An image forming apparatus includes a plurality of light-emitting element array chips including a light-emitting element array and a transfer element array, and a control driver applying a signal to the plurality of light-emitting element array chips. The control driver includes a check terminal that measures signals output from the plurality of light-emitting element array chips, and the control driver determines whether any of the plurality of light-emitting element array chips are defective by analyzing the signals measured at the check terminal.

An image forming apparatus includes a plurality of light-emitting element array chips including a light-emitting element array and a transfer element array, and a control driver applying a signal to the plurality of light-emitting element array chips. The control driver includes a check terminal that measures signals output from the plurality of light-emitting element array chips, and the control driver determines whether any of the plurality of light-emitting element array chips are defective by analyzing the signals measured at the check terminal.

A lens array includes a flat plate-shaped base part, a plurality of lenses, a plurality of columnar light guiding parts and a plurality of light shielding parts. The lenses are formed on one surface of the base part. The columnar light guiding parts are formed on another surface of the base part at points corresponding to the lenses. The light shielding parts are formed at least on lateral surfaces of the light guiding parts.

A holding member 505 includes a first side wall portion 505a and a second side wall portion 505b, and a part of a surface 803b of a substrate 502 on a side opposite from a mounting surface 803 and a holding member 505 are fixed to each other by an adhesive. In the first side wall portion 505a, an inserting hole 801 opposing a corner portion 502 as of the substrate 502 in a widthwise direction of the substrate 502, and also, in the second side wall portion 505b, an inserting hole 801 opposing a corner portion 502bs of the substrate 502.

A scanning suspension box is disclosed, enabling the creation of a 3D model of an object. The box is a sealable enclosure for receiving the object to be scanned. A camera coupled to a surface of the enclosure images the object to generate a three-dimensional model of the object, which does not move once contained in the box.

A scanning suspension box is disclosed, enabling the creation of a 3D model of an object. The box is a sealable enclosure for receiving the object to be scanned. A camera coupled to a surface of the enclosure images the object to generate a three-dimensional model of the object, which does not move once contained in the box.

The lens unit includes a first lens array including a plurality of first lens elements each of which has a first optical axis and which are arranged in an arrangement direction perpendicular to the first optical axis. A second lens array includes a plurality of second lens elements each of which has a second optical axis and which are arranged in the arrangement direction while facing the first lens elements. The second lens array is in a positional relationship relative to the first lens array such that the second lens array is rotated about a virtual line perpendicular to both the first optical axis and the arrangement direction as the rotational axis by 180 degrees. The optical axes of the lens elements located at the substantially centers of the lens arrays in the arrangement direction are arranged to substantially coincide with each other.

A holding member includes a first opposing portion (first inner wall surface) and a second opposing portion (second inner wall surface) which oppose side wall surfaces of a lens array. Side wall surfaces of the lens array on opposite end sides with respect to a longitudinal direction of the lens array are exposed from opposite ends of the first opposing portion and opposite ends of the second opposing portion.

An exposure head includes a plurality of light emitting element array chips each having light emitting portions and a wire bonding pad. The plurality of light emitting element array chips are arranged in a staggered manner in a longitudinal direction of a printed-circuit board. One end portion of a first light emitting element array chip overlaps one end portion of a second light emitting element array chip when viewed in a width direction. Another end portion of the second light emitting element array chip overlaps one end portion of a third light emitting element array chip when viewed in the width direction. An adhesive for fixing the second light emitting element array chip to the printed-circuit board is applied in an area between the one end portion of the first light emitting element array chip and the one end portion of the third light emitting element array chip.

An exposure head includes a plurality of light emitting element array chips. A first distance from a first side which is one of two long sides of each of the plurality of light emitting element array chips to one long side of a sealing area which is parallel to and proximate to the first side is shorter than a second distance from a second side which is another one of the two long sides to another long side of the sealing area which is parallel to and proximate to the second side, and a third distance from the first side to one long side of a light emitting area which is parallel to and proximate to the first side is shorter than a fourth distance from the second side to another long side of the light emitting area which is parallel to and proximate to the second side.