The subject matter described herein relates to various antenna element configurations, antenna array configurations, their operations including various systems and methods to generate modulated data for transmission by an RF antenna array via an optical processing engine. The subject matter includes optical processing engine structure and methods (e.g., modulating in the optical domain, MIMO and spatial modulation via RF beam formation, coherent transmission of RF signal components, coherent operation of spatially separate RF antenna arrays) that may be implemented with the various RF antenna array structures. In some examples, the system combines the virtues of digital, analog and optical processing to arrive at a solution for scalable, non-blocking, simultaneous transmission to multiple UE-s. Much of the system architecture is independent of the RF carrier frequency, and different frequency bands can be accessed easily and rapidly by tuning the optical source (TOPS). In some examples, multiple communication channels may be transmitted simultaneously to different locations. The transmitter may be formed by an array of optically fed antennas.

Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.

An optocoupler is provided and which includes a side-emitting electromagnetic radiation source configured to emit electromagnetic radiation at a side wall, and an electromagnetic radiation detector configured to detect at least part of the emitted electromagnetic radiation.

An optical interconnect computing module having free space optical interconnects that form communication links with other systems with like optical interconnects and with computer blades contained within the computing module. The computing module adapts to changes in the position and orientation and other factors of the optical interconnects. The optical interconnects utilize solid-state electronic and optoelectronic components and optical components. The ability to adapt is controlled by an algorithm implemented in software, firmware and logic circuits. Computing modules within an equipment rack and between equipment racks as well as blades contained within a computing module may experience changes in position and orientation due to installation misalignment, servicing of equipment, vibrations, floor sagging, thermal expansion and contraction, earthquakes, line-of-sight obstructions, manufacturing imperfections and other sources.

Optical communication system communicates between an array of originating tiles and an array of terminating tiles. Each array is associated with a lenslet array, such as a two-layer array which has two layers of lenslets. Each originating tile has an array of transmitters and each terminating tile has an array of receivers. Each tile is associated with a common lenslet or lenslet pair. A beamlet from a representative transmitter passes through the lenslet pair adjacent to its tile to become a collimated beam whose angle is related to the location of the transmitter. The collimated beam passes through the receiver lenslet pair adjacent to the tile containing the receiver associated with the representative transmitter, and is focused onto that receiver by that lenslet pair. The system may operate in the reverse direction, wherein the transmitters are transmitter-receivers, the receivers are receiver-transmitters, and a beam from a receiver-transmitter is directed to its corresponding transmitter-receiver.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Systems and methods for performing signed matrix operations using a linear photonic processor are provided. The linear photonic processor is formed as an array of first amplitude modulators and second amplitude modulators, the first amplitude modulators configured to encode elements of a vector into first optical signals and the second amplitude modulators configured to encode a product between the vector elements and matrix elements into second optical signals. An apparatus may be used to implement a signed value of an output of the linear processor. The linear photonic processor may be configured to perform matrix-vector and/or matrix-matrix operations.

The current disclosure shows a fiber optic slip ring with through bore, or an off-axis fiber optic rotary joint to provide transmission of optic data between mechanically rotational interface with a through bore. Said fiber optic slip ring with through bore may include a ring assembly and a brush block assembly within a rotor and a stator. Said ring assembly may include a ring, a ring holder and a fiber. Said brush block assembly may include a fiber brush, a brush block, an optic index matching fluid, and shaft seals. Said ring may be a donut-shaped waveguide with flat surface on one side. Said fiber brush may have an angled-surface, which is fully contacted with said flat surface on said ring at any time so that during the rotation of said rotor, the optic signal can be transmitted between said fiber and said fiber brush in either direction.

A system includes a communication interface including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of: a laser emitter configured to transmit laser energy across an air gap to a separate device; or a photodiode configured to detect laser energy received across the air gap from the separate device.

An optical transmission/reception unit includes a carrier rotatable about a rotational axis, an optical receiver arranged at the carrier on the rotational axis to receive an optical reception signal from a first direction, an optical transmitter arranged adjacent to the optical receiver at the carrier to emit an optical transmission signal in a second direction, and a transmission/reception optic arranged at the carrier on the rotational axis above the optical receiver and extending across the optical receiver and the optical transmitter, wherein the transmission/reception optic includes a reception optic and a transmission optic arranged in the reception optic. The reception optic is configured to guide the optical reception signal incident on the transmission/reception optic towards the optical receiver on the rotational axis, and the transmission optic is arranged above the optical transmitter and is configured to shape the optical transmission signal emitted by the optical transmitter into an output beam.