An example electronic device may include a switch configured to perform switching using at least two bias voltages input from a plurality of power suppliers as an input thereto and one of the two bias voltages as an output therefrom; and a first power amplifier which is included in at least one first transmission chain capable of selectively supporting the heterogeneous network among a plurality of transmission chains, and which is configured to amplify a radio frequency signal for transmission based on the bias voltage supplied from the switch.

A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

Embodiments of the present application provide a terminal calibration method, apparatus, device, and storage medium. The method includes: sending to a network device calibration capability information of a terminal device; receiving calibration configuration information which is determined by the network device based on the calibration capability information; and performing a calibration procedure according to the calibration configuration information.

The invention discloses a transmitter comprising a pulse encoder for creating pulses from the amplitude of an input signal to the transmitter, a compensation signal generator for cancelling quantization noise caused by the pulse encoder, a mixer or I/Q modulator for mixing an output of the pulse encoder with the phase of an input signal to the transmitter, said output of the pulse encoder comprising the amplitude of the complex input signal plus the quantization noise caused by the pulse encoder, and an amplifier for creating an output signal from the transmitter. In the transmitter, a control signal (C.sub.A) for controlling a function of the amplifier comprises an output signal from the compensation signal generator, and an input signal to the amplifier comprises an output from the mixer having been modulated to a desired frequency.

A digital frontend circuit for a radio frequency (RF) comprises a digital predistortion (DPD) block, a plurality of sub-sample delay elements, and a selection circuit. The DPD block for computing predistorted transmit signals according to a Volterra series approximation model. The DPD block has an input for receiving input samples at a first sample rate and an output for providing the predistorted transmit signals at the first sample rate. Each of the sub-sample delay elements provides a delay to an input sample as specified by the Volterra series approximation model, where each of the delays is based on a fraction of the first sample rate. The selection circuit selects one of the plurality of sub-sample delay elements in response to a selection signal from the digital predistortion block. The selection signal for selecting a delay as specified by the Volterra series approximation model.

A wireless transceiver. The transceiver includes: (i) a transmit signal path; (ii) a calibration path, comprising a conductor to connect a calibration tone into the transmit signal path; (iii) a receive signal path, comprising a first data signal path to process a first data and a second data signal path, different than the first data signal path, to process a second data; (iv) a first capacitive coupling to couple a response to the calibration tone from the transmit signal path to the first data signal path; and (v) a second capacitive coupling to couple a response to the calibration tone from the transmit signal path to the second data signal path.

Apparatus and methods for power amplifier bias modulation for low bandwidth envelope tracking are provided herein. In certain embodiments, a power amplifier system for a mobile device includes a power amplifier that amplifies an RF signal and a low bandwidth envelope tracker that generates a power amplifier supply voltage for the power amplifier based on an envelope of the RF signal. The envelope tracking system further includes a bias modulation circuit that modulates a bias signal of the power amplifier based on a voltage level of the power amplifier supply voltage.

A radio frequency circuit is described, which comprises a first power amplifier comprising a first output, a second power amplifier comprising a second output, a third power amplifier comprising a third output, and a fourth power amplifier comprising a fourth output. The first power amplifier, the second power amplifier, the third power amplifier and the fourth power amplifier are configured to perform an amplification based on a radio communication signal to produce a first amplifier output signal, a second amplifier output signal, a third amplifier output signal, and a fourth amplifier output signal. Furthermore, the present application also relates to a transmitter comprising such a radio frequency amplifier circuit.

A package or a chip including a linear amplifier and a power amplifier is provided, wherein the linear amplifier is configured to receive an envelope tracking signal to generate an amplified envelope tracking signal, the power amplifier is supplied by an envelope tracking supply voltage comprising a DC supply voltage and the amplified envelope tracking signal, and the power amplifier is configured to receive an input signal to generate an output signal.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.