H04B1/036

Thermal Management with Antenna Modules

A user equipment (UE) manages thermal levels of antenna modules with reference to a temperature threshold. The UE includes multiple antenna modules having a first antenna module and a second antenna module and at least one wireless transceiver coupled to the multiple antenna modules. The UE also includes a processor and memory system implementing an antenna module thermal manager. The manager is configured to obtain a first temperature indication corresponding to the first antenna module of the multiple antenna modules. The manager is also configured to perform a comparison of the first temperature indication to at least one temperature threshold. The manager is further configured to switch, based on the comparison, from using the first antenna module to using the second antenna module for wireless communication with the at least one wireless transceiver.

Thermal Management with Antenna Modules

A user equipment (UE) manages thermal levels of antenna modules with reference to a temperature threshold. The UE includes multiple antenna modules having a first antenna module and a second antenna module and at least one wireless transceiver coupled to the multiple antenna modules. The UE also includes a processor and memory system implementing an antenna module thermal manager. The manager is configured to obtain a first temperature indication corresponding to the first antenna module of the multiple antenna modules. The manager is also configured to perform a comparison of the first temperature indication to at least one temperature threshold. The manager is further configured to switch, based on the comparison, from using the first antenna module to using the second antenna module for wireless communication with the at least one wireless transceiver.

Modular monopole for wireless communications

A modular monopole for wireless communications includes: an antenna module having a floor, a ceiling and a side wall that form an antenna compartment, wherein at least one antenna resides within the antenna compartment; a radio module having a floor, a ceiling and a side wall that form a radio compartment, wherein at least one remote radio unit (RRU) resides within the radio compartment; and a base. The base, the radio module, and the antenna module are arranged in vertically stacked relationship, with the base below the radio module and the antenna module above the radio module.

Mobile terminal

The present invention relates to a mobile terminal comprising: a terminal body; a circuit board mounted inside the terminal body; an electronic device mounted on one surface of the circuit board; a shield can provided on the circuit board so as to surround the electronic device and shielding electromagnetic waves generated from the electronic device; a metal plate coupled to the shield can and made of a material having high thermal conductivity; and a heat pipe which is positioned to face the shield can with the metal plate interposed therebetween and has a flow path to accommodate a fluid at a center portion thereof, wherein the metal plate and the heat pipe are integrally formed, and heat generated in the electronic device can be transmitted to the heat pipe through the metal plate.

COOLING DEVICE, A RECEPTACLE ASSEMBLY, A SYSTEM AND A PRINTED BOARD ASSEMBLY

A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and at least one heat pipe that is in thermal contact with the heat sink, wherein the at least one heat pipe comprises a thermal contact area that is configured for thermal contact with a heat generating component, and the at least one heat pipe is configured in a shape that provides mechanical spring properties. Such a heat generating component may comprise a pluggable module. Also disclosed is a receptacle assembly comprising a frame having an interior cavity configured for accommodating a heat generating component and having an opening for receiving the heat generating component, characterized in that it comprises a cooling device. Disclosed is also a system comprising a receptacle assembly, and a printed board assembly (PBA) comprising a receptacle assembly.

Radio tray assemblies

Described herein are radio tray assemblies that include space for a specific radio and its power supply and that additionally provide cooling and power conversion and control functionalities. The disclosed radio tray assemblies are designed to have a form factor compatible with legacy radio systems (e.g., MIDS-LVT) while enabling installation of a new radio system (e.g., MIDS-JTRS). The disclosed radio tray assemblies are configured so that the radio and its power supply are secured to a tray so that the radio and power supply are side-by-side and parallel lengthwise. A cooling module or assembly of the disclosed radio tray assemblies is disposed immediately behind the radio and its power supply and is configured to cool these units using forced air cooling directed lengthwise through the radio and its power supply. A power converter and controller module converts input power into the power required by the radio power supply.

Device thermal management

Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANICAL SYSTEM
20220259036 · 2022-08-18 ·

In one or more embodiments, an apparatus generally comprises a microelectromechanical system (MEMS) module comprising a plurality of air movement cells and a power unit operable to control the plurality of air movement cells, and a housing configured for slidably receiving the MEMS module and positioning the MEMS module adjacent to a heat generating component of a network device. The MEMS module is operable to dissipate heat from the heat generating component and is configured for online installation and removal during operation of the heat generating component.

Electronic device including radiation structure

An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.

Electronic device including radiation structure

An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.