A photoelectric conversion device according to an embodiment of the present disclosure includes a calculation unit configured to calculate an initial value of each of a plurality of first correction components based on a first pixel value read out from the first region, update each of the plurality of the first correction components based on a second pixel value read out from the second region and a predetermined second correction component, and calculate the correction value using the updated first correction component and the second correction component.

A method for processing a raw image characterized by raw measurements S.sub.p(i,j) that are associated with active bolometers B.sub.pix_(i,j) of an imager, which bolometers are arranged in a matrix array, the imager being at an ambient temperature T.sub.amb and furthermore comprising blind bolometers B.sub.b_(k), the method, which is executed by a computer that is provided with a memory, comprising the following steps: a) a step of calculating the electrical resistances R.sub.Tc(i,j) and R.sub.Tc(k), at the temperature T.sub.amb, of the active and blind bolometers, respectively, from their respective electrical resistances R.sub.Tr(i,j) and R.sub.Tr(k) at a reference temperature T.sub.r, said resistances being stored in the memory; b) a step of determining the temperatures T.sub.sc(i,j) actually measured by each of the active bolometers B.sub.pix_(i,j) from the electrical resistances calculated in step a) and from the raw measurements S.sub.p(i,j).

A sensor arrangement for light sensing for light-to-frequency conversion. The sensor arrangement includes a photodiode, an analog-to-digital converter (ADC) operable to perform a chopping technique in response to a first clock signal (CLK1), and convert a photocurrent (IPD) into a digital comparator output signal (LOUT). The ADC includes a sensor input coupled to the photodiode, an output for providing the digital comparator output signal (LOUT), an integrator including an integrator input coupled to the sensor input and operable to receive an integrator input signal, a first set of chopping switches coupled to a first amplifier, a second set of chopping switches electrically coupled to an output of the first amplifier and electrically coupled to input terminals of a second amplifier, and an integrator output providing an integrator output signal (OPOUT).

An image capturing apparatus comprises an image sensor including a plurality of photoelectric conversion portions for each of a plurality of microlenses, performs readout control using one of a first readout method of reading out a plurality of image signals from the plurality of photoelectric conversion portions corresponding to each of the microlenses, and a second readout method of reading out an added image signal from the plurality of photoelectric conversion portions corresponding to each of the microlenses, determines whether an image signal is read out using the first readout method or the second readout method, adds the plurality of image signals read out using the first readout method, and adjusts the added image signal obtained through the addition by an increased amount of the black level that has increased due to the addition as an adjustment value.

An image capturing apparatus includes an image sensor, an optical system that forms a subject image on an image sensing plane of the image sensor, a driving unit that curves the image sensor, and a control unit that controls the driving unit to curve the image sensor to a curvature according to aberration of the optical system and image capturing conditions.

An image sensor includes a pixel array unit including an active pixel area including active pixels, a first dark area including first dark pixels, and a second dark area including second dark pixels, an offset extractor configured to extract a final dark offset value, and a corrector configured to correct pixel data values of the active pixels based on the final dark offset value. The offset extractor extracts a per-column dark offset value, a global dark offset value, a per-row average, and a per-row noise value, selects one of the extracted per-column dark offset value and global dark offset value, and extracts the final dark offset value from the per-row noise value and either the per-column dark offset value or the global dark offset value.

The signal quality of a solid-state imaging element configured to detect address events is enhanced. The solid-state imaging element has open pixels and light-blocked pixels arrayed therein. In the solid-state imaging element, the open pixels each detect whether or not an amount of change in incident light amount exceeds a predetermined threshold, and output a detection signal indicating a result of the detection. On the other hand, in the solid-state imaging element, the light-blocked pixels each output a correction signal based on an amount of noise generated in the open pixels each configured to detect whether or not an amount of change in incident light amount exceeds the predetermined threshold and to output a detection signal indicating a result of the detection.

An image sensing device includes a first test block, a second test block, and a readout block. The first test block includes a plurality of first image sensing pixels structured to convert incident light carrying an image into a first pixel signal indicative of the image, and a first heating element structured to transmit heat to the first image sensing pixels. The second test block includes a plurality of second image sensing pixels that each include a light blocking structure to be shielded from receiving incident light to generate a second pixel signal without being directly exposed to the incident light, and a second heating element structured to transmit heat to the second image sensing pixels. The readout block processes the first pixel signal output from the first test block and the second pixel signal output from the second test block.

An image sensing device includes a first test block, a second test block, and a readout block. The first test block includes a plurality of first image sensing pixels structured to convert incident light carrying an image into a first pixel signal indicative of the image, and a first heating element structured to transmit heat to the first image sensing pixels. The second test block includes a plurality of second image sensing pixels that each include a light blocking structure to be shielded from receiving incident light to generate a second pixel signal without being directly exposed to the incident light, and a second heating element structured to transmit heat to the second image sensing pixels. The readout block processes the first pixel signal output from the first test block and the second pixel signal output from the second test block.

The signal quality of a solid-state imaging element configured to detect address events is enhanced. The solid-state imaging element has open pixels and light-blocked pixels arrayed therein. In the solid-state imaging element, the open pixels each detect whether or not an amount of change in incident light amount exceeds a predetermined threshold, and output a detection signal indicating a result of the detection. On the other hand, in the solid-state imaging element, the light-blocked pixels each output a correction signal based on an amount of noise generated in the open pixels each configured to detect whether or not an amount of change in incident light amount exceeds the predetermined threshold and to output a detection signal indicating a result of the detection.