (DAC) having a resistor network. The resistor network includes a first and second segments. The first segment includes a first switch coupled between a first supply voltage node and a first set of resistors. The second segment includes a second switch coupled between the first supply voltage node and a second set of resistors. The first segment includes a third switch coupled in series with a second resistor. The series-combination of the third switch and second resistor coupled in parallel with at least one resistor of the first set of resistors. The second segment includes a fourth switch coupled in series with a third resistor. The series-combination of the fourth switch and third resistor is coupled in parallel with at least one resistor of the second set of resistors.

The present invention relates to telecommunication techniques and integrated circuit (IC) devices. In a specific embodiment, the present invention provides a laser deriver apparatus that includes a main DAC section and a mini DAC section. The main DAC section processes input signal received from a pre-driver array and generates an intermediate output signal. The mini DAC section provides a compensation signal to reduce distortion of the intermediate output signal. The intermediate output signal is coupled to output terminals through a cascode section and/or a T-coil section. There are other embodiments as well.

An imaging element according to a first aspect includes: a successive approximation resistor type analog-digital converter that converts an analog signal output from a pixel including a photoelectric conversion part into a digital signal, in which the successive approximation resistor type analog-digital converter has a preamplifier having a band limiting function. An imaging element according to a second aspect includes a DAC in which the successive approximation resistor type analog-digital converter uses a capacitance element to convert a digital value after AD conversion to an analog value, and sets the analog value to a comparison reference for comparison with an analog input voltage. Then, the DAC includes one of lower-bit capacitance elements including a plurality of capacitance elements, and after performing AD conversion for all bits, each of the plurality of capacitance elements is selectively applied with at least a first reference voltage to a fourth reference voltage, so that re-AD conversion is performed for lower bits.

The present disclosure relates to a capacitor array for an analog-to-digital converter, a successive approximation register analog-to-digital converter and a capacitor array board. The capacitor array includes a control logic generation circuit, a control code logic conversion circuit, a first sub-capacitor array and a second sub-capacitor array configured to form different regions of a high-order bit region and a low-order bit region. In the present disclosure, the capacitances of the second capacitor units are equal, so that the second capacitor units can be sequentially switched. Thus, no matter which bit in the second binary code changes, it will not cause a large number of the second capacitor units to switch together, thereby reducing conversion error. In addition, the capacitor array is divided in regions, which avoids the problem of a large number of parallel branches in case where only the second sub-capacitor array is arranged.

The present disclosure relates to an imaging element and a method for controlling an imaging element, an imaging apparatus, and an electronic apparatus that can reduce the size of the imaging element and can reduce power consumption. First, a gray code corresponding to a P-phase pixel signal of each pixel is converted into a binary code. Then, a difference between a binary code corresponding to the converted same bit and a binary code of the pixel signal in which all bits are 0 and which is latched in a temporary latch is continuously calculated and is latched as the binary code of the P-phase pixel signal in the temporary latch. Then, a gray code corresponding to a D-phase pixel signal of each pixel is converted into a binary code. Then, a difference between a binary code corresponding to the converted same bit and the binary code of P-phase the pixel signal which is latched in the temporary latch is continuously calculated. The present disclosure can be applied to an imaging apparatus.

An analog-to-digital converter includes a low voltage power supply rail, a high voltage power supply rail, successive approximation circuit, a level shifter, and a capacitive digital-to-analog converter (CDAC). The successive approximation circuitry is coupled to the low voltage power supply rail. The level shifter is coupled to the high voltage power supply rail and includes inputs coupled to first outputs of the successive approximation circuitry. The CDAC includes a first segment and a second segment. The first segment includes a first plurality of capacitors, and a first plurality of switches coupled to outputs of the level shifter. The second segment includes a second plurality of capacitors, and a second plurality of switches coupled to second outputs of the successive approximation circuitry.