A device for time delay and integration imaging comprises: an array of pixels being arranged in rows and columns extending in a first and second direction, respectively. Pixels may accumulate generated charges in response to received electro-magnetic radiation along each column. The rows comprise at least one lateral charge shifting row to selectively shift accumulated charges in a column to an adjacent column and a controller configured to receive at least two angle correction input values. Each angle correction input value is based on a received intensity of electro-magnetic radiation on a measurement line, wherein the at least two angle correction input values are acquired by measurement lines extending in directions defining different angles in relation to the second direction, wherein the controller is configured to, based on the received at least two angle correction input values, control activation of the at least one lateral charge shifting row.

The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.

The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.

Provided are an X-ray inspection apparatus and an X-ray inspection method. The X-ray inspection apparatus includes: an X-ray source; a sample moving mechanism; the TDI sensor; and a TDI computing unit. The TDI computing unit includes a data transfer unit configured to transfer, to an outside, data of accumulated charges obtained by accumulating and transferring the charges, and has a function of setting in advance, as a determination region, a plurality of columns of line sensors with which the sample is detectable, and of detecting the sample in the determination region. The data transfer unit is configured to set, as detecting rows, rows of the pixels with which the sample has been detected in the determination region and rows around the rows, and transfer, to the outside, the data of accumulated charges only for pixels in the detecting rows.

Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

Disclosed is a linear array ultra-fast scanning x-ray imaging device. The linear array x-ray imaging device is single photon sensitive, operating in frame output mode and including a pixel array Application Specific Integrated Circuit including the readout pixel array. The ASIC includes digital control logic and sufficient memory to accumulate digital output frames in various modes of operation prior to output from the ASIC, permitting advanced imaging functionalities directly on the ASIC, while maintaining a dynamic range of 16 bits and single photon sensitivity. The effective or secondary frames output from the pixel array ASIC can be tagged with user provided external triggers synchronizing the effective frames to the x-ray beam energy and/or to the movement of the x-ray source or imaged object. This enables dual energy imaging and ultra-fast scanning, without complex and costly conventional photon counting x-ray imaging sensors. The system architecture is simpler and higher performance.

The application provides a cross-row time delay integral method, apparatus and camera. The method includes obtaining a first stage integral energy in an i-th target region from an i-th row of a first integral piece domain; transferring the first stage integral energy across rows to an i-th row of a second integral piece domain; obtaining the first stage integral energy and an second stage integral energy accumulated in the i-th target region from the i-th row of the second integral piece domain, after an integration period; outputting an image of the i-th target region containing the first stage integral energy and the second stage integral energy. The application performs cross-row integration through the energy obtained by imaging, the shooting of the target can be carried out in a higher-speed environment, the method can be implemented on the existing photoelectric device, and the method has excellent imaging quality and wide applicability.

A TDI scanner including a dynamically programmable focal plane array including a two-dimensional array of detectors arranged in a plurality of columns and a plurality of rows, the array being divided into a plurality of banks separated from one another by gap regions, each bank including a plurality of sub-banks, and each sub-bank including at least one row of detectors, a ROIC coupled to the focal plane array and configured to combine in a TDI process outputs from detectors in each column of detectors in each sub-bank, and a controller configured to program the focal plane array to selectively and dynamically set characteristics of the focal plane array, the characteristics including a size and a location within the two-dimensional array of each of the plurality of sub-banks and the gap regions, the size corresponding to a number of rows of detectors included in the respective sub-bank or gap region.

Provided are an X-ray inspection apparatus and an X-ray inspection method. The X-ray inspection apparatus includes: an X-ray source; a sample moving mechanism; the TDI sensor; and a TDI computing unit. The TDI computing unit includes a data transfer unit configured to transfer, to an outside, data of accumulated charges obtained by accumulating and transferring the charges, and has a function of setting in advance, as a determination region, a plurality of columns of line sensors with which the sample is detectable, and of detecting the sample in the determination region. The data transfer unit is configured to set, as detecting rows, rows of the pixels with which the sample has been detected in the determination region and rows around the rows, and transfer, to the outside, the data of accumulated charges only for pixels in the detecting rows.