The present invention relates to a dual GPON Small Form-Factor Pluggable optical module, projected to provide connection to two SC optical fiber connectors, and to be incorporated in any state of the art SFP transceiver host to allow double GPON-OLT channels. The module comprises a case housing a specific set of technical elements such as bidirectional optical subassemblies, high-speed electrical interface, and all the necessary electronic circuits, printed circuit board and flex-printed circuit board to ensure proper assembly and electronic performance of all elements.--

Disclosed in a communication device including a light source over a substrate and a liquid crystal element over the light source. The light source includes first to third light-emitting elements and first to third light-guide plates. The first light-emitting element is configured to emit first light. The second light-emitting element is configured to emit second light different in wavelength from the first light. The third light-emitting element is configured to emit third light different in wavelength from the first light and the second light. The first to third light-guide plates are arranged in a stripe shape and is configured so that the first light to the third light are respectively incident thereon. The liquid crystal element overlaps the first to third light-guide plates. The liquid crystal element is configured to independently control irradiation regions of the first to third lights incident through the first to third light-guide plates.

A method for transmitting data carrying optical information over an optical channel, comprising the steps of providing an optical transmitter consisting of a light source being a Mode-Locked Optical Frequency Comb (MLFC) for generating a frequency comb of multiple carriers, each of which being modulated by a baseband signal; an optical modulator for modulating each and all of the multiple carriers in a modulation bandwidth extending up to the modes' frequency spacing between the multiple carriers; performing all-optical encoding of the modulated carriers by manipulating the optical amplitude and/or phase and/or polarization of all optically modulated carriers; and transmitting, by the optical transmitter, the encoded modulated carriers to an optical receiver, over an optical channel.

A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the light emitting unit is provided outside the encapsulation structure. The optical transmission component is optically coupled with the thin film LiNbOx modulator.

A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.

A first optical transceiver outputs a first optical signal while switching the wavelength of the first optical signal to an optical fiber that acts as a medium for carrying single-fiber bi-directional communication between the first optical transceiver and an opposing second optical transceiver. When the wavelength of the first optical signal is switched to a receivable wavelength, the second optical transceiver identifies the wavelength of the received first optical signal, and outputs the second optical signal having a wavelength determined on the basis of the identification result to the optical fiber. When the first optical transceiver receives the second optical signal from the optical fiber, the first optical transceiver stops switching the wavelength of the first optical signal.

A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the light emitting unit is provided outside the encapsulation structure. The optical transmission component is optically coupled with the thin film LiNbOx modulator.

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

Methods, systems, and devices for network communications to reduce optical beat interference (OBI) in upstream communications are described. For example, a fiber node may provide a seed source to injection lock upstream laser diodes. Therefore, upstream communications from each injection locked laser diode may primarily include the wavelength associated with each seed source. The seed sources may be unique to each end device and configured to minimize OBI. That is, the upstream laser diodes may be generic, but the collected seed source may enable upstream communications at varying wavelengths. The end device may provide upstream communications by externally modulating a signal generated by the injection locked laser diode.

A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.