An isolator includes a first insulating portion, a first electrode provided in the first insulating portion, a second insulating portion provided on the first insulating portion and the first electrode, a third insulating portion provided on the second insulating portion, and a second electrode provided in the third insulating portion. The second insulating portion includes a plurality of first voids and a second void. The plurality of first voids are arranged in a first direction parallel to an interface between the first insulating portion and the second insulating portion. At least one of the first voids is provided under the second void.

Described examples include a hybrid circuit having a component. The component has a first conductive element on a substrate having a configuration and having a first periphery and having an extension at the first periphery. The component also has a dielectric on the first conductive element. The component also has a second conductive element having the configuration on the dielectric that is proximate to and aligned with the first conductive element, and has a second periphery, the extension of the first conductive element extending past the second periphery.

An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first and second metal layers and coupled to one of the first and second plates in a resonant circuit.

In some examples, a device includes a capacitor arranged across the galvanic isolation barrier, where the capacitor is configured to communicate a single-ended signal from a first voltage domain to a second voltage domain. The device also includes a high-pass filter arranged in the second voltage domain and configured to receive the single-ended signal from the capacitor. The device further includes a low-pass filter arranged in the second voltage domain and coupled between the high-pass filter and a low-impedance node. The high-pass filter is coupled between the capacitor, the low-pass filter, and the low-impedance node, and the low-pass filter is configured to generate a differential signal.

A communication device according to an embodiment includes an oscillator, a first signal generation circuit, a first insulation element, a first receiving circuit, and a first output circuit. The oscillator is configured to output a first carrier signal when at least one of a plurality of input signals that are externally input is at a first logic level. The first carrier signal and a first input signal among the input signals are input to the first signal generation circuit. The first signal generation circuit is configured to generate a first signal when the first input signal changes from a second logic level to the first logic level, output a first modulated signal based on the first signal, and thereafter output a second modulated signal based on the first carrier signal.

In an embodiment, a semiconductor device includes a galvanically isolated signal transfer coupler having a contact pad. The contact pad includes a metallic base layer, a metallic diffusion barrier layer arranged on the metallic base layer, and a metallic wire bondable layer arranged on the metallic diffusion barrier layer. The metallic diffusion barrier layer includes a first portion and a second portion. The first portion has a first surface and a second surface opposing the first surface. The first surface has a curved surface at the periphery. The first portion extends in a transverse plane and has a width. The second portion protrudes from the second surface intermediate the width of the first portion.

Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.

A capacitive digital isolator circuit includes: a signal emitting module; a signal receiving module; and a capacitive isolation module. The signal emitting module includes an edge Pulse-Coding modulator circuit, which modulates an input signal to generate a pair of differential modulated signals based on the input signal and transmits the pair of differential modulated signals to the signal receiving module. Each of the pair of differential modulated signals has twelve high-frequency pulses when the input signal has a rising edge and has six high-frequency pulses when the input signal has a falling edge. The signal receiving module includes an ultra-low power consumption high-speed comparator, a timer and a pulse counter. An output signal of the pulse counter has a rising edge when the pulse number of the comparator output signal is larger than nine and a falling edge when the pulse number is equal to or smaller than nine.

A PoDL system that uses a center-tapped transformer, for galvanic isolation of the PHY, has AC-coupling capacitors in series between the transmission wires and the transformer's secondary windings for blocking DC voltages generated by a PSE power supply. The center tap is conventionally connected to ground. As a result, one capacitor sees the full VPSE voltage across it, and the other capacitor sees approximately 0 V across it. Since the effective value of a ceramic capacitor significantly reduces with increasing DC bias voltages across it, the effective values of the capacitors will be very different, resulting in unbalanced data paths. This can lead to conversion of common mode noise and corrupt the data. To avoid this, a resistor divider is used to generate VPSE/2, and this voltage is applied to the center tap of the transformer. Therefore, the DC voltage across each capacitor is approximately VPSE/2, so their values remain equal.

According to one embodiment, a digital isolator includes a first metal portion, a first insulating portion, a second metal portion, a third metal portion, and a first layer. The first insulating portion is provided on the first metal portion. The second metal portion is provided on the first insulating portion. The third metal portion includes first, second, and third portions. The first portion is provided around the first metal portion in a direction perpendicular to a first direction. The second portion is provided on a portion of the first portion with a first conductive layer interposed. The third portion is provided on the second portion and provided around the second metal portion in the perpendicular direction. The first layer contacts the first conductive layer and an other portion of the first portion and is provided around a bottom portion of the second portion.