A radio-frequency module includes a module substrate having a first major surface and a second major surface, a receive filter, a low-noise amplifier, an antenna switch, a first matching circuit disposed on the input side of the receive filter, a second matching circuit disposed on the output side of the receive filter, and a control circuit. The receive filter and the first and second matching circuits are arranged at the first major surface. The low-noise amplifier, the antenna switch, and the control circuit are arranged at the second major surface. When the module substrate is viewed in plan view, the receive filter is positioned between the first and second matching circuits, the control circuit is positioned between the antenna switch and the low-noise amplifier, and respective footprints of the second matching circuit and the low-noise amplifier coincide with each other.

A wideband transmission circuit is provided. The wideband transmission circuit includes a transceiver circuit and a power amplifier circuit(s). The transceiver circuit generates a radio frequency (RF) signal(s) from a time-variant input vector and provides the RF signal(s) to the power amplifier circuit(s). The power amplifier circuit(s) amplifies the RF signal(s) based on a modulated voltage and provides the amplified RF signal(s) to a coupled RF front-end circuit (e.g., filter/multiplexer circuit). In embodiments disclosed herein, the transceiver circuit is configured to apply an equalization filter to the time-variant input vector to thereby compensate for a voltage distortion filter caused by a coupling of the power amplifier circuit(s) and the RF front-end circuit. As a result, it is possible to reduce undesired instantaneous excessive compression and/or spectrum regrowth resulting from the voltage distortion filter to thereby improve efficiency and linearity of the power amplifier circuit(s).

Envelope tracking (ET) voltage correction in a transmission circuit is provided. The transmission circuit includes a transceiver circuit and a power amplifier circuit(s). The transceiver circuit generates a radio frequency (RF) signal(s) from a time-variant modulation vector and the power amplifier circuit(s) amplifies the RF signal(s) based on a modulated voltage and provides the amplified RF signal(s) to a coupled RF front-end circuit. Herein, the transceiver circuit is configured to apply an equalization filter to a selected form of the time-variant modulation vector to compensate for a voltage distortion filter created across a modulation bandwidth of the RF signal(s) by coupling the power amplifier circuit with the RF front-end circuit. As a result, it is possible to reduce undesired instantaneous excessive compression and/or spectrum regrowth resulting from the voltage distortion filter to thereby improve efficiency and linearity of the power amplifier circuit(s) across the modulation bandwidth of the RF signal(s).

In one embodiment, a multi-transceiver RF signal processing system comprises: a controller; a DPD core and CFR engine; and a plurality of transceiver paths comprising at least a first transceiver path for a first frequency block, and a second transceiver path for a second frequency block. The first frequency block is adjacent to the second frequency block. Signal processing outputs a stream of digital RF based on wireless RF signals received into the first and second transceiver paths. Signal processing inputs a first stream of digital RF and outputs a first digital RF signal corresponding to the first frequency block to the first transceiver path, and outputs a second digital RF signal corresponding to the second frequency block to the second transceiver path for wireless transmission via the at least one antenna. The DPD core applies a distortion that covers the first and second frequency blocks.

The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

Some embodiments herein describe a radio frequency power semiconductor device that include a first non-linear filter network for compensating for lower frequency noise of a power amplifier. The first non-linear filter network can include a plurality of infinite impulse response filters and corresponding corrective elements to correct for a non-linear portion of the power amplifier. The radio frequency power semiconductor device can further include a second non-linear filter network for compensating for broadband distortion. The second non-linear filter network can be connected in parallel to the first non-linear filter network. The broadband distortion can include digital predistortion and the narrowband distortion can include charge trapping effects. The first non-linear filter network can comprise Laguerre filters. The second non-linear filter network can comprise general memory polynomial filters.

A millimeter-wave phase array system may include massive heterodyne transceivers as its building elements. A transceiver of each element may include an IQ image rejection heterodyne transmitter and a receiver. Each transmitter may include a single DAC, a Tx I channel, and a Tx Q channel. Each receiver may include an Rx I channel, an Rx Q channel, and a single ADC. For Tx IQ image rejection calibration, amplitude and phase offsets are determined, using both the Tx I and Tx Q channels from a first element and using only one of the Rx I or Rx Q channel from a second element. The IQ channel imbalances are compensated using the offsets in analog domain. A similar procedure is used for Rx IQ image rejection calibration with alternated signal path enabling. A frequency response variation of an RF front end is detected with a single path Tx/Rx channel setup.

Examples described herein include methods, devices, and systems which may compensate input data for non-linear power amplifier noise to generate compensated input data. In compensating the noise, during an uplink transmission time interval (TTI), a switch path is activated to provide amplified input data to a receiver stage including a coefficient calculator. The coefficient calculator may calculate an error representative of the noise based partly on the input signal to be transmitted and a feedback signal to generate coefficient data associated with the power amplifier noise. The feedback signal is provided, after processing through the receiver, to a coefficient calculator. During an uplink TTI, the amplified input data may also be transmitted as the RF wireless transmission via an RF antenna. During a downlink TTI, the switch path may be deactivated and the receiver stage may receive an additional RF wireless transmission to be processed in the receiver stage.

An Analog-to-Digital Converter, ADC, system is provided. The ADC system comprises a plurality of ADC circuits and a first input for receiving a transmit signal of a transceiver. One ADC circuit of the plurality of ADC circuits is coupled to the first input and configured to provide first digital data based on the transmit signal. The ADC system further comprises a second input for receiving a receive signal of the transceiver. The other ADC circuits of the plurality of ADC circuits are coupled to the second input, wherein the other ADC circuits of the plurality of ADC circuits are time-interleaved and configured to provide second digital data based on the receive signal. Additionally, the ADC system comprises a first output configured to output digital feedback data based on the first digital data, and a second output configured to output digital receive data based on the second digital data.

A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.