Patent classifications
H04L25/0266
Signal isolator having at least one isolation island
Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.
TRANSMISSION DEVICE, INTERFACE, AND TRANSMISSION METHOD
In a transmission device connected by AC coupling, time taken before the start of transmission of valid data is shortened. The transmission device includes an internal resistor, an internal circuit, and a transmission-side control unit. One end of the internal resistor is connected to an output terminal connected to a capacitor. The internal circuit supplies one of a plurality of potentials different from each other to another end of the internal resistor. The transmission-side control unit performs control to supply one of the plurality of potentials to the internal circuit over a period from time when a potential of the output terminal is initialized to a predetermined initial value to timing when the potential of the output terminal reaches a predetermined specified value.
Rotary data coupler
Various examples are directed to a rotary coupler and methods of use thereof. The rotary data coupler may comprise a transmitter and receiver. The transmitter may comprise a first band and a second transmitter band. The receiver may comprise a receiver housing positioned to rotate relative to the first transmitter band and the second transmitter band. A first receiver band may be positioned opposite the first transmitter band to form a first capacitor and a second receiver band may be positioned opposite the second transmitter band to form a second capacitor. The receiver may also comprise a resistance electrically coupled between the first receiver band and the second receiver band and a differential amplifier. The differential amplifier may comprise an inverting input and a non-inverting input, with the non-inverting input electrically coupled to the first receiver band and the inverting input electrically coupled to the second receiver band.
Emission reduction device and method for reducing the emissions of a transceiver device for a serial bus system
An emission reduction device for a CAN bus system. The device includes an evaluation block for evaluating signals that are transferred differentially on two bus lines, the evaluation block being designed to form the sum voltage of the differentially transferred signals, and a comparison block for comparing the sum voltage in such a way that the difference between the sum voltage for a dominant bus state and the sum voltage for a recessive bus state has a predetermined minimum value, the recessive bus state being overwritable by a dominant bus state. For the comparison, the comparison block is designed to modify at least one property of the transceiver device via a setting in a block of the transceiver device until the difference between the sum voltage for a dominant bus state and the sum voltage for a recessive bus state has the predetermined minimum value.
Digital isolator
A digital isolator according to an embodiment includes a first electrode, a first insulating part, a second electrode, a second insulating part, and a first dielectric part. The first insulating part is located under the first electrode. The second electrode is located under the first insulating part. The second insulating part is located around the first electrode along a first plane perpendicular to a first direction. The first direction is from the second electrode toward the first electrode. The first dielectric part is located between the first electrode and the second insulating part in a second direction along the first plane. The first dielectric part contacts the first electrode. A relative dielectric constant of the first dielectric part is greater than a relative dielectric constant of the first insulating part.
Network communication system with bidirectional current modulation for transmitting data
A network communication system for a vehicle includes a communication bus, a first communication device, and a plurality of second communication devices which are connected to one another via the communication bus. The first communication device includes a bias voltage source for generating a constant bias voltage on the communication bus, the first communication device includes a current measurement apparatus for capturing the current on the communication bus, the network communication system includes a terminating resistor which is arranged in parallel with the plurality of second communication devices, the first communication device includes a first modulation apparatus for modulating a current set by the bias voltage and the terminating resistor on the communication bus, each second communication device includes a second voltage measurement apparatus for capturing a voltage at the terminating resistor and a second modulation apparatus for modulating the current set by the bias voltage and the terminating resistor.
Signal isolator having at least one isolation island
Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.
CAPACITIVELY COUPLED RESONATORS FOR HIGH FREQUENCY GALVANIC ISOLATORS
Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.
ELECTRONIC CIRCUITRY AND METHOD
According to one embodiment, electronic circuitry includes: transmitting circuitry to output a first waveform including N pulse waveforms (N is a natural number larger than 1) in response to an input signal; transfer circuitry to transfer the first waveform as a second waveform that includes at least N+1 pulse waveforms, via electromagnetic coupling; and receiving circuitry configured to receive the second waveform and determine the input signal based on the at least N+1 pulse waveforms.
LATERAL CORELESS TRANSFORMER
A multi-voltage domain device includes a semiconductor layer including a first voltage domain, a second voltage domain, and an isolation region that electrically isolates the first voltage domain and the second voltage domain in a lateral direction. The isolation region includes at least one deep trench isolation barrier. A layer stack is arranged on the semiconductor layer and includes a stack insulator layer, a first coil arranged in the stack insulator layer, and a second coil arranged in the stack insulator layer and laterally separated from the first coil in the lateral direction. The first and second coils are magnetically coupled to each other in the lateral direction. The first coil includes terminals arranged vertically over the first region and are electrically coupled to the first voltage domain, and the second coil includes terminals arranged vertically over the second region and are electrically coupled to the second voltage domain.