A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.

An RF filter comprising a resonator element and a polymer composition is provided. The polymer composition contains an aromatic polymer and has a melting temperature of about 240 C. or more. The polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz.

Various embodiments relate to a method for calibration of a center frequency of a BPF in an FSK transceiver, the method including the steps of filtering a carrier frequency signal by the BPF to produce a filtered signal, detecting, by a phase-frequency detector (PFD), a difference in phase between the carrier frequency signal and the filtered signal from the BPF, sweeping a calibration code of the BPF, detecting a transition in the sign of the phase difference and capturing a calibration code associated with the transition in the sign of the phase difference for calibration of the BPF.

A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.

An RF module includes a switch IC on a surface of a module substrate and a passive circuit provided in and/or on the module substrate. The switch IC includes a high-frequency circuit on an IC substrate and a digital control circuit. In a plan view of the IC substrate, the digital control circuit is surrounded by the high-frequency circuit. The high-frequency circuit includes analog ground electrodes in a boundary portion with the digital control circuit in the high-frequency circuit to surround the digital control circuit in the plan view.

Radio frequency (RF) filtering devices, and particularly compensation structures for RF filtering devices are disclosed. Representative RF filtering devices are described that include compensation structures configured to adjust, reduce, or cancel leakage signals within the RF filtering devices, thereby providing improved isolation. Compensation structures may include surface acoustic wave (SAW) devices having multiple interdigital transducers (IDT) that are longitudinally coupled between two reflective structures. Different IDTs of a SAW device may be electrically connected to an RF filtering device, and at least one IDT of the SAW device may comprise an electrically floating electrode that provides the ability to further tune acoustic waves. Depending on the application, the compensation structure may be electrically connected to different portions of the RF filtering device. In certain embodiments, the RF filtering device is an RF duplexing device.

An RF module includes a switch IC on a surface of a module substrate and a passive circuit provided in and/or on the module substrate. The switch IC includes a high-frequency circuit on an IC substrate and a digital control circuit. In a plan view of the IC substrate, the digital control circuit is surrounded by the high-frequency circuit. The high-frequency circuit includes analog ground electrodes in a boundary portion with the digital control circuit in the high-frequency circuit to surround the digital control circuit in the plan view.

A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.

Example access network devices are described. One example access network device includes a signal processing apparatus. The signal processing apparatus includes a first power amplifier, a second power amplifier, a first filter, a second filter, and a combiner. The first filter filters a second signal obtained by the first power amplifier, to obtain a first sub-signal belonging to a first frequency band and a second sub-signal belonging to a second frequency band. The second filter filters a fourth signal obtained by the second power amplifier, to obtain n sub-signals including at least a third sub-signal belonging to a third frequency band. The combiner combines the first sub-signal and i sub-signals in the n sub-signals based on a preset condition, to obtain a first combined signal. The communication module sends the first combined signal by using a first port, and sends the second sub-signal by using a second port.

A system comprises an antenna, a port converting device, an information transmission device, a shield case, and a reference voltage end; wherein the antenna, the port converting device, and the information transmission device are connected sequentially, and the information transmission device is disposed within the shield case, and both the shield case and the port converting device is connected with the reference voltage end; the antenna is configured for a conversion between a radio frequency signal and a single-ended signal; the port converting device is configured for a conversion between the single-ended signal and target differential mode signals; the information transmission device is configured to transmit and process the target differential mode signals; and parameters of components in the port converting device is determined according to a preset communication frequency and a voltage amplitude and phase of a differential mode signal.