Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.

An optical communications transmitter for use in free space communication from the transmitter to a receiver, the transmitter including a light input and an optical fiber array for directing the light input. The optical communications transmitter further includes an optical phased array for receiving the light input from the optical fiber array and transmitting a light output, the optical phased array being configured for modifying a relative phase of the light input such that the light output exhibits a predetermined far-field intensity pattern.

A Multi-Chip Module (MCM) includes a substrate and a switch controller on the substrate. An optical module on the substrate includes at least one optical crosspoint switch for selectively routing optical signals received by the optical module out of the MCM without the MCM buffering data from the optical signals or without converting the optical signals into electrical signals for processing data from the optical signals by the switch controller. According to another aspect, at least one memory on the substrate is connected to the switch controller by a parallel bus. In another aspect, the MCM includes a plurality of input optical paths for receiving optical signals from outside the MCM, a plurality of output optical paths for transmitting optical signals from the MCM, and a plurality of optical crosspoint switches each connecting an input optical path to an output optical path to selectively route optical signals.

An adapter for electrically connecting a laser diode to a circuit board is disclosed. An example laser diode may form part of an optical communications system in which the laser diode emits optical signals into an optical fiber cable based on electrical signals received from one or more source circuits. The laser diode is electrically connected to the source circuit(s) through a circuit board. A laser diode adapter is provided to facilitate electrically connecting, as well as mechanically coupling, the laser diode to the circuit board. In this regard, the laser diode adapter includes conductive pads for coupling to conductive legs of the laser diode. The laser diode adapter also includes a set of conductive signal pads for coupling to conductive receiving pads which are electrically connected to the conductive pads, thereby electrically connecting the conductive legs of the laser diode to the circuit board.

A coupling system includes a first connecting unit and a second connecting unit adapted to be connected to each other. Each of the first connecting unit and a second connecting unit includes an enclosure with a substantial even mating surface and a pair of lens module. Each lens module includes a lens enclosed within a magnet, and the magnets of the coupled lens modules have opposite magnet poles around the corresponding mating surfaces. The pair of lens modules are further equipped with a transmitting chip and a receiving chip in aligned with the corresponding lens, respectively.

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

This cyber-retro-reflector technology is a series of Architectures, representing staged deployments, including backward compatibility, of products with enhanced features, for integrating technologies and capabilities, of electronic and photonic systems to: (a) reduce power consumption for circuits and systems that are placed into off and/or disabled states, including external interface portals of electronic and photonic systems, (b) increase and enhance intra-/inter-connectivity, interoperability, and functionality of a system and the aggregate of systems, (c) increase and enhance integrated capabilities leading to higher computational performance for the system and the aggregate of systems, (d) take full advantage of photonic capabilities, and (e) improve hacking detection.

An integrated circuit optical interconnect for connecting a first circuit part arranged to output an optical signal and a second circuit part arranged to receive an optical signal. The integrated circuit optical interconnect comprises a body comprising a glass material. The glass material has embedded therein an optical waveguide arrangement having an input, located at a surface of the body, for coupling to the first circuit part, and an output, located at a surface of the body, for coupling to the second circuit part. The optical waveguide arrangement comprises at least two optical waveguide segments extending in different directions through the glass material and at least one reflecting part arranged between the two optical waveguide segments, for directing an optical signal from one of the optical waveguide segments to the other of the optical waveguide segments. The optical waveguide arrangement is arranged to optically couple the input and the output, whereby an optical signal can pass from the input to the output through the optical waveguide arrangement. There is also provided an integrated circuit module comprising the integrated circuit optical interconnect, and a telecommunications switch comprising the integrated circuit module. There is further provided a method for manufacturing an integrated circuit optical interconnect.

An optical interconnect computing module having free space optical interconnects that form communication links with other systems with like optical interconnects and with computer blades contained within the computing module. The computing module adapts to changes in the position and orientation and other factors of the optical interconnects. The optical interconnects utilize solid-state electronic and optoelectronic components and optical components. The ability to adapt is controlled by an algorithm implemented in software, firmware and logic circuits. Computing modules within an equipment rack and between equipment racks as well as blades contained within a computing module may experience changes in position and orientation due to installation misalignment, servicing of equipment, vibrations, floor sagging, thermal expansion and contraction, earthquakes, line-of-sight obstructions, manufacturing imperfections and other sources.

The disclosure provides a method for adjusting an optical link alignment of a first communication device with a remote device. The method includes transmitting or receiving an optical signal; receiving one or more measurements of at least one environmental factor at the first communication device or the remote device; and receiving or detecting an apparent amount of alignment of the optical signal. Then, by one or more processors of the first communication device, determining an estimated error attributable to optical cross coupling and an actual amount of alignment of the optical signal based on the apparent amount of alignment and the estimated error. Next, adjusting the first communication device based on the actual amount of alignment to correct for optical cross coupling.