Patent classifications
H04B1/50
FILTER DEVICE AND COMMUNICATION APPARATUS
A filter device includes a port, a reference potential part, at least one filter, a signal line, a first inductor, and at least one second inductor. A signal is input through the port, and/or a signal is output through the port. The reference potential part is placed at a reference potential. The at least one filter filters a signal. The signal line connects the port to the at least one filter. The first inductor is at least part of the signal line. The second inductor forms a connection between the signal line and the reference potential part. The first inductor and the at least one second inductor are inductively coupled to each other.
ANTENNA MODULE PERFORMING INTER-BAND CARRIER AGGREGATION AND ELECTRONIC DEVICE INCLUDING THE SAME
According to various embodiments, an electronic device is provided. The electronic device includes at least one communication processor, an intermediate frequency integrated circuit (IFIC) configured to output at least one of a first intermediate frequency (IF) signal corresponding to a first polarization characteristic and a second IF signal corresponding to a second polarization characteristic, based on a baseband signal generated from the at least one communication processor, a radio frequency integrated circuit (RFIC) configured to control at least one antenna element to generate a radio frequency (RF) signal, based on at least one of the first IF signal or the second IF signal, and an antenna array including at least one antenna element configured to generate and transmit the RF signal. The RFIC may include a first diplexer configured to receive the first IF signal and a second diplexer configured to receive the second IF signal.
Radio frequency module and communication device
A radio frequency module includes a transmit filter of Band A and Band B, a transmit amplifier, and a switch circuit and can perform CA using a transmit signal of Band A and a receive signal of Band B, a transmit band of Band B including a receive band of Band C. The switch circuit includes a switch switching connection between a common terminal and a first selection terminal, a switch switching connection between the common terminal and a second selection terminal, and a switch switching connection between the second selection terminal and a third selection terminal. The common terminal is connected to the transmit amplifier. The first selection terminal is connected to the transmit filter of Band A. The second selection terminal is connected to the transmit filter of Band B. The third selection terminal is connected to a receive path of Band C.
REDUCING IMPEDANCE MATCHING COMPONENTS IN FRONT END ARCHITECTURES FOR MULTI-BAND TRANSMIT AND RECEIVE FUNCTIONS
Front end architectures are described that tailor duplexer characteristics to enable the removal of many of the impedance matching components typically included in a receive signal path between an antenna and receive amplifiers and in a transmit signal path between transmit amplifiers and the antenna. By tailoring duplexer characteristics, targeted impedance matching can be achieved for front end architectures. This enables the front-end architecture to impedance match without including typical impedance matching components along a signal path between the antenna and an amplifier. This can be implemented on the transmit signal path (e.g., between a power amplifier (PA) and the antenna), on the receive signal path (e.g., between the antenna and a low noise amplifier (LNA)), or both the transmit signal path and the receive signal path. Thus, the disclosed front end architectures are configured to reduce or eliminate the number of components required for impedance matching.
REDUCING IMPEDANCE MATCHING COMPONENTS IN FRONT END ARCHITECTURES FOR MULTI-BAND TRANSMIT AND RECEIVE FUNCTIONS
Front end architectures are described that tailor duplexer characteristics to enable the removal of many of the impedance matching components typically included in a receive signal path between an antenna and receive amplifiers and in a transmit signal path between transmit amplifiers and the antenna. By tailoring duplexer characteristics, targeted impedance matching can be achieved for front end architectures. This enables the front-end architecture to impedance match without including typical impedance matching components along a signal path between the antenna and an amplifier. This can be implemented on the transmit signal path (e.g., between a power amplifier (PA) and the antenna), on the receive signal path (e.g., between the antenna and a low noise amplifier (LNA)), or both the transmit signal path and the receive signal path. Thus, the disclosed front end architectures are configured to reduce or eliminate the number of components required for impedance matching.
MODULAR MICROWAVE TRANSMISSION SYSTEM WITH AUTOMATIC CONFIGURATION
A wireless transmission system comprising a main circuit board having a first controller and a first connector assembly associated therewith; a removable and replaceable radio frequency module for transmitting and receiving wireless data, wherein the radio frequency module includes a second controller, a first module connector assembly, and a second connector assembly that is configured to couple to the first connector assembly; a removable and replaceable diplexer module for sending and receiving the wireless data at different frequencies, wherein the diplexer module includes a storage element, a first waveguide port connector, and a second module connector assembly that is configured to couple to the first module connector assembly; and a transition waveguide module having a second waveguide port connector that is configured to couple to the first waveguide port connector.
METHOD OF SYNCHRONIZING THE H AND V PHASE IN A DUAL-POLARIZED PHASED ARRAY SYSTEM
A communication device, including a plurality of transceiver modules; a storage configured to store calibration information; and at least one processor configured to: generate a first dual-polarized RF signal by controlling a first transceiver module to generate a first RF signal based on the calibration information; measure, by a second transceiver module, a first signal power of the first dual-polarized RF signal; adjust a parameter of the first transceiver module, and generate a second dual-polarized RF signal by controlling the first transceiver module to generate a second RF signal based on the adjusted parameter; measure, by the second transceiver module, a second signal power of the second dual-polarized RF signal; and generate an aligned dual-polarized RF signal by controlling the plurality of transceiver modules to generate a plurality of RF signals based on a result of a comparison between the first signal power and the second signal power.
METHOD OF SYNCHRONIZING THE H AND V PHASE IN A DUAL-POLARIZED PHASED ARRAY SYSTEM
A communication device, including a plurality of transceiver modules; a storage configured to store calibration information; and at least one processor configured to: generate a first dual-polarized RF signal by controlling a first transceiver module to generate a first RF signal based on the calibration information; measure, by a second transceiver module, a first signal power of the first dual-polarized RF signal; adjust a parameter of the first transceiver module, and generate a second dual-polarized RF signal by controlling the first transceiver module to generate a second RF signal based on the adjusted parameter; measure, by the second transceiver module, a second signal power of the second dual-polarized RF signal; and generate an aligned dual-polarized RF signal by controlling the plurality of transceiver modules to generate a plurality of RF signals based on a result of a comparison between the first signal power and the second signal power.
PACKAGE FOR A SEMICONDUCTOR DEVICE
Disclosed is a package for a semiconductor device including a semiconductor die. The package includes a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess in its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.
METHOD FOR APPLYING MSD AND APPARATUS THEREOF
A disclosure of this specification provides a device configured to operate in a wireless system, the device comprising: a transceiver configured with an Evolved Universal Terrestrial Radio Access (E-UTRA)-New Radio (NR) Dual Connectivity (EN-DC), wherein the EN-DC is configured to use three bands, a processor operably connectable to the transceiver, wherein the processer is configured to: control the transceiver to receive a downlink signal, control the transceiver to transmit an uplink signal via at least two bands among the three bands, wherein a value of Maximum Sensitivity Degradation (MSD) is applied to a reference sensitivity for receiving the downlink signal