An electronic device is provided. The electronic device includes a housing which includes a mounting portion and an inner wall portion extending in a first direction with respect to the mounting portion, a printed circuit board which includes an outer wall portion that is parallel to the inner wall portion of the housing, a clip member including a clip portion which is arranged at a position adjacent to the outer wall portion of the printed circuit board to be electrically connected to the printed circuit board and which protrudes toward the inner wall portion, a protruding guide which is spaced apart from the clip portion in a second direction that is opposite to the first direction, and which protrudes from the outer wall portion of the printed circuit board toward the inner wall portion of the housing, and a guide recess formed in the inner wall portion of the housing.

According to various embodiments of the disclosure, an electronic device may comprise: a display, a first circuit board disposed under the display, at least one component disposed on one surface of the first circuit board, an interposer surrounding at least two sides of the at least one component and disposed on the first circuit board, and a second circuit board spaced apart from the first circuit board and including an area joined with the interposer. The interposer may include: a first interposer portion disposed along a first area of the first circuit board, a first end of the first interposer having at least a portion including a non-shielding area, and a second interposer portion disposed along a second area, adjacent to the first area, of the first circuit board, a second end of the second interposer facing the first end and having at least a portion including a non-shielding area.

An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

An electronic device includes a housing including a side wall having a first opening and a second opening provided at one side of the first opening; a tray configured to be inserted into or extracted from the housing through the first opening; and a waterproof member provided in the second opening and configured to reciprocate linearly, wherein the waterproof member includes: a pin member configured to linearly reciprocate within the second opening; and at least one waterproof ring protruding from an outer peripheral surface of the pin member and sealing a space between the outer peripheral surface of the pin member and an inner wall of the second opening, and wherein the second opening extends at an incline with respect to a direction in which the tray is inserted or extracted.

Electronic equipment allowed to endure repetitive severe environmental change in a sterilizing treatment using an autoclave is provided. A tablet terminal (electronic equipment) 106 includes: an enclosure 10; a substrate 30 arranged in an internal space of the enclosure 10; an electronic circuit component 40 mounted on the substrate 30; a (first) heat insulating layer 50 formed along the enclosure 10; and a (first) heat release mechanism 70 allowed to discharge heat from an internal space of the heat insulating layer 50 to outside of the enclosure 10.

An electronic device includes first and second housings, a flexible display, a hinge structure, a hinge cover, and a wireless communication circuit. The first housing includes a first conductive portion, the hinge cover may be positioned opposing the flexible display with respect to the hinge structure when the housings are in a folded state, and the second housing includes a second conductive portion. When the housing are folded, the hinge cover is exposed to the outside of the electronic device by a first width while being disposed between the first edge of the first housing and the second edge of the second housing, and in the folded state, the wireless communication circuit feeds a first point of the hinge cover and transmits and/or receives a signal in a first frequency band, through a first electrical path formed in the first conductive portion and/or the second conductive portion by the feeding.

A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.

A housing for a mobile computing device, the housing comprising: a first frame including a perimeter wall encircling a housing interior, the perimeter wall having a carrier surface facing outwards from the housing interior; an antenna having a radiating element affixed to the carrier surface and separated from the housing interior by the perimeter wall; and a second frame having (i) an inner surface facing towards the housing interior, and (ii) an outer surface defining an exterior surface of the mobile computing device, the second frame affixed to the first frame and encasing at least a portion of the radiating element between the carrier surface and the inner surface of the second frame.

An electronic device includes: a housing including a plate and a back plate facing a second surface of the plate and including a planar area facing a first direction, a display module including a display disposed on a first surface of the plate, a battery and a circuit board disposed on the second surface of the plate, a first flexible substrate extending from the display module, and a second flexible substrate extending from the circuit board to the first flexible substrate across the battery. The first flexible substrate includes a first connector, and the second flexible substrate includes a second connector. The first flexible substrate and the second flexible substrate are configured such that the first connector and the second connector are coupled in a second direction different from the first direction.