A wireless communication module includes a wireless module board, a frequency converter, an amplifier phase shifter, a band-pass filter, and a communication board, and a through-hole, which penetrates in a direction in which the wireless module board and the communication board are aligned, is formed at a portion of the communication board to which at least one of IC chips of the frequency converter and the amplifier phase shifter faces, and the band-pass filter is covered by the communication board.

A configuration adjustment method includes: determining, among businesses run by the terminal, a target business for which a heat generating speed is greater than a first preset speed, when a temperature of the terminal is higher than a preset temperature; sending information of the target business to a base station; reducing a wireless transmission configuration for the target business according to a received first adjustment command of the base station for the target business.

A system for cooling a mobile device within a vehicle is provided. The system includes mounting structure within the vehicle cabin, which can be a portion of the center console. The HVAC system of the vehicle provides forced air to the mobile device when the mobile device is mounted to the mounting structure. The system may include a supplemental passageway in which forced air will be provided toward a supplemental air outlet disposed adjacent the mounting structure. The mounting structure may include a movable flap that is biased to a closed position that blocks the flow of air out of the supplemental air outlet, and that moves to open the supplemental air outlet in response to mounting the mobile device. The mounting structure may include nubs on a base surface to space the device away from the base surface and allow air to flow around the mobile device.

A case for a mobile device includes a cover defining a cavity configured for receiving and holding the mobile device, the cover including a back panel and a window formed in the back panel; a male plug disposed in the second portion of the cover, extending into the cavity defined by the cover, and configured for insertion into a female socket of the mobile device, the male plug including first contacts configured for mating with contacts of the mobile device; and an accessory attachment coupleable to the cover and including a fan configured to be positioned over the window formed in the back panel of the cover to facilitate heat dissipation from the mobile device.

A vehicle wireless communication device includes: an electric wave transmission portion that has a function of transmitting an electric wave; an electric wave reception portion that has a function of receiving an electric wave; a positioning portion that has a positioning function; a temperature acquisition portion that acquires a temperature of the vehicle wireless communication device; and a function controller that represses multiple functions or restitutes a repressed function.

A module for multiple network pluggable optics is disclosed. The module includes a Printed Circuit Board (PCB); a faceplate connected to the PCB; a plurality of cage assemblies connected to the PCB, each cage assembly is configured to receive a pluggable optical module via a corresponding opening in the faceplate; and a shared heat exchanger that is integrally formed and substantially covers the plurality of cage assemblies, wherein the shared heat exchanger is configured to cool multiple pluggable optics in the plurality of cage assemblies.

A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.

In one or more embodiments, an apparatus generally comprises a microelectromechanical system (MEMS) module comprising a plurality of air movement cells and a power unit operable to control the plurality of air movement cells, and a housing configured for slidably receiving the MEMS module and positioning the MEMS module adjacent to a heat generating component of a network device. The MEMS module is operable to dissipate heat from the heat generating component and is configured for online installation and removal during operation of the heat generating component.

A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.

A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.