A radio-frequency module includes power amplifiers on a major surface of a module substrate, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band A, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band C, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band E, a resin member covering the major surface, a metal shield layer covering a surface of the resin member, and a metal shield plate on the major surface between the power amplifier and the power amplifier and also between the power amplifier and the power amplifier. The metal shield plate is in contact with a first ground electrode at the major surface and also with the metal shield layer.

A front-end module, compatible with various baseband chipset configurations, that includes a transmit signal path having a transmit amplifier, to amplify an outgoing signal, and a coupler. The coupler diverts a first portion of the outgoing signal, to a transmit-receive switch, a second portion to a receive path switch, and a third portion to a RF-coupling port. As included is a receive signal path including a low-noise amplifier, configured to receive an incoming signal, and a receive path switch. The receive path switch receives the incoming signal, from the transmit-receive switch, and the second portion of the outgoing signal from the coupler. The receive signal path also includes a receive port configured to selectively receive, through the receive path switch, incoming signals from an antenna and the second portion of the outgoing signal. A RF coupling port connects to the coupler to receive the third portion of the outgoing signal.

Power amplification system with variable supply voltage. A power amplification system can include a power amplifier and a boost converter configured to provide a supply voltage to the power amplifier. The power amplification system can include a control system configured to provide a boost converter control signal to the boost converter to adjust the supply voltage based on a parameter associated with the power amplifier.

The behavioral model and predistorter for modeling and reducing nonlinear effects in power amplifiers addresses the model size estimation problem. The GMP model is replaced by the hybrid memory polynomial/envelope memory polynomial (HMEM) model within a twin nonlinear two-box structure to reduce the number of variables involved in the model size estimation problem, without compromising model accuracy and digital predistorter performance. A sequential approach is presented to efficiently estimate the model size. Experimental validation is carried out to evaluate the performance of the size estimation and the accuracy of the HMEM-based twin-nonlinear two-box model with respect to that of the GMP-based twin-nonlinear two-box model.

A radio-frequency module includes a module substrate; a power amplifier; a first switch connected to an input terminal of the power amplifier; a second switch connected to an output terminal of the power amplifier; and a switch control circuit that controls the first switch and the second switch. The first switch, the second switch, and the switch control circuit are included in a semiconductor IC being integrated into a single chip. The power amplifier and the semiconductor IC are mounted on or above the module substrate. When the module substrate is viewed in a plan view, in the semiconductor IC, the switch control circuit is disposed between the first switch and the second switch.

A radio-frequency module includes an integrated circuit (IC) device and an external inductor provided outside the IC device. The IC device includes a plurality of low-noise amplifiers/one or more inductors/and a switching circuit. The plurality of low-noise amplifiers includes a plurality of transistors in one to one correspondence. The one or more inductors are coupled to one or more of the plurality of transistors. Each inductor is coupled to the emitter or source of a corresponding one of the plurality of transistors. The switching circuit is coupled between the emitter or source of each of the plurality of transistors and the external inductor. The external inductor is coupled between the switching circuit and ground in series with each of the one or more inductors via the switching circuit.

Signals are received that include a channel band and an adjacent band. The channel band is demodulated to obtain recovered symbols. Cross-correlation between the recovered symbols and the adjacent band is estimated. Adjacent channel interference is estimated, using the estimated cross-correlation of the recovered symbols and the adjacent band. Upon the estimated adjacent channel interference meeting a condition, a back-off command is sent to a transmitter power amplifier.

In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.

The present invention relates inter alia to a transmitter arrangement (1), in particular for radio communication, comprising at least two antenna elements (31, 32), spaced apart by a defined distance and a differential output amplifier (20) with a first output (21) coupled to a first (31) of the at least two antenna elements (31, 32) and with a second inverted output (22) coupled to a second (32) of the at least two antenna elements (31, 32). A first transmission line element (50) is arranged between at least one of the first and second outputs (21, 22) and the respective one of the at least two antenna elements (31, 32) and is configured such that signals applied to respective input taps (310, 320) of the at least two antenna elements (31, 32) are substantially in-phase with each other.