Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The first substrate and the second substrate may be lattice-matched such that an interface region between the first substrate and the second substrate exhibits an sp3 carbon peak at about 1332 cm.Math..sup.1 having a full width half maximum of no more than 5.0 cm.Math..sup.1 as measured by Raman spectroscopy. In some aspects, the first substrate and said second substrate permit said chip to transmit or receive data at a transfer rate of at least 500 megabits per second and a frequency of at least 8 GHz. In some aspects, the RF amplifier chip is part of a satellite transmitter.

A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit.

The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

This present invention pertains to a method and apparatus to improve thermal transfer properties of a protective case for a mobile device such as a smartphone or tablet computer. The protective mobile device case is optimized for temperature regulation and heat transfer by integrating thermal interface materials into key regions of the protective case where heat transfer to or from heat sensitive components within a mobile device are located.

This present invention pertains to a method and apparatus to improve thermal transfer properties of a protective case for a mobile device such as a smartphone or tablet computer. The protective mobile device case is optimized for temperature regulation and heat transfer by integrating thermal interface materials into key regions of the protective case where heat transfer to or from heat sensitive components within a mobile device are located.

Described herein are radio tray assemblies that include space for a specific radio and its power supply and that additionally provide cooling and power conversion and control functionalities. The disclosed radio tray assemblies are designed to have a form factor compatible with legacy radio systems (e.g., MIDS-LVT) while enabling installation of a new radio system (e.g., MIDS-JTRS). The disclosed radio tray assemblies are configured so that the radio and its power supply are secured to a tray so that the radio and power supply are side-by-side and parallel lengthwise. A cooling module or assembly of the disclosed radio tray assemblies is disposed immediately behind the radio and its power supply and is configured to cool these units using forced air cooling directed lengthwise through the radio and its power supply. A power converter and controller module converts input power into the power required by the radio power supply.

Systems and methods for managing temperatures of wearable device components are disclosed. In one aspects, a method includes determining a temperature of an electronic component of the wearable device, determining a rate of temperature change of the electronic component, and determining whether to increase or decrease a transmission rate limit of the electronic component based on the temperature and the rate, adjusting the transmission rate limit based on the determination, and limiting a rate of transmission of the electronic component based on the adjusted transmission rate limit.

Systems and methods for managing temperatures of wearable device components are disclosed. In one aspects, a method includes determining a temperature of an electronic component of the wearable device, determining a rate of temperature change of the electronic component, and determining whether to increase or decrease a transmission rate limit of the electronic component based on the temperature and the rate, adjusting the transmission rate limit based on the determination, and limiting a rate of transmission of the electronic component based on the adjusted transmission rate limit.

An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This process forms both metal-to-metal and dielectric hydrogen bonds between bonding surfaces to seal the wafer stack. Each array core block includes an array of through substrate metal vias to distribute DC bias, LO and information signals. Each array core block also includes a cooling system including micro-channels formed on a backside of at least one of the chips in each bonded pair and through substrate via holes formed through the stack that operatively couple the micro-channels for all of the bonded pairs to receive and circulate a fluid through the micro-channels and through substrate via holes to cool the RFIC and MMIC Power Amplifier chips and to extract the heated fluid.

An wireless audio transceiver housing comprising an air inlet, an intake manifold, one or more fans, directing vanes, and an exhaust port, wherein the geometry of the intake manifold, the directing vanes, and the exhaust port are configured to enhance airflow from the one or more fans through the housing, over a heatsink, and out the exhaust port towards the rear of the housing by minimizing the pressure drop for the one or more fans and maximizing the potential for airflow through the unit.

An wireless audio transceiver housing comprising an air inlet, an intake manifold, one or more fans, directing vanes, and an exhaust port, wherein the geometry of the intake manifold, the directing vanes, and the exhaust port are configured to enhance airflow from the one or more fans through the housing, over a heatsink, and out the exhaust port towards the rear of the housing by minimizing the pressure drop for the one or more fans and maximizing the potential for airflow through the unit.