Patent classifications
H04B10/803
COMPUTING DEVICE FOR HIGH SPEED OPTICAL DATA SWITCHING
Embodiments of a computing device and optical data switching circuitry are generally described herein. A processing element of the optical data switching circuitry may generate a plurality of optical data signals, and may send the optical data signals to an optical switch of the optical data switching circuitry. The optical switch may transmit the optical signals to a fiber optic router for relay to different destinations. The optical switch may switch between transmission directions for transmission of the optical signals to different receiving ports of the fiber optic router. The receiving ports of the fiber optic router may be mapped to the different destinations, in some cases.
High-speed optical transceiver
Provided is a high-speed optical transmission-reception apparatus including a digital-signal processing circuit and optical modulation and optical reception modules, in which a flexible printed circuit is used as a high-frequency interface for the optical modulation and optical reception modules, a mechanism for connecting the high-frequency line pattern to the flexible printed circuit is provided on a package substrate of the digital-signal processing circuit, and the package substrate and the optical modulation and optical reception modules are connected by the flexible printed circuit.
Communication system and method for ultra-flexible and ultra-reliable laser beam based wireless communication
A communication system that includes a master communication device at a first location in a defined indoor area, a service communication device at a second location in the defined indoor area, and passive optical routing devices at a plurality of locations in the defined indoor area. The master communication device obtains first signal from data source or modem and directs first laser beam carrying the first signal in a downstream path to the service communication device directly or via the plurality of passive optical routing devices. The master communication device receives Laser Beam Network Control instructions from a cloud server, and dynamically changes a laser beam-based communication route from the master communication device to the service communication device by changing a path of laser communication from first set of passive optical routing devices to second set of passive optical routing devices to reach to the service communication device.
Curved light guide structure, method of manufacturing same, and optical transmission system
A curved light guide structure configured to guide a spectral region, includes: end faces disposed at two ends of the ring segment structure; a first main side extending between the end faces and a second main side opposite the first main side and extending between the end faces; at least a first pass region on the first main side, the first pass region being configured to receive and let pass an optical signal within the spectral region, the curved light guide structure being configured to guide the optical signal along an axial direction between the end faces; and at least a second pass region on the second main side that is configured to let pass and to emit at least part of the optical signal from the curved light guide structure.
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Transceiver and interface for IC package
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
OPTICAL INTERCONNECTS USING MICROLEDS
MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.
Transceiver and interface for IC package
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
HYBRID TAG FOR RADIO FREQUENCY IDENTIFICATION SYSTEM
RFID (radio frequency identification) systems are provided in which tag and interrogator devices implement a hybrid framework for signaling including an optical transmitter/receiver system and an RF transmitter/receiver system. For instance, an RFID tag device includes: optical receiver circuitry configured to receive an optical signal having an embedded clock signal from an interrogator device, and convert the optical signal into an electrical signal comprising the embedded clock signal; clock extraction circuitry configured to extract the embedded clock signal from the electrical signal, and output the extracted clock signal as a clock signal for controlling clocking functions of the tag device; voltage regulator circuitry configured to generate a regulated supply voltage from the electrical signal, wherein the regulated supply voltage is utilized as a bias voltage for components of the tag device; and data transmitter circuitry configured to wirelessly transmit tag data to the interrogator device.
WIRELESS CONNECTORS
A wireless connector is disclosed that includes a first communication device configured to wirelessly transmit, by radiative coupling, a modulated signal including a carrier signal modulated with a digital signal. The wireless connector also includes a second communication device configured to receive the modulated signal. The first and second communication devices are coupled to one another through at least one wired connection that carries a signal used to demodulate the modulated signal.