In order to reduce the number of wires between blades, this blade device is provided with: a control blade for sending first information, which is at least one of control information for controlling a blade to be controlled and monitor information for monitoring the blade to be controlled, to the blade to be controlled by wireless communication; and the blade to be controlled which performs a process in accordance with the first information that has been received.

A Multi-Chip Module (MCM) includes a substrate and a switch controller on the substrate. An optical module on the substrate includes at least one optical crosspoint switch for selectively routing optical signals received by the optical module out of the MCM without the MCM converting the optical signals into electrical signals for processing data from the optical signals by the switch controller. According to another aspect, at least one memory on the substrate is electrically connected to the switch controller by a parallel bus. In another aspect, the MCM includes a plurality of input optical paths for receiving optical signals from outside the MCM, a plurality of output optical paths for transmitting optical signals from the MCM, and a plurality of optical crosspoint switches each connecting an input optical path to an output optical path to selectively route optical signals.

The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (A.sub.oC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (E.sub.oK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (S.sub.o) to be coupled in.

Some embodiments are provided for providing a wireless bridge to local devices on personal equipment systems. Personal equipment systems can include wireless communication systems that allow external systems, users, or both to communicate with and access data from local devices on the personal equipment systems. Personal equipment systems are provided having one or more local devices coupled thereto and in wired communication with one another. Personal equipment systems can include a wireless system and local devices attached to a headgear system, the local devices being in wired communication with one another and in wireless communication with external systems. The wireless communication system is configured to establish a wireless connection with external systems for communicating with and accessing local devices that are in wired communication with each other.

A system for optical data interconnect of a source and a sink includes a first HDMI compatible electrical connector able to receive electrical signals from the source. A first signal converter is connected to the first HDMI compatible electrical connector and includes electronics for conversion of TMDS or FRL electrical signals to optical signals, with the electronics including an optical conversion device. At least one optical fiber is connected to the first signal converter. A second signal converter is connected to the at least one optical fiber and includes electronics for conversion of optical signals to differential electrical signals. A power module for the second signal converter includes a power tap connected to TMDS or FRL circuitry and a first voltage regulator connected to the power tap to provide power to an electrical signal amplifier. A rechargeable battery module is used to trigger power activation of connected ports, with the battery module being connected to the power tap. A second HDMI compatible electrical connector is connected to the second signal converter and able to send signals to the sink.

A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.

An optical interconnect computing module having free space optical interconnects that form communication links with other systems with like optical interconnects and with computer blades contained within the computing module. The computing module adapts to changes in the position and orientation and other factors of the optical interconnects. The optical interconnects utilize solid-state electronic and optoelectronic components and optical components. The ability to adapt is controlled by an algorithm implemented in software, firmware and logic circuits. Computing modules within an equipment rack and between equipment racks as well as blades contained within a computing module may experience changes in position and orientation due to installation misalignment, servicing of equipment, vibrations, floor sagging, thermal expansion and contraction, earthquakes, line-of-sight obstructions, manufacturing imperfections and other sources.

In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

To optimize the efficiency and reliability of downhole data transmissions, an optical splash communication system may be utilized. A downhole tool may include an optical splash communication system that comprises multiple electrical elements where the electrical elements communicate with each other by transmitting and receiving via free space an optical splash signal through an inner space of the downhole tool. The electrical elements may comprise or be coupled to a light source and a detector. Multiple optical splash communication systems may be deployed in multiple downhole tools such that each downhole tool may communicate with another downhole tool via an opening, for example, a transparent sealed window, between the downhole tools. The opening is sufficient to permit transmissions to occur even when the downhole tools are rotated independently of each other.

An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device, and a driver circuit electrically coupled to the laser emitter and to an electrical interface. The driver circuit is configured to detect voltage levels at the electrical interface including a first voltage level, a second voltage level, and a third voltage level, and drive the laser emitter at a first power level when detecting the first voltage level, drive the laser emitter at a second power level when detecting the second voltage level, and drive the laser emitter at a third power level intermediate the first and second power levels when detecting the third voltage level.