Patent classifications
H04N25/767
IMAGE SENSOR
An image sensor for electronic cameras has a plurality of pixels for generating exposure-dependent signals, wherein a respective pixel at least comprises at least one light-sensitive element; a readout node; a transfer gate; a converter transistor; and a selection switch that is connected to a signal output of the converter transistor to selectively couple the signal output to a column line of the image sensor. The column line is coupled or can be coupled to a negative input of an associated column amplifier via an input capacitor, wherein an amplifier output of the column amplifier is connected to a column readout circuit and to a compensation line. The compensation line is coupled via a respective feedback capacitor to the respective readout node of the associated pixels.
IMAGE SENSOR
An image sensor for electronic cameras has a plurality of pixels for generating exposure-dependent signals, wherein a respective pixel at least comprises at least one light-sensitive element; a readout node; a transfer gate; a converter transistor; and a selection switch that is connected to a signal output of the converter transistor to selectively couple the signal output to a column line of the image sensor. The column line is coupled or can be coupled to a negative input of an associated column amplifier via an input capacitor, wherein an amplifier output of the column amplifier is connected to a column readout circuit and to a compensation line. The compensation line is coupled via a respective feedback capacitor to the respective readout node of the associated pixels.
Solid-state image pickup apparatus and image pickup system
An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.
Electronic apparatus, method for controlling electronic apparatus, and control program
To generate multiple types of images of the same subject, an electronic apparatus includes a drive control unit that controls the drive of an image sensor, a division unit that divides an image capture region of the image sensor into at least first and second regions, and an image generation unit that generates a first image by capturing an image of the same subject in the first region and generates a second image by capturing an image of the same subject in the second region.
SYSTEMS AND METHODS FOR DIGITAL IMAGING USING COMPUTATIONAL PIXEL IMAGERS WITH MULTIPLE IN-PIXEL COUNTERS
A stereo imaging system includes an optical assembly and a computational pixel imager (CPI) having a plurality of pixels. Each pixel includes a light sensor and counters that convert a photocurrent from the light sensor to a digital signal. The optical assembly, which directs light from a light field to the CPI, includes an optical field combiner and first and second primary lens assemblies, which are configured to receive first and second portions of the light from the light field, respectively, and to direct the first and second portions of the light to the optical field combiner. The optical field combiner includes a modulator configured to modulate the first and second portions of the light and to direct modulated first and second portions of the light onto the CPI. The counters are configured to perform digital signal processing on the digital signal.
SYSTEMS AND METHODS FOR DIGITAL IMAGING USING COMPUTATIONAL PIXEL IMAGERS WITH MULTIPLE IN-PIXEL COUNTERS
A stereo imaging system includes an optical assembly and a computational pixel imager (CPI) having a plurality of pixels. Each pixel includes a light sensor and counters that convert a photocurrent from the light sensor to a digital signal. The optical assembly, which directs light from a light field to the CPI, includes an optical field combiner and first and second primary lens assemblies, which are configured to receive first and second portions of the light from the light field, respectively, and to direct the first and second portions of the light to the optical field combiner. The optical field combiner includes a modulator configured to modulate the first and second portions of the light and to direct modulated first and second portions of the light onto the CPI. The counters are configured to perform digital signal processing on the digital signal.
VACUUM HEALTH DETECTION FOR IMAGING SYSTEMS AND METHODS
Techniques for facilitating vacuum health detection for imaging systems and methods are provided. In one example, an imaging device includes a detector configured to generate a first reference signal. The imaging device further includes a buffer circuit configured to store a value of the first reference signal. The imaging device further includes a processing circuit coupled to the buffer circuit. The processing circuit is configured to determine a first predetermined value based on a first temperature associated with the detector. The processing circuit is further configured to determine vacuum integrity associated with the detector based at least on the value of the first reference signal and the first predetermined value. Related methods and systems are also provided.
VACUUM HEALTH DETECTION FOR IMAGING SYSTEMS AND METHODS
Techniques for facilitating vacuum health detection for imaging systems and methods are provided. In one example, an imaging device includes a detector configured to generate a first reference signal. The imaging device further includes a buffer circuit configured to store a value of the first reference signal. The imaging device further includes a processing circuit coupled to the buffer circuit. The processing circuit is configured to determine a first predetermined value based on a first temperature associated with the detector. The processing circuit is further configured to determine vacuum integrity associated with the detector based at least on the value of the first reference signal and the first predetermined value. Related methods and systems are also provided.
Image sensors with reduced peak power
An image sensor may include a pixel array having pixels arranged in rows and columns, column readout circuitry, and control circuitry. Column readout circuitry may include corresponding readout circuits each coupled to a corresponding column path for a respective column of pixels. The readout circuits may each include signal processing circuits such as correlated double sampling circuitry and analog-to-digital converter circuitry. To reduce peak-to-average power ratio, during the signal processing operations for each pixel row, the control circuitry may control the signal processing circuits to perform time-domain multiplexing across the pixel columns to activate the signal processing circuits at varied times within the row time. If desired, the pattern of time-domain multiplexing may be varied across the signal processing operations for different pixel rows and/or for different image frames.
Methods and systems for active SWIR imaging using germanium receivers
Systems and methods for imaging in the short wave infrared (SWIR), photodetectors with low dark current and associated circuits for reducing dark currents and methods for generating image information based on data of a photodetector array. A SWIR imaging system may include a pulsed illumination source operative to emit radiation pulses in the SWIR band towards a target resulting in reflected radiation from the target; (b) an imaging receiver including a plurality of Ge PDs operative to detect the reflected SWIR radiation and a controller, operative to control activation of the receiver for an integration time during which the accumulated dark current noise does not exceed the time independent readout noise.