An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device; a photodiode configured to detect laser energy received across the air gap from the separate device; and logic circuitry configured to initiate recurrent transmission of a laser pulse by the laser emitter; and end the recurrent transmission in response to detecting laser energy received by the photodiode from the separate device.

A display panel, a display device and a signal transmission device are provided. The display panel includes: an array substrate; an opposed substrate arranged opposite to the array substrate; a circuit board, disposed on a side of the array substrate away from the opposed substrate; a driving circuit, disposed on a side of the array substrate close to the opposed substrate; a light emitter, disposed on a side of the circuit board close to the array substrate and electrically connected with the circuit board, in which the light emitter includes a light emitting surface which faces the array substrate; and a light receiver, disposed on a side of the array substrate close to the opposed substrate and electrically connected with the driving circuit, in which the light receiver includes a light receiving surface which faces the light emitter.

A Multi-Chip Module (MCM) includes a substrate and a switch controller on the substrate. An optical module on the substrate includes at least one optical crosspoint switch for selectively routing optical signals received by the optical module out of the MCM without the MCM converting the optical signals into electrical signals for processing data from the optical signals by the switch controller. According to another aspect, at least one memory on the substrate is electrically connected to the switch controller by a parallel bus. In another aspect, the MCM includes a plurality of input optical paths for receiving optical signals from outside the MCM, a plurality of output optical paths for transmitting optical signals from the MCM, and a plurality of optical crosspoint switches each connecting an input optical path to an output optical path to selectively route optical signals.

A method for connecting nodes in a datacenter includes installing a first network node in a datacenter adjacent to at least a second network node. A wireless communication link is automatically established between the first network node and the second network node. A network is configured with the first network node, the second network node, and a third network node.

In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

A textile capable of detecting electromagnetic radiation includes interlaced fibers; a photodetector embedded, as a result of a fiber draw process, within a particular one of the fibers; and a first electrical conductor extending within the particular fiber and along a longitudinal axis thereof. The first electrical conductor is in electrical contact with the photodetector, and the photodetector position in the particular fiber corresponds to a lowest energy configuration relative to a pattern of flow along the longitudinal axis of the particular fiber throughout the fiber draw process. A method of manufacturing the textile and a system including the textile are also disclosed.

A hybrid integrated circuit (HIC) with a high bandwidth, low-power, miniaturized, optically coupled data communication interface, the interface and an arrangement including the HIC. Active and passive components and integrated circuit (IC) chips may be mounted on an HIC substrate and collecting data. The HIC is smaller than one millimeter square and communicates data externally through a microLED (LED) array mounted on the HIC substrate and coupled to other HIC components. Each on LED consumes less than ten microwatts (10 W).

A Multi-Chip Module (MCM) includes a substrate and a switch controller on the substrate. An optical module on the substrate includes at least one optical crosspoint switch for selectively routing optical signals received by the optical module out of the MCM without the MCM buffering data from the optical signals or without converting the optical signals into electrical signals for processing data from the optical signals by the switch controller. According to another aspect, at least one memory on the substrate is connected to the switch controller by a parallel bus. In another aspect, the MCM includes a plurality of input optical paths for receiving optical signals from outside the MCM, a plurality of output optical paths for transmitting optical signals from the MCM, and a plurality of optical crosspoint switches each connecting an input optical path to an output optical path to selectively route optical signals.

Free-space coupler devices are disclosed. In one embodiment, a free-space coupler device comprises a waveguide structure including a waveguide grating, and an out-of-plane coupler separated from and in optical communication with the waveguide grating. The waveguide grating and the out-of-plane coupler are separated by a distance that will yield an optical resonance at a desired operating frequency or wavelength of an optical signal, thereby maximizing a diffraction power of the optical signal at the out-of-plane coupler while minimizing a reflection power of the optical signal at the out-of-plane coupler.

An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device; a mobile industry processor interface (MIPI); driver circuitry electrically coupled to the laser emitter, wherein the driver circuitry is configured to receive an electrical signal according to an MIPI protocol and drive the laser emitter according to the electrical signal; a tone circuit configured to generate a tone signal of a specified tone frequency; and an MIPI mode detection circuit electrically coupled to the driver circuitry and the MIPI, wherein the MIPI mode detection circuit is configured to detect a change between a MIPI low power (LP) mode and a MIPI high speed (HS) mode at the MIPI interface, and add the tone signal to an electrical signal provided to the driver circuitry from the MIPI according to the detected change.